ASM AMICRA Microtechnologies

What ASM AMICRA Microtechnologies does

ASMPT AMICRA GmbH, headquartered in Regensburg, Germany, and founded in 2001, manufactures ultra high-precision Die Attach Equipment with a claimed submicron placement accuracy of ±0.2µm at 3 sigma. The company was acquired by and rebranded under Hong Kong-listed ASMPT Group (HKEX: 0522), operating today as ASMPT AMICRA within the parent's semiconductor solutions segment. Its portfolio centers on four product families — the CoS Die Bonder for high-precision chip-on-substrate bonding, the NOVA Pro and NANO die/flip chip bonders, and a High Speed & Precision Dispensing System — supporting die attach, flip chip bonding, and precision dispense applications.

The company sells into photonics, silicon photonics, active optical cables (AOC), VCSELs, laser diodes, wafer-level packaging, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, and automotive sensor/LiDAR manufacturers. In 2021 it became the first equipment vendor to integrate X-Celeprint's Micro-Transfer Printing (MTP) technology for heterogeneous integration of ultra-thin chips, and in 2024 it highlighted a Co-Packaged Optics (CPO) solution at OFC 2024, extending its reach into CPO. It also developed Panel-Level Heterogeneous Integration Technology for Analog ICs.

ASMPT AMICRA runs an enterprise field-sales motion delivered by a worldwide team of experienced engineers, supplemented by presence at major trade shows (ECOC, SEMICON Europe, OFC) and digital/owned channels (LinkedIn, Facebook, YouTube, news releases). Revenue is generated through direct, quote-based sales of custom-engineered capital equipment and related service; pricing is not publicly disclosed. The company holds the Top 100 Seal 2022 for innovation among German SMEs and is led by a small management team including Horst Lapsien and Dr. Johann Weinhändler.

Name

ASM AMICRA Microtechnologies

Legal name

ASMPT AMICRA GmbH

Website

https://amicra.com

Company type

Private

Founded year

2001

Operating status

Operating

Headcount range

101–250 employees

Short description

ASMPT AMICRA GmbH, a Regensburg-based subsidiary of ASMPT Group, manufactures ultra high-precision die attach and flip chip bonding equipment (±0.2µm@3s) for photonics, advanced semiconductor packaging, and automotive sensor manufacturers.

Ownership category

akta.pro rank

Product category

Semiconductor Assembly Equipment

NAICS

Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (3345)

SIC

Industrial Instruments For Measurement, Display, And Control (3823)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• Precision die attach equipment
• Flip chip bonding systems
• Semiconductor packaging machinery
• Photonics assembly equipment
• High-speed dispense systems

Headquarters

HQ city

Regensburg

HQ country

Germany

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Precision Equipment Sales: Direct sales of ultra high-precision Die Attach Equipment including die bonders, flip chip bonders, and high-speed dispense systems. Revenue is generated through equipment sales with potential installation, training, and after-sales service components for enterprise customers in semiconductor and photonics industries.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels7 records

Core offering

ASMPT AMICRA GmbH designs, manufactures, and sells ultra high precision Die Attach Equipment offering submicron placement accuracy (±0.2µm@3s). Its product portfolio spans die bonders (CoS Die Bonder, NOVA Pro, NANO), flip chip bonders, and a High Speed & Precision Dispensing System, used by photonics, silicon photonics, optoelectronics, advanced semiconductor packaging, and automotive sensor manufacturers. Equipment is custom-engineered and sold directly via enterprise field sales supported by technical consultation.

Product overview

ASMPT AMICRA GmbH offers a portfolio of ultra high precision Die Attach Equipment specializing in submicron placement accuracy (±0.2µm@3s). The product portfolio centers on four core offerings: CoS Die Bonder for high-precision chip-on-substrate bonding, NOVA Pro and NANO as die bonder and flip chip bonder systems, and a High Speed & Precision Dispensing System for material deposition. Together, these products address die attach, flip chip bonding, and dispense system requirements across photonics, semiconductor, and advanced packaging applications including SiPhotonics/PIC, 3D IC, TSV, TCB, Fan-out, and automotive sensor/LiDAR markets.

Differentiator

Problem solved

Functional benefit

Products and services

• CoS Die Bonder High-precision chip-on-substrate bonding system designed for ultra-precise die attach applications requiring exceptional submicron placement accuracy. Targeted at photonics, silicon photonics, and advanced semiconductor packaging manufacturers.
• NOVA Pro Die bonder and flip chip bonder combining high precision placement with versatility for various bonding applications including 2.5D/3D IC, TSV, and TCB processes. Aimed at advanced semiconductor packaging manufacturers.
• NANO Compact die bonder and flip chip bonder designed for precision die attach in advanced packaging applications. Targeted at high-accuracy photonics and semiconductor packaging environments where a smaller form factor is preferred.
• High Speed & Precision Dispensing System High-speed dispense system providing precision material deposition for die attach and other semiconductor manufacturing processes. Used by photonics and semiconductor manufacturers requiring both speed and precision in material application.

Segments5 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

One partnership is on record.

• X-CeleprintcoreTechnology or Integration · 26 April 2021ASMPT AMICRA unveiled the industry's first manufacturing systems incorporating X-Celeprint's Micro-Transfer Printing (MTP) technology for high-volume heterogeneous integration of ultra-thin chips. This partnership enables advanced packaging capabilities combining precision die bonding with micro-transfer printing technology.

Scale indicators3 records

Recent moves5 records

Expansion highlights6 records

Direct peers

• Hanmi Semiconductor: Hanmi Semiconductor is a Korean maker of advanced packaging equipment including TCB (thermal compression) bonders and singulation tools, directly competing with AMICRA in advanced semiconductor packaging equipment.
• Palomar Technologies: Palomar Technologies produces precision die bonders and packaging equipment for photonics, RF, and microelectronics assembly — overlapping with AMICRA in high-precision optoelectronic and semiconductor packaging equipment.
• Toray Engineering Co., Ltd. Toray Engineering supplies precision die bonders and flip-chip bonders for semiconductor and optoelectronic packaging, competing directly with AMICRA in high-precision die placement equipment.
• Finetech GmbH & Co. KG: Finetech manufactures precision die bonders and flip-chip bonders for R&D and production, with overlapping product positioning to AMICRA in sub-micron placement accuracy and optoelectronic/photonic packaging.
• BE Semiconductor Industries N.V. (BESI): BESI is a direct competitor in advanced packaging and die attach equipment, offering die bonders, flip-chip bonders, and hybrid bonding tools serving the same semiconductor and photonics end customers as AMICRA.
• MRSI Systems (Mycronic AB): MRSI, part of Mycronic, manufactures precision die bonders and flip-chip bonders for photonics, datacom, and advanced semiconductor packaging — competing head-to-head with AMICRA in sub-micron placement accuracy equipment.

Emerging players

• SET Corporation (Smart Equipment Technology): SET Corporation (France) supplies high-accuracy die bonders and flip-chip bonders with sub-micron placement for advanced packaging, hybrid bonding, and photonics — directly comparable niche specialist competing with AMICRA in the high-precision equipment segment.

Broad incumbents

• Kulicke & Soffa Industries: K&S is a broad incumbent in semiconductor and LED assembly equipment with significant exposure to die bonding, wire bonding, and advanced packaging — overlapping directly with AMICRA's core equipment categories and serving similar photonics and semiconductor customers.
• SÜSS MicroTec SE: SÜSS MicroTec supplies lithography, coating, and advanced packaging equipment (including bonding solutions) serving semiconductor and MEMS manufacturers — an incumbent adjacent to AMICRA in advanced packaging equipment.
• ASMPT (parent): ASMPT is AMICRA's parent and a leading global semiconductor assembly equipment supplier; while AMICRA operates within the ASMPT platform, ASMPT's broader portfolio (wire bonders, advanced packaging lines) defines the competitive context in which AMICRA's specialized tools are sold.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/channel/UCPSs3EFBySHKdF7J_p538sg
• Facebookfacebook.com/Amicra-Microtechnologies-1173400652755191
• LinkedInlinkedin.com/company/amicra-microtechnologies

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about ASM AMICRA Microtechnologies