Hybrid

What Hybrid does

Hybrid SA is a Swiss microelectronics assembly specialist operating in the micro-EMS (μ-EMS) segment, founded in 1989 in Chez-le-Bart, Canton of Neuchâtel. The company delivers nine integrated assembly services spanning die bonding, wire bonding, flip-chip, SMT, glob top, gold bumping, screen printing, product finishing, and electrical test, with annual production capacity of approximately 1 million circuits. Hybrid serves mission-critical end-markets including aerospace, medical and pharmaceutical, industrial sensors, security, watchmaking, and academic research, with documented deployments in Mars missions and CERN instrumentation. The company maintains ISO 9001:2015 and ISO 13485:2016 certifications, enabling qualification for regulated-customer pipelines.

The business model is a B2B, project-based micro-EMS engagement model: Hybrid works directly with customer engineering teams from prototype through serial production up to 100,000+ units per year, with pricing delivered via custom quote rather than published rate cards. The company employs roughly 41-60 staff with an average tenure of 11 years, of which 61% are local hires concentrated in the Canton of Neuchâtel, indicating a stable, high-skill operator base. The company is privately held following a second management buyout in June 2021 and does not disclose financial results.

Commercially, Hybrid pursues a multi-vertical diversification strategy across European geographies, with recent ecosystem and visibility moves including joining AESEMI (Spanish Semiconductor Industry Association) in September 2025, BFM Business TV exposure in July 2024, and active participation in European microelectronics events such as MiNaPAD, Medi'Nov, EMPC, and Paris Space Week. The combined signal is that of a consolidated, niche Swiss micro-EMS firm pursuing organic European expansion through association memberships, trade presence, and high-credibility customer references rather than acquisitive growth.

Name

Hybrid

Legal name

Hybrid SA

Website

https://hybrid.swiss

Company type

Private

Founded year

1989

Operating status

Operating

Headcount range

51–100 employees

Short description

Hybrid SA is a Swiss microelectronics assembly specialist (μ-EMS) providing die bonding, wire bonding, flip-chip, SMT, and thick-film hybrid circuit services for aerospace, medical, watchmaking, sensor, and security customers from prototype to mid-volume production.

Ownership category

akta.pro rank

Product category

Electronic Manufacturing Services (Microelectronics Assembly)

NAICS

All Other Industrial Machinery Manufacturing (333248), Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing (334511)

SIC

Industrial Instruments For Measurement, Display, And Control (3823), Special Industry Machinery, Nec (3559)

akta.pro primary industry

System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI)

Keywords

• Microelectronics assembly
• Electronic manufacturing services
• Wire bonding services
• Semiconductor packaging
• Die bonding services

Headquarters

HQ city

Chez-le-bart

HQ country

Switzerland

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Electronic Manufacturing Services (EMS): Hybrid SA generates revenue through providing microelectronic assembly and packaging services on a project basis. Services range from prototyping through large-scale production exceeding 100,000 units per year. The company offers end-to-end control of the production process, serving clients across multiple industry verticals including watch industry, sensors, industrial, medical/pharma, aerospace, security, and academia. Revenue is generated through service fees for assembly, testing, and related engineering services, typically structured as project-based or long-term manufacturing contracts.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

Hybrid SA is a Swiss microelectronics assembly specialist (μ-EMS) that provides precision electronic component assembly and packaging services for high-reliability applications. The company offers nine core capabilities — die bonding, wire bonding, SMT, flip-chip, gold bumping, glob top, screen printing, product finishing, and electrical testing — delivered from prototype through large-scale production exceeding 100,000 units per year. Services are tailored to sectors including watch, sensors, medical/pharma, aerospace, security, industrial, and academia.

Product overview

Hybrid SA offers a comprehensive portfolio of microelectronics assembly services spanning nine core capabilities: Die Bonding, Glob Top, SMT (Surface Mount Technology), Wire Bonding, Flip-Chip, Gold Bumping, Screen Printing (Thick Film Hybrid Circuits), Product Finishing, and Electrical Testing. These services are delivered from prototype through high-volume production (exceeding 100,000 units per year) for industries including watch, sensors, medical/pharma, aerospace, security, industrial, and academic research. The company specializes in precision assembly of electronic components with capabilities for ultra-miniature components (down to 01005 size), advanced packaging technologies (flip-chip, chip-on-board), and complex hybrid circuits. All services are supported by ISO 9001:2015 and ISO 13485:2016 certifications.

Differentiator

Problem solved

Functional benefit

Products and services

• Die Bonding Chip bonding service that places semiconductor chips of different sizes and thicknesses (chip side 0.2–10mm, thickness 50µm) onto various substrate types with high positioning accuracy (standard ±30µm, specific ±15µm). Supports conductive, non-conductive adhesives and silicone, with wafer mapping for full traceability. Wafer sizes up to 8 inches, waffle pack 2–4 inches, and gelpack packaging. Serves clients across watch, sensors, medical, aerospace, and industrial sectors needing precision chip placement.
• Wire Bonding Precision wire bonding service for bare chips using gold wire (ball bonding, standard 20–30µm) and aluminum wire (wedge bonding, standard 18–33µm). Handles minimum chip pad size of 50×50µm, supporting high bond counts with complex and high-density bonding plans. Used by clients in aerospace, medical, sensor, and industrial applications requiring high-reliability interconnections.
• SMT (Surface Mount Technology) Assembly Surface mounting of electronic components on single or double-sided substrates. Capable of placing extremely small components down to 01005 size at a production capacity of up to 12,000 components per hour with positioning accuracy of ±50µm. Handles standard boxes, IC, PLCC, QFN, BGA, CSP, and Flip-Chip solder bump components on ceramic, rigid, flex, rigid-flex, IMS, and Pyrex substrates. Compliant with IPC/JEDEC J-STD-020D and IPC-A-610 Class 3 standards.
• Flip-Chip Assembly Advanced flip-chip assembly of electronic modules using two technologies: ICA (Isotropically Conductive Adhesive with Underfill) and NCP (Non-Conductive Paste). Enables higher I/O density and enhanced reliability through direct chip-to-substrate connections. Cost-effective for high-volume production. Serves clients needing high-performance, high-density semiconductor packaging for mission-critical applications.
• Glob Top Encapsulation Protection of microelectronic modules via epoxy glob top, UV glob top, silicone, underfill, and filling mass. Supports substrates including thick-film ceramic, FR4, FR5, G10, G11, Rogers, flex, rigid-flex, IMS, and Pyrex. Available in transparent, opaque, and black colors. Performed via automatic and manual processes to protect assemblies in demanding environments.
• Gold Bumping Gold stud bump placement on semiconductor chip bond pads with diameters of 60–120µm and heights of 45–60µm. Production cadence up to 35 bumps per second. Bump types include Standard Bump, Accu Bump, and Stacked Bump. Supports bumping on wafer up to 12 inches, blue foil, sawn wafer, and single chip. Used for advanced flip-chip and high-density interconnect applications.
• Screen Printing (Thick Film Hybrid Circuits) Design and development of complex thick-film hybrid circuits including multilayer, double-sided, and high-density configurations. Substrates: alumina (Al2O3) and aluminum nitride (AlN). Line & space 80µm/80µm. Resistor range 0.1Ω to 100MΩ. Conductive layers: Ag, AgPt, AgPd. RoHS compliant. Laser trimming with resistor tolerance ±1% standard, down to 0.1%. Active and passive trimming, with date code marking options.
• Product Finishing Assembly-finishing operations including cables, springs, and contacts battery soldering (lead-free, RoHS compliant), DIL and SIL inserting with bath soldering (lead-free, RoHS), and hot bar welding. Performed on manual or semi-automatic equipment. Completes the microelectronic assembly workflow prior to testing.
• Electrical Testing Module electrical function testing performed according to customer specifications on automated equipment during production and final phases. Both automatic and manual test options are available. Ensures functional compliance and quality of assembled microelectronic modules before delivery.

Quantifiable outcome

• 1 million circuits produced per year
• +3 more outcomes

Segments7 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature9 records

Partnerships

One partnership is on record.

• AESEMI (Asociación Española de la Industria de Semiconductores)coreStrategic or Co-development Partner · 1 September 2025Hybrid SA officially joined AESEMI (Spanish Semiconductor Industry Association) in September 2025 as a new collaborator. With over 30 years of experience and a team of 40 professionals, Hybrid SA brings its know-how in high-precision processes such as flip chip, chip on board, wire bonding, solder flip chip, and 3D stacking technologies, positioning itself as a key partner for mission-critical projects in space, medical, defense, IoT, and advanced sensors sectors. Membership reinforces Hybrid SA's commitment to the development of the European and Iberian technological ecosystem, favoring industrial collaboration, knowledge transfer, and strengthening the microelectronics value chain. Dominique Valantin, Managing Director of Hybrid SA, noted that joining AESEMI reflects the company's willingness to integrate further into the European industrial fabric and contribute capabilities to joint initiatives driving competitiveness and innovation in Spain and Europe.

Scale indicators5 records

Recent moves5 records

Expansion highlights5 records

Broad incumbents

• Jabil: Global tier-1 EMS provider with significant healthcare and industrial divisions. Represents the broad incumbent Hybrid competes against when customers consolidate to full-service manufacturing partners.
• ASE Technology Holding: World's largest OSAT provider with comprehensive assembly and test services. Provides the upper-bound benchmark for what scaled semiconductor packaging looks like and the competitive ceiling Hybrid faces.
• Amkor Technology: Global OSAT leader offering advanced packaging including flip-chip, wafer-level, and SiP. Overlaps Hybrid in semiconductor packaging services but at vastly larger scale and broader technology footprint.
• Powertech Technology: Large Taiwanese OSAT serving memory and logic packaging needs. Competes with Hybrid indirectly for semiconductor assembly work, especially in Asia-based supply chains.
• Flex: Large diversified EMS serving medical, automotive, and industrial OEMs. Relevant as the broad incumbent against which Hybrid positions on agility, microelectronics specialization, and European proximity.

Direct peers

• Sencio: Netherlands-based specialist in microelectronics packaging services including die bonding, flip-chip, and encapsulation. Directly comparable to Hybrid in process portfolio and target verticals (medical, sensors, industrial).
• Hana Microelectronics: Asian-headquartered microelectronics assembly services provider serving high-reliability end markets including medical, industrial, and consumer. Comparable as a multi-site specialty EMS with overlapping process capabilities.
• Cicor Technologies: Swiss-headquartered microelectronics EMS provider offering assembly, packaging, and PCB production for aerospace, medical, and industrial customers. Closest geographic and capability analog to Hybrid SA's specialty high-reliability assembly model.

Others

• Besi: Leading supplier of die-bonding and flip-chip assembly equipment. Provides the upstream capital equipment ecosystem reference for the process technologies that constitute Hybrid's core service portfolio.
• ASMPT: Global semiconductor and SMT assembly equipment manufacturer. Relevant as an ecosystem peer whose tooling roadmap (die bonding, packaging) defines the technology envelope in which Hybrid's services operate.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/hybrid-sa
• Facebookfacebook.com/profile.php

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hybrid