What Sencio does

Sencio is a private, for-profit company headquartered in Nijmegen, Netherlands, that was founded in 2011. The company positions itself as a solutions and service provider focused on functional packaging for the semiconductor industry, addressing customers that require specialized packaging capabilities within the semiconductor value chain. Its stated scope is functional packaging rather than front-end wafer fabrication, suggesting a position in back-end or assembly-adjacent services where semiconductor devices are encapsulated or integrated into higher-level packages for downstream use.

Operating with a workforce of 11-50 employees, Sencio is a small specialist firm working in a niche technical segment of the broader semiconductor supply chain. The company maintains a corporate website at sencio.nl as its primary digital presence and operates as a B2B service provider rather than a product vendor of mass-market goods. Beyond the firmographic profile, no additional product specifications, customer disclosures, leadership information, partnership data, pricing structure, or financial metrics specific to Sencio were available in the source material.

The bulk of the aggregated data in this record pertains to a different entity (Neways, an EMS provider) and is not attributed to Sencio here. The investment-relevant picture for Sencio specifically is therefore narrow: a Netherlands-rooted, 13-year-old, small-headcount B2B specialist in semiconductor functional packaging. The lack of disclosed revenue, customer logos, funding history, product portfolio specifics, or certification footprint in the source material means that any assessment of scale, competitive position, or growth trajectory for Sencio rests on a thin evidence base and warrants additional primary-source diligence.

Name

Sencio

Website

https://sencio.nl

Company type

Private

Founded year

2011

Operating status

Operating

Headcount range

11–50 employees

Short description

Sencio is a Netherlands-based (Nijmegen) private company founded in 2011 that provides solutions and services for functional packaging in the semiconductor industry, operating with 11-50 employees in a B2B specialist model.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Services

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• Semiconductor packaging
• Functional packaging solutions
• Semiconductor industry services
• Packaging solutions provider
• Semiconductor equipment supplies

Headquarters

HQ city

Nijmegen

HQ country

Netherlands

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Operations, Personnel, Supply Chain, Technology or R&D

Revenue model

1. Electronics Manufacturing Services: Neways generates revenue through development and production of highly complex electronics, serving mission-critical applications in semicon, defense & mobility, and connectivity markets. Revenue is derived from design services and manufacturing of Complex PCBAs, high-level assemblies, cable assemblies, and microelectronics packaging.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels1 record

Core offering

Sencio is a solutions and service provider specializing in functional packaging for the semiconductor industry. The company delivers qualified packaging solutions tailored to the requirements of semiconductor manufacturers and equipment makers. Operating from Nijmegen in the Netherlands, Sencio serves a focused B2B customer base within the global semiconductor value chain.

Product overview

Neways operates as a technology partner offering a comprehensive portfolio of electronics manufacturing services and solutions. The portfolio includes five core product groups: Complex PCBAs (printed circuit board assemblies), High level assemblies, High-end cable assemblies, Microelectronics assembly and packaging, and Circular Services for sustainability. These products are supported by three technology service pillars (Design & development, Value engineering, and Technology domains) and manufacturing services (Manufacturing capabilities and Supply chain management). The company serves three primary market verticals: Semicon solutions, Defense & Mobility, and Connectivity. With over 55 years of experience and 500+ engineers, Neways provides integrated services from early design stages through production and end-of-life circular solutions.

Differentiator

Problem solved

Functional benefit

Products and services

• Functional Packaging Solutions for the Semiconductor Industry Qualified functional packaging solutions and related services tailored to the requirements of semiconductor manufacturers and equipment makers. Targeted at B2B customers in the semiconductor value chain requiring specialized packaging expertise.

Segments3 records

Ideal customer profiles1 record

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Three partnerships are on record, tiered major, core and minor.

• Philips Micro DevicesmajorStrategic or Co-development PartnerNeways successfully completed the acquisition of Philips Micro Devices, expanding their microelectronics assembly and packaging capabilities.
• ThalescoreStrategic or Co-development PartnerNeways and Thales have signed a Long-term Partnership Agreement, indicating a significant strategic relationship in defense and security electronics.
• NovopressminorStrategic or Co-development PartnerNeways and Novopress are collaborating on next generation pipe pressing technology in handheld tools, demonstrating Neways' capability to apply their electronics expertise across diverse industrial applications.

Scale indicators2 records

Broad incumbents

• JCET (Jiangsu Changjiang Electronics Technology): China's largest OSAT offering a broad packaging and test portfolio across wirebond, flip-chip, wafer-level and system-in-package. Comparable as a global functional packaging competitor with strong cost position that pressures European niche players like Sencio.
• Powertech Technology: Taiwan-based OSAT with capabilities in memory and logic packaging including advanced flip-chip and stacking. Comparable as another large-scale OSAT competing for the same functional packaging workloads.
• ASE Technology Holding: World's largest OSAT provider offering a full spectrum of semiconductor packaging and test services including wirebond, flip-chip, and advanced packaging. Comparable as a benchmark incumbent in the same functional packaging market Sencio serves, though far larger and more diversified.
• Intel Foundry (Advanced Packaging): Intel's foundry and packaging services (Foveros, EMIB) are an emerging competitor in advanced functional packaging. Comparable because Intel is increasingly offering packaging as a service, encroaching on the OSAT market.
• TSMC (Advanced Packaging): TSMC's Advanced Packaging business (InFO, CoWoS, 3DFabric) is a major player in the back-end functional packaging market. Comparable because it increasingly competes for the same advanced packaging workloads, though primarily focused on leading-edge nodes.
• Amkor Technology: Leading US-headquartered OSAT with strong advanced packaging capabilities (flip-chip, fan-out, 2.5D/3D) serving automotive, communications and computing. Comparable as a global OSAT competitor for the same functional packaging opportunities, with greater scale and geographic reach.

Others

• Taiwan Semiconductor Manufacturing (Netherlands packaging partners): Adjacent ecosystem enabler: large foundries and equipment OEMs in the Netherlands and broader EU that drive local demand for functional packaging services like those Sencio provides.
• ASMPT (ASM Pacific Technology): Leading supplier of assembly and packaging equipment (die bonders, wire bonders) to OSATs and IDMs. Comparable as a key equipment enabler in the functional packaging value chain that Sencio depends on.
• Besi: Dutch-headquartered supplier of die-bonding and packaging equipment for advanced packaging, including hybrid bonding. Comparable as both a Dutch semiconductor packaging ecosystem peer and an equipment supplier whose roadmap shapes Sencio's options.

Emerging players

• Signetics: South Korea-headquartered OSAT focused on memory and system semiconductor packaging and test. Comparable as a mid-sized OSAT competing for similar functional packaging business with a similar scale profile.

Market position

Strengths3 records

Weaknesses4 records

Competitive moat2 records

Key risks4 records

Key highlights4 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Sencio