What Hilpert Electronics does

Hilpert electronics AG, founded in 1972 and headquartered in Baden-Dättwil, Switzerland, is a specialized distributor and full-service provider of production equipment for the electronics, microelectronics, and micromechanics manufacturing industries. The company represents 12+ global OEMs including Rehm Thermal Systems (soldering), F&K Delvotec (wire bonding), SET (flip-chip), Techman (cobots), ASM, Viscom, Nutek, and Ormon Automation (inspection), offering a portfolio that spans the full electronics manufacturing value chain from paste printing, SPI/AOI/AXI inspection, and component placement through reflow and vapor phase soldering, contact soldering, wire bonding, flip-chip, conformal coating, drying/curing, cleaning, and MES software. The company also offers MEMS and lithography equipment, 3D printing, and inkjet printing for semiconductor manufacturing.

Hilpert generates revenue through a combination of capital equipment sales, consumables and materials, equipment rental (Hilpert Renting), and a full suite of professional services including consulting, installation and commissioning, technical customer support, training, and process analysis. The business model is enterprise field sales: direct consultation with customers, quotation-based pricing (not publicly disclosed), and a multi-channel marketing approach spanning a multilingual website (DE/FR/IT), trade shows and self-organized technology days, email newsletter, and social media. The customer base spans electronics manufacturers, semiconductor companies, micromechanics firms, research institutes, and universities across Switzerland — the company's sole operating geography.

The company has actively expanded its portfolio since 2021, most notably through a restructured commercial partnership with Rehm Thermal Systems (effective January 2022) covering conformal coating, drying/curing, and convection and vapor phase soldering, followed by a 2022 launch of the SET FC150 PLATINUM R&D flip-chip bonder. Hilpert has also built out a cobot-based automation line combining Techman collaborative robots with JBC soldering systems, supported by Swiss system integrator Autix AG. Ownership is independent and founder-managed, with Raphael B. Burkart as CEO; no parent company, private equity investment, or public listing has been disclosed.

Name

Hilpert Electronics

Legal name

Hilpert electronics AG

Website

https://hilpert.ch

Company type

Private

Founded year

1972

Operating status

Operating

Headcount range

11–50 employees

Short description

Hilpert electronics AG is a Swiss full-service distributor and service provider of production equipment for electronics, microelectronics, and micromechanics manufacturing, representing 12+ global OEMs and serving industrial, semiconductor, micromechanics, research, and academic customers exclusively in Switzerland.

Ownership category

akta.pro rank

Product category

Electronics Manufacturing Equipment

NAICS

Commercial and Service Industry Machinery Manufacturing (333310)

SIC

Wholesale-Industrial Machinery & Equipment (5084)

akta.pro primary industry

HVAC Equipment (Heating, Cooling & Air Handling) (IMAHAKAB)

akta.pro secondary industry

Soldering, Rework & Electronics Hand Tools Retail (CRACAKAG)

Keywords

• Electronics manufacturing equipment
• Soldering systems
• Wire bonding equipment
• Semiconductor production equipment
• Collaborative robot automation

Headquarters

HQ city

Baden

HQ country

Switzerland

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Operations, Marketing or Sales, Technology or R&D, Infrastructure

Revenue model

1. Equipment Sales: Hilpert sells production equipment for electronics, microelectronics and micromechanics manufacturing. This includes machines for SMT production, semiconductor manufacturing, testing and measurement equipment, accessories and materials, and demo/used machines.
2. Consulting and Technical Services: Technical consulting, process integration advice, and comprehensive support services for production equipment deployment and optimization.
3. Installation and Commissioning: Professional installation and commissioning services for production equipment.
4. Technical Customer Service: Ongoing technical support and maintenance services over the entire machine lifecycle.
5. Training Services: Training programs for equipment operation and process optimization.
6. Hilpert Renting: Equipment rental services allowing customers to rent production equipment.
7. Consumables and Materials: Sale of solder paste, solder wire, solder bars, flux, cleaning materials, bonding wire, accessories, and other consumables for electronics manufacturing.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels6 records

Core offering

Hilpert electronics AG is a Swiss specialized distributor and full-service provider of production equipment for electronics, microelectronics, and micromechanics manufacturing. The company represents globally leading OEMs including Rehm Thermal Systems (soldering), F&K Delvotec (wire bonders), SET (flip-chip bonders), Techman (cobots), JBC, ASM, Viscom, Nutek, Ormon Automation, Comet Yxlon, and AVIO, and complements equipment sales with consulting, installation, commissioning, technical customer service, training, equipment rental (Hilpert Renting), and reflow soldering process analysis.

Product overview

Hilpert Electronics is a Swiss full-service provider of production equipment and consultation services for electronics manufacturing, microelectronics, and micromechanics. The product portfolio is organized into five main categories: Electronics Manufacturing (covering paste printing, SPI/AOI/AXI inspection, PCB assembly, reflow and vapor phase soldering, contact soldering, welding, conformal coating, test solutions, drying/curing, cleaning, storage, dry cabinets, handling/automation, component management, prototype PCB manufacturing, 3D printing, software solutions, and MES), MEMS & Lithography (including semiconductor manufacturing equipment for coating, developing, mask alignment, inkjet printing, UV scanning, temporary and permanent bonding, bake & develop, photomask cleaning, plasma treatment, wafer handling, and data preparation software), Measurement & Testing (optical inspection, incoming goods inspection, X-ray technology, probe systems, wire bond testing, and solder profile monitoring), Accessories & Materials (printer accessories, bonding wire, cleaning materials, soldering aids, wire bonding tools, dummy components, adhesives, ESD products, and technical sprays), and Demo/Used Machines. Major product lines include Rehm soldering systems (Vision series for reflow, Condenso series for vapor phase, Nexus for vacuum contact, RDS UV for drying), F&K Delvotec wire bonders, SET flip-chip bonders, Techman collaborative robots, ASM, Viscom, Nutek, Ormon Automation inspection systems, and Comet Yxlon X-ray systems. Services include consultation, installation & commissioning, technical support, training, Hilpert Renting, and reflow soldering process analysis.

Differentiator

Problem solved

Functional benefit

Products and services

• Rehm Vision TripleX 3-in-1 soldering system combining convection reflow soldering (with and without vacuum) and vapor phase soldering using Galden. Features a patented injection principle for reproducible soldering profiles and precise temperature control. Designed for electronics manufacturers needing flexible soldering process options in a single system.
• Rehm VisionXP+ Energy-efficient reflow convection soldering system with EC motors, under-vacuum capability, and bottom-side cooling for heavy boards. Designed for electronics manufacturing SMT production lines.
• Rehm VisionXS Compact reflow convection soldering system with flexible transport configuration, cold condensation cleaning, and Power Cooling Unit for multi-stage cooling.
• Rehm VisionXC Compact reflow soldering system designed for small and medium batch production, laboratories, or demo lines with small footprint and closed-loop principle.
• Rehm Nexus Vacuum Contact Soldering Vacuum contact soldering system for power electronics and advanced packaging, operating up to 400°C. Designed for flux-free soldering of pastes and preforms with vacuum for void-free joints.
• Rehm Condenso XC Compact vapor phase soldering system for laboratory, small series production, or prototyping, with a footprint of 2.3 m², patented injection principle, and optional vacuum.
• Rehm CondensoXS smart Vapor phase soldering system with new chamber design featuring vertical opening/closing for optimal hermetic sealing. Supports manual and automatic loading for assemblies up to 650 x 650 mm.
• Rehm CondensoXM smart Inline-capable vapor phase soldering system for automated processes. Can be integrated as island solution or in production line with manual or automated loading.
• Rehm Condenso smartline Fully automated inline vapor phase soldering system with integrated carrier return transport. Features traceability and MES connection for complete production documentation.
• Rehm CondensoX-Line High-end vapor phase soldering system with 3-chamber design for void-free soldering in inert atmosphere (under 100 ppm O2). Designed for power electronics serial production with horizontal transport.
• F&K M17S Wire Bonder Compact, fully automatic wire bonder with the smallest footprint on the market. Convertible to all common wire bonding processes in under 15 minutes using the quick-change bonding head principle, providing high flexibility for R&D applications.
• F&K M17D Wire Bonder First wire bonder worldwide with two welding heads on a single chassis. Enables combination of heavy and fine wire bonding in the same production run. Handles wire diameters 17-600 μm and ribbons up to 2000 x 300 μm.
• F&K M17L Wire Bonder Fully automatic wire bonder with the largest work area for standard applications. Features flexible passage height up to 500 mm and combination of manual and automatic component handling.
• F&K M17XL Wire Bonder Wire bonder with the world's largest work area, designed for large-scale applications such as solar sensors and electromobility batteries.
• F&K Delvotec Laser Ultrasonic Bonder Laser ultrasonic bonding equipment combining ultrasonic and laser welding for power modules and battery assembly. Welds aluminum, copper, or nickel ribbons with low bonding force.
• SET FC150 PLATINUM Flip-Chip Bonder Advanced R&D flip-chip bonder with alignment accuracy of ±0.1 μm and parallelism adjustment in microradians. Supports chip-to-chip (up to 100mm) and chip-to-wafer (up to 200mm) applications with force range 0.25-2000 N. Targets telecommunications, automotive, defense, HPC, AI, and VR industries.
• Techman Cobots (TM Robots) Collaborative robots distributed in Switzerland, available in four models with different arm reach options. Includes accessories such as Cobotracks linear motion system, Liftkit for extended vertical reach, and Nabells Robot Flex protective cover.
• Cobot Soldering Solutions (Techman + JBC) Fully automatic soldering solution using Techman cobots with JBC soldering systems for electronics manufacturing. Includes automatic tip changer and various tip geometries for selective THT soldering.
• TM Palletizing Operator Fully equipped cobot cell for automatic carton palletizing. Features vision system, vacuum grippers, software, and safety sensors. Lifts up to 10 kg with palletizing height up to 1.90m and speed up to 7 boxes per minute.
• AVIO Welding Technology Welding solutions for demanding applications in battery manufacturing, electronics, and semiconductor industries.
• Ormon Automation Inspection (AOI/SPI/AXI) Optical inspection solutions for electronics manufacturing including Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Automated X-ray Inspection (AXI) for quality control.
• Comet Yxlon X-ray Inspection X-ray inspection systems for non-destructive testing and quality control in electronics manufacturing applications.
• Rehm RDS UV Curing System Compact dryer for UV curing of UV lacquers and adhesives. Cures in seconds using UV lamps with mercury medium-pressure emitters or UV-LED emitters.
• PiXDRO LP50 Inkjet Printing System Industrial inkjet printing system for electronics and semiconductor manufacturing applications.
• Hilpert Renting Equipment Rental Equipment rental service allowing customers to rent production equipment from Hilpert's portfolio for short-term use, evaluation, or capacity bridging.
• Technical Consulting and Process Integration Technical consulting and process integration services for production equipment deployment and optimization, including advice on equipment selection, process engineering, and line integration.
• Installation and Commissioning Professional installation and commissioning services for production equipment sold by Hilpert.
• Technical Customer Service and Maintenance Ongoing technical support and maintenance services over the entire machine lifecycle, including repair, preventive maintenance, and spare parts.
• Training Services Training programs for equipment operation, programming, and process optimization, delivered to customer operators and engineers.
• Reflow Soldering Process Analysis Analysis of reflow and vapor phase soldering processes for process optimization, including profile measurement and parameter recommendations.
• Consumables and Materials Sale of solder paste, solder wire, solder bars, flux, cleaning materials, bonding wire, accessories, dummy components, adhesives, ESD products, technical sprays, and other consumables for electronics manufacturing.

Quantifiable outcome

• Over 100 professionals attended the 2026 Assembly Technology Day event, with over 50 companies participating for knowledge exchange and technology evaluation

Named customers1 record

Segments4 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

16 partnerships are on record, tiered core and minor.

• Rehm Thermal Systems GmbHcoreChannel Partner/ Reseller/ Distributor · 1 January 2022Hilpert became the commercial partner for Rehm in Switzerland starting January 1, 2022. The partnership covers production equipment for the electronics industry including conformal coating systems, drying and curing equipment, and complete range of convection and vapor phase soldering systems. This was a significant restructuring of Hilpert's product portfolio.
• Techman Cobot (TM Robots)coreChannel Partner/ Reseller/ DistributorHilpert distributes Techman collaborative robots in Switzerland. The partnership enables fully automatic soldering solutions using cobots with integrated automatic tip changers, as well as palletizing applications and various automation solutions for electronics manufacturing.
• F&K DelvoteccoreChannel Partner/ Reseller/ DistributorHilpert distributes F&K Delvotec wire bonders and ultrasonic bonding equipment. Products include the F&K M17S, M17D, M17L, and M17XL wire bonder models for semiconductor packaging applications.
• JBCcoreChannel Partner/ Reseller/ DistributorHilpert uses JBC soldering systems integrated with Techman cobots for fully automatic soldering solutions in electronics manufacturing applications.
• Ormon AutomationcoreChannel Partner/ Reseller/ DistributorHilpert distributes Ormon Automation AOI, SPI, and AXI inspection equipment for quality control in electronics manufacturing.
• Autix AGcoreImplementation/ SI/ Consulting PartnerSwiss system integrator partner specializing in automation solutions. Collaboration focuses on integrating collaborative robots into production lines with emphasis on safety compliance and specific requirements for cobot applications in industrial settings.
• staedler automation SAminorImplementation/ SI/ Consulting PartnerSwiss system integrator that supports customers in implementing cobot-based soldering solutions. Provides customer integration services alongside Hilpert's equipment offerings.
• F&S BondteccoreChannel Partner/ Reseller/ DistributorHilpert distributes F&S Bondtec wire bonding equipment including the Series 53 and 56 wire bonders for semiconductor manufacturing applications.
• ASMcoreChannel Partner/ Reseller/ DistributorASM is mentioned as part of Hilpert's existing product and brand portfolio, representing leading manufacturers in the electronics manufacturing equipment sector.
• ViscomcoreChannel Partner/ Reseller/ DistributorViscom is mentioned as part of Hilpert's existing product and brand portfolio, representing leading manufacturers in the electronics manufacturing equipment sector.
• NutekcoreChannel Partner/ Reseller/ DistributorNutek is mentioned as part of Hilpert's existing product and brand portfolio, representing leading manufacturers in the electronics manufacturing equipment sector.
• MOT Mikro- und Oberflächentechnik GmbHminorStrategic or Co-development PartnerPartnership with MOT for micro and surface technology solutions in semiconductor manufacturing applications.
• Systronic Produktionstechnologie GmbH & Co. KGminorStrategic or Co-development PartnerCooperation agreement for production technology solutions in electronics manufacturing.
• AVIOcoreChannel Partner/ Reseller/ DistributorAVIO is a partner for welding technology solutions. Hilpert will present AVIO technologies at The Battery Show Europe 2026 for battery manufacturing, electronics, and semiconductor applications.
• Comet YxloncoreChannel Partner/ Reseller/ DistributorPartnership for X-ray inspection technology solutions. Comet Yxlon X-ray systems are distributed by Hilpert for non-destructive testing and inspection applications.
• SET (Société Européenne de Thermalisme)coreChannel Partner/ Reseller/ DistributorHilpert distributes SET flip-chip bonders including the FC150 PLATINUM for R&D applications in telecommunications, automotive, defense, HPC, AI, and VR industries.

Scale indicators3 records

Recent moves6 records

Expansion highlights4 records

Direct peers

• SEHO Systems GmbH: German manufacturer of reflow and vapor phase soldering equipment for electronics manufacturing. Direct product overlap with Hilpert's soldering equipment portfolio; serves the same European electronics-manufacturer customers from a similar mid-sized industrial base.
• Kurtz Ersa GmbH: German manufacturer of reflow, wave, and selective soldering systems plus soldering tools. Direct product overlap with Hilpert's Rehm soldering distribution portfolio; both target electronics manufacturers in Switzerland, Germany, and broader Europe.

Broad incumbents

• Mycronic AB: Swedish manufacturer of SMT pick-and-place equipment, flexible PCB production solutions, and advanced packaging tools. Global player serving electronics manufacturers and overlapping directly with Hilpert's customer segments.
• HELLER Industries: US-based manufacturer of reflow and curing ovens for SMT assembly. Direct product overlap with Hilpert's soldering equipment portfolio and a long-established incumbent in the same industrial thermal equipment category.
• Viscom AG: German manufacturer of AOI and X-ray inspection equipment for electronics manufacturing. Hilpert distributes Viscom products in Switzerland; both target the same electronics-manufacturer inspection use cases.
• Koh Young Technology: Korean market leader in AOI/SPI inspection equipment for SMT manufacturing. Same target customers (electronics manufacturers) as Hilpert and overlapping equipment categories (SPI/AOI/AXI).
• ASM Assembly Systems (ASMPT): Global leader in SMT equipment manufacturing (DEK printers, SIPLACE placement, SmartFactory). Large-scale incumbent serving the same electronics manufacturer customer base; Hilpert is one of ASM's Swiss distribution partners.
• ITW EAE: Global electronics assembly equipment manufacturer spanning Vitronics Soltec reflow ovens and Speedline Technologies. Serves the same electronics-manufacturer customers as Hilpert with broader geographic and product scale.
• Saki Corporation: Japanese AOI inspection equipment manufacturer serving SMT and electronics manufacturers globally. Same target customers and product category (automated optical inspection) as Hilpert's inspection equipment portfolio.

Others

• Rehm Thermal Systems GmbH: German manufacturer of thermal processing systems including reflow, vapor phase, and contact soldering. Hilpert is Rehm's exclusive Swiss distribution partner and primary route-to-market in Switzerland; better characterized as a key supplier than a peer competitor.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• Xx.com/hilperttweet
• Facebookfacebook.com/Hilpert.electronics.AG
• LinkedInlinkedin.com/company/hilpert-electronics

Revenue estimate

Valuation estimate

Number of profiles

Profiles9 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hilpert Electronics