Disco Hi-Tec (M) Sdn Bhd

Name

Disco Hi-Tec (M) Sdn Bhd

Website

https://discosin.com.sg

Company type

Private

Headcount range

11–50 employees

Short description

Disco Hi-Tec (M) Sdn Bhd is a privately held Malaysian company of 37 employees based in Bayan Baru, Penang, with a Singapore-domain website linked to DISCO Corporation (株式会社ディスコ), suggesting a regional semiconductor-equipment affiliate role.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Electrical Industrial Apparatus (3620)

akta.pro primary industry

Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware) (IMAGAGAK)

Keywords

• Semiconductor dicing equipment
• Precision grinding machines
• Wafer processing equipment
• Electronics packaging tooling
• Semiconductor manufacturing services

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Marketing or Sales, Infrastructure

Core offering

The company operates as the Malaysian regional arm of Disco Corporation (株式会社ディスコ), providing sales, distribution, and technical support for precision semiconductor manufacturing equipment such as dicing and grinding machines used in wafer processing and electronics packaging. Its presence supports customers in the Southeast Asian semiconductor and electronics manufacturing sectors.

Differentiator

Problem solved

Functional benefit

Products and services

• DISCO Precision Dicing Equipment (regional supply) Supply of DISCO Corporation precision wafer dicing machines used by semiconductor manufacturers for singulating wafers into individual chips. Offered to fab and OSAT customers in Malaysia and Southeast Asia.
• DISCO Precision Grinding Equipment (regional supply) Supply of DISCO Corporation precision grinding and wafer-thinning equipment for semiconductor back-grinding and surface preparation, provided to semiconductor packaging and electronics manufacturing customers in the region.

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Broad incumbents

• Tokyo Electron (TEL): One of the largest semiconductor production equipment suppliers globally with broad product coverage including back-end processes. Operates across Southeast Asia and serves the same fab/IDM customer base as DISCO.
• Kulicke & Soffa Industries: Established semiconductor and LED assembly equipment supplier with significant Southeast Asian operations, including a presence in Penang. Overlaps with DISCO in back-end semiconductor equipment sold to similar customers.
• Applied Materials: Largest semiconductor equipment manufacturer globally with growing presence in advanced packaging adjacent to DISCO's core market. Maintains significant operations in Singapore and Malaysia.
• Lam Research: Major semiconductor wafer fabrication equipment supplier with regional operations across Southeast Asia serving many of the same fab and IDM customers as DISCO.
• ASM Pacific Technology: Major semiconductor assembly equipment manufacturer with extensive Malaysian operations in Penang and Johor. Serves the same OSAT/IDM customer base as DISCO with adjacent back-end process equipment.
• BE Semiconductor Industries (Besi): Leading supplier of assembly equipment for the semiconductor and hybrid industries. Competes with DISCO in advanced packaging equipment sold to global OSAT and IDM customers.

Direct peers

• Tokyo Seimitsu (Accretech): Direct competitor to DISCO Corporation in wafer dicing, grinding, and CMP equipment for semiconductor back-end processing. Most relevant peer given near-identical product portfolio served to the same OSAT/IDM customer base that this Malaysian subsidiary supports.

Emerging players

• Hanmi Semiconductor: Korean supplier of dicing and sawing equipment as well as vision inspection systems for semiconductor back-end. Increasingly competing with DISCO in advanced packaging singulation tools.
• SÜSS MicroTec: Manufacturer of equipment for lithography, wafer processing, and advanced packaging. Adjacent product portfolio overlaps with DISCO in back-end semiconductor process equipment.
• Onto Innovation: Supplier of process control and inspection equipment for semiconductor packaging and adjacent markets. Competes with DISCO indirectly via shared advanced-packaging customer wallet share.

Market position

Customer concentration

• LinkedInlinkedin.com/company/disco-hi-tec-m-sdn-bhd

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Disco Hi-Tec (M) Sdn Bhd