What Quick Intelligent Equipment Co.,Ltd. does

QUICK INTELLIGENT EQUIPMENT CO.,LTD. is a privately held Chinese manufacturer of precision electronics assembly equipment and backend semiconductor packaging solutions, established in 1993 and headquartered in Changzhou, Jiangsu. The company designs and builds capital equipment covering the full SMT/PCBA value chain — selective soldering, laser soldering, FPC hotbar soldering, precision dispensing, laser marking, and 3D AOI/SPI inspection — as well as a newer line of semiconductor packaging tools that includes thermo-compression bonders, high-speed and multi-functional die bonders, silver sintering systems, vacuum ovens, formic acid ovens, and die-packaging AOI.

The underlying technology rests on a self-developed motion control platform with intelligent temperature compensation, a proprietary dual electromagnetic pump for selective soldering, coaxial vision positioning for laser soldering, integrated MES/PDCA/AMES connectivity for process traceability, and CCD-based automated optical inspection. QUICK holds 300+ patents and software copyrights and reinvests 14%+ of revenue into R&D, with 900+ global employees supporting engineering, manufacturing, and field service.

The company sells through a B2B enterprise field-sales motion combining 7+ direct sales and after-sales offices in China with an International Business Unit backed by 30+ agents serving the US, Europe, and Southeast Asia. End markets include intelligent terminals (smartphones, wearables, AR/VR), electric vehicles (BMS, ECU, mmWave radar, PTC heater lines), new energy (IGBT, photovoltaic and wind inverters), semiconductor packaging (power devices, die bonding, sintering), and Mini-LED displays. Equipment pricing is quote-based and varies by configuration and order volume; no public revenue figures, funding rounds, or M&A activity are disclosed.

Name

Quick Intelligent Equipment Co.,Ltd.

Legal name

QUICK INTELLIGENT EQUIPMENT CO.,LTD.

Website

https://en.quick-global.com

Company type

Private

Founded year

1993

Operating status

Operating

Headcount range

1–10 employees

Short description

QUICK Intelligent Equipment is a Chinese manufacturer of precision electronics assembly and semiconductor backend packaging equipment, serving intelligent terminals, EVs, new energy, and semiconductor packaging customers globally through direct sales and an international agent network.

Ownership category

akta.pro rank

Product category

Electronics Assembly Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Welding and Soldering Equipment Manufacturing (333992), Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674), Industrial Process Furnaces & Ovens (3567), Electronic Components, Nec (3679), Special Industry Machinery, Nec (3559)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Thermal Processing Equipment (Furnaces/RTP/Anneal) (HDAHAEAE)

Keywords

• Precision electronics assembly
• Semiconductor packaging equipment
• Selective soldering machines
• Die bonding equipment
• Automated optical inspection

Headquarters

HQ city

Changzhou

HQ country

China

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Equipment Sales: Sale of precision electronics assembly equipment and semiconductor packaging equipment including selective soldering machines, laser soldering systems, precision dispensers, die bonders, AOI systems, and supporting tools
2. Integrated Automation Solutions: Turnkey automated production line solutions for SMT/PCBA intelligent upgrading and digital transformation

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

QUICK designs and manufactures precision electronics assembly equipment and backend semiconductor packaging equipment, including selective soldering, laser soldering, FPC hotbar soldering, precision dispensing, laser marking, 3D AOI/SPI, thermocompression and high-speed die bonders, silver sintering systems, vacuum and formic acid ovens, and turnkey automated production lines for EV, new energy, AIoT, intelligent terminal, and semiconductor customers. The company also sells soldering tools, BGA rework systems, and Mini-LED manufacturing solutions, supported by integrated MES/PDCA digital process management.

Product overview

QUICK INTELLIGENT EQUIPMENT CO.,LTD. is a precision electronics assembly and backend semiconductor packaging equipment manufacturer established in 1993. The company offers a comprehensive portfolio of products organized into core SMT/PCBA assembly equipment (Selective Soldering, Laser Soldering, FPC Hotbar Soldering, Soldering Locking Assembly, Precision Dispensing, Laser Marking, 3D AOI & 3D SPI), semiconductor packaging equipment (Thermo-Compression Bonder, High Speed Die Bonder, Thermo-compression Die Bonder, Multifunctional Die Bonder, Silver Sintering, Vacuum Oven, Formic Acid Oven, Die Packaging AOI), soldering tools and equipment (intelligent soldering stations, BGA rework systems, smoke purification, electrostatic protection), and specialized manufacturing solutions (Mini-LED manufacturing, automated production lines for new energy/electric vehicles). The product lines serve key industry verticals including 3C intelligent terminals, electric vehicles, new energy (photovoltaic/wind power IGBT), AIoT, and semiconductor packaging.

Differentiator

Problem solved

Functional benefit

Products and services

• Selective Soldering Equipment Selective soldering equipment with multiwave soldering process and self-developed dual electromagnetic pump for PCBA-DIP high-reliability soldering applications including electric vehicles and new energy power devices.
• Laser Soldering Systems Laser soldering systems including laser spray soldering, laser solder paste soldering, laser solder wire soldering, laser solder ring soldering, laser hot pressure soldering, and laser metal soldering across models LB10, LB100, LB100S, LB1000, LP100, LP100S, LP1000, LW10, LW100, LW100S, LW1000, LR100, LR100S, LR1000, LH100, LH100S, LH1000, LSW100, LSW100S, LSW1000.
• FPC Hotbar Soldering Equipment FPC (Flexible Printed Circuit) hotbar soldering equipment with innovative fully closed-loop pressure system for precision soldering of 3C cell phone and intelligent wear devices, with temperature closed-loop control, pressure closed-loop control, PDCA digital management, and dashboard visualization. Available in tabletop, turntable, 4-head, and on-line 12 head designs.
• Soldering Locking Assembly Robots Soldering robot systems for automation including iron soldering, hot pressure soldering, micro spot soldering, micro air soldering, solder wire quantitative droplet soldering, and screw locking, with self-developed motion control, intelligent temperature compensation, CCD visual positioning, and MES information interaction.
• Precision Dispensing Equipment Precision dispensing equipment for high precision, speed and flexibility applications including on-line precision dispensing equipment, desktop visual dispenser, automatic dispensing equipment, dispensing equipment for environment cleaning, piezoelectric injection valve, and precision screw valve. Models include QS800H, QM800, QM800A, QT300S, QT400A.
• Laser Marking Equipment Laser marking equipment with intelligent anti-stupidity and anti-re-carving features, industry minimum laser spot diameter 0.11mm, customized MES system docking, and high-precision visual navigation. Applications include post-package semiconductor engraving, filter engraving, and silicon wheat engraving.
• 3D AOI & 3D SPI Equipment 3D Automated Optical Inspection and 3D Solder Paste Inspection equipment for automated inspection and measurement in SMT/PCBA manufacturing lines.
• Thermo-Compression Bonder Thermo-compression bonder for semiconductor packaging with high accuracy XY ±1μm@3σ, θ ±0.004°@3σ, active bond head tilt control for coplanarity 1μm, and fluxless solutions with H2 plasma, targeted at AI and high performance computing applications.
• High Speed Die Bonder High speed die bonder with cycle time of 0.14s/Die, XY placement X,Y: ±20μm (3σ), θ: ±3° (3σ), and bonding area X: 8mm (±4mm), Y: 90mm. Suitable for discrete devices, integrated circuits, MEMS, and transducers.
• Thermo-compression Die Bonder Thermo-compression die bonder compatible with Ag paste and Ag film thermo-compression process, UPH: 1K, die bonding accuracy: ±10μm@3σ, θ: ±0.2°@3σ, die bonding pressure: 30g-30kg, designed for power semiconductor and new energy vehicle applications.
• Multifunctional Die Bonder Multifunctional die bonder with multiple feeding methods (Wafer, Tray, Tape), max 6 nozzles, accuracy: ±25μm, Max UPH >6K, supports large jig/carrier up to 330x660mm, and automated solder preform cutting and placement.
• Silver Sintering Equipment Silver sintering equipment (online and offline) for small batch and mass production. Sintering area: Max. 350*270mm, sintering pressure: Max. 30MPa, sintering temperature: Max. 350°C. Supports die, DTS, Clip, Module and wafer sintering with full-process anti-oxidation protection.
• Vacuum Oven / Vacuum Soldering System Vacuum soldering system supporting high temperature solder paste process with soldering temperature max 450°C, void control as low as 1%, and temperature uniformity ±3.5°C for automotive and aerospace applications.
• Formic Acid Oven Four-chamber formic acid oven for higher productivity with max temperature 450°C, temperature uniformity ±5°C, void ratio of soldering joint as low as 1%, for power semiconductor and industrial applications.
• Die Packaging AOI Die packaging AOI with dual-resolution optical system, multi-angle shadowless light source, Ultra DoF Fusion Technology, and AI programming, applied to photoelectric components, power modules, T/R modules, and die packaging.
• Soldering Tools and Equipment Comprehensive range of soldering tools including intelligent soldering stations (TS8+, TS1100, TS1200, TS1200D, TS2200, TS2200D, 203H, 203D, 205), desoldering rework stations (BGA rework systems EA-A10, EA-A20, EA-H15, EA-R35, 7610, 7720), smoke purification equipment, electrostatic protection devices, testers, dispensing devices, solder pots, solder nozzle cleaners, solder cutting machines, and solder wire feeders.
• Mini-LED Manufacturing Solutions Complete Mini-LED manufacturing solutions including Mini-LED die bonder with patented double-wishbone design, precision dispensing for dam&fill, lens dispensing, flux/solder paste dispensing, FPC reinforcement, and associated AOI inspection equipment for household TVs, e-sports displays, tablets, vehicle displays, and outdoor displays.
• Automated Production Lines for EV and New Energy Turnkey automated production lines including BMS hot pressure soldering automated production line, automated production line for millimeter wave radar, PTC automated production line, and ECU automated production line for new energy and electric vehicle applications.

Quantifiable outcome

• Die bonding accuracy up to XY ±1μm@3σ with active bond head tilt control
• +5 more outcomes

Segments5 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration4 records

AI capability11 records

Feature8 records

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• ASMPT (ASM Pacific Technology): ASMPT is the global leader in semiconductor assembly equipment (die bonding, wire bonding, TCB) and SMT solutions; it is the most directly comparable peer to QUICK's die bonder, silver sintering, and selective soldering lines given overlapping product categories and customer base.
• Kulicke & Soffa Industries: Kulicke & Soffa is a major player in die bonding, wire bonding, and advanced packaging equipment; it competes head-on with QUICK's die bonder portfolio and serves the same power semiconductor and advanced packaging customers.
• Rehm Thermal Systems: Rehm manufactures reflow soldering, condensation soldering, and selective soldering systems for SMT/PCBA, competing with QUICK in the same selective soldering and vacuum soldering/oven segments serving automotive and industrial customers.
• BE Semiconductor Industries (BESI): BESI is a leading supplier of die bonding and advanced packaging equipment for semiconductor back-end, including hybrid bonding and TCB solutions; it directly competes with QUICK's new thermo-compression and high-speed die bonders in the advanced packaging market.
• Mycronic: Mycronic provides SMT assembly equipment (pick-and-place, solder paste application, AOI) and die bonding/advanced packaging solutions; it overlaps with QUICK across the SMT line plus die bonding and selective soldering equipment.
• ERSA (Kurtsan): ERSA is a German specialist in selective soldering, reflow soldering, and rework systems for SMT/PCBA; its selective soldering portfolio directly competes with QUICK's selective soldering equipment in European and global automotive/electronics accounts.
• Hesse Mechatronics: Hesse is a leading manufacturer of selective soldering, wire bonding, and ribbon bonding equipment with a strong focus on automotive and power electronics customers; it is one of the closest direct competitors to QUICK's selective soldering and FPC hotbar soldering lines.

Broad incumbents

• Hanwha (Hanwha Precision Machinery): Hanwha (formerly Samsung Techwin) produces semiconductor back-end equipment including die bonders, flip-chip bonders, and packaging tools; it is a major incumbent directly competing with QUICK's thermo-compression and high-speed die bonders in the Korean and global OSAT market.
• Panasonic Smart Factory Solutions: Panasonic's Smart Factory Solutions division offers a broad SMT equipment portfolio (pick-and-place, reflow, laser soldering, dispensing) serving automotive and 3C customers; it competes with QUICK across multiple SMT categories as a large incumbent with global reach.

Emerging players

• Inertech / Shenzhen Inteway: Inteway is a Chinese equipment maker specializing in precision soldering, dispensing, and selective soldering systems for SMT/PCBA; as a domestic Chinese peer with overlapping product lines, it competes with QUICK in the same regional market.

Market position

Strengths1 record

Weaknesses1 record

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/quick-intelligent-equipment-co-ltd

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Quick Intelligent Equipment Co.,Ltd.