What IMAPS-UK does

IMAPS-UK is a UK-registered charity and the United Kingdom Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), tracing its institutional lineage to ISHM founded in 1968. The organisation functions as a professional society serving engineers, scientists, manufacturers, end-users, and supply chain companies working in microelectronics assembly and packaging. Its core "products" are membership subscriptions, recurring conferences (MicroTech annual conference, RaMPoP, REACT, CWTEC, IMAPS Symposium, World Micromachining Summit, Si Photonics Packaging Summit, Electronics for Extreme Environments, CPE), technical workshops (Microelectronics Packaging Workshop, Advanced Packaging and Heterogeneous Integration Workshop), webinars, and structured training delivered through the IMAPS-UK Academy — including the Cardiff University-developed Introduction to Wire Bonding Online Course.

The underlying platform is a community-and-events model rather than a technology stack: IMAPS-UK convenes industry through its website (imaps.org.uk), an active LinkedIn presence, email newsletters (including the Advancing Microelectronics Magazine), and physical events held at partner venues across the UK (CSA Catapult Newport, University of Southampton, University of Warwick, King's Conference Centre, Churchill College Cambridge, Rutherford Appleton Labs). The organisation is volunteer-led by senior figures from KLA (Chair Carolyn Short), Inseto (Vice Chair Eamonn Redmond), Tribus-D Ltd (Secretariat Steve Riches), and PandA Europe (Secretary Andy Longford), with a small operational staff of 1-10 employees.

Name

IMAPS-UK

Legal name

IMAPS-UK (UK Chapter of the International Microelectronics Assembly and Packaging Society)

Website

https://imaps.org.uk

Company type

Private

Founded year

1968

Operating status

Operating

Headcount range

1–10 employees

Short description

IMAPS-UK is the UK chapter of the International Microelectronics Assembly and Packaging Society, operating as a registered charity that convenes microelectronics packaging engineers, researchers, manufacturers, and suppliers through membership, conferences, workshops, and training.

Ownership category

akta.pro rank

Headquarters

HQ city

Cambridge

HQ country

United Kingdom

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Marketing or Sales, Technology or R&D, Infrastructure

Revenue model

1. Membership Fees: IMAPS-UK generates revenue through membership fees. Members receive benefits including access to business networking, technical events, workshops, research papers, newsletters, publications, discounted event tickets, free Advancing Microelectronics Magazine, and one-world IMAPS Membership.
2. Event Registration Fees: Revenue generated from conference and workshop registration fees. Event pricing varies by membership status and event type, with member rates discounted compared to non-members. Examples include workshops at £50-95 and conferences with various tiered pricing.
3. Exhibitor and Sponsorship Fees: Revenue from tabletop exhibitions and sponsorship packages at conferences. Sponsorship packages include exhibitor access, speaking slots, program advertising, and logo placement on promotion materials.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels6 records

Core offering

IMAPS-UK is a registered charity and the UK Chapter of the International Microelectronics Assembly and Packaging Society. It operates as a professional society that delivers paid individual and corporate memberships, an annual flagship MicroTech Conference, specialised conferences (RaMPoP, Si Photonics Packaging Summit, REACT, IMAPS-UK Academic Conference, World Micromachining Summit, CWTEC, POP2, CPE), technical workshops, webinars, and online training courses (such as the Introduction to Wire Bonding Online Course with Cardiff University). Membership includes access to the IMAPSource Technical Library, discounted event and exhibitor tickets, the Advancing Microelectronics Magazine, networking, and one-world IMAPS Membership.

Product overview

IMAPS-UK is the UK Chapter of the International Microelectronics Assembly and Packaging Society, operating as a registered charity and professional society. The organization functions as a platform-plus-events model, providing a membership program that includes access to technical resources, networking, and publications, complemented by a diverse portfolio of conferences, workshops, and training courses. Key products include the annual MicroTech Conference focused on semiconductor packaging innovation, the Introduction to Wire Bonding Online Course developed with Cardiff University, the REACT Conference on sustainable electronics, the RaMPoP Conference on RF/Microwave/Photonics packaging, and various technical workshops on topics such as advanced packaging, heterogeneous integration, and failure analysis. The Academy division offers educational initiatives targeting skills development, while membership provides access to the IMAPSource Technical Library, newsletters, and discounted event registration.

Differentiator

Problem solved

Functional benefit

Products and services

• IMAPS-UK Membership Professional society membership for individuals and corporate members, providing access to business networking, technical events, workshops, research papers, newsletters, publications, the IMAPSource Technical Library, the Advancing Microelectronics Magazine, discounted event and exhibitor tickets, and one-world IMAPS Membership for engineers, scientists, manufacturers, end-users, and supply chain companies in microelectronics packaging.
• MicroTech Conference IMAPS-UK's annual flagship conference bringing together experts from across the microelectronics sector to discuss the latest technologies, developments, and commercial opportunities in semiconductor packaging.
• RaMPoP Conference RF, Microwave and Photonics Packaging Conference addressing assembly and packaging for high-frequency devices, covering materials, thermal management, hermeticity, photonic integration, and modelling.
• World Micromachining Summit (MMS2026) 29th World Micromachining Summit focusing on advanced packaging and heterogeneous integration of micro- and nanotechnologies for semiconductors, AI, and quantum computing applications, bringing together experts from academia, industry, and government.
• IMAPS-UK Academic Conference on Advanced Packaging R&D IMAPS-UK Academic Conference on Advanced Packaging R&D in the UK, focused on academic research presentations and industry-academia collaboration in microelectronics packaging.
• CWTEC (Cambridge Wireless Technology and Engineering Conference) Cambridge Wireless Technology and Engineering Conference examining critical enabling technologies for next-generation innovation with emphasis on semiconductors and photonics, attracting senior engineers, technologists, academics, and business leaders.
• Si Photonics Packaging Summit Summit dedicated to advancing silicon photonics and co-packaging optics, bringing together leaders from across the silicon photonics ecosystem.
• Electronics for Extreme Environments Conference Conference focused on electronics that must endure in high and low temperatures, high field strengths, and severe mechanical conditions, hosted with ZEISS and Forensic Eyes.
• REACT Conference (International Responsible Electronics and Circular Technologies) International Responsible Electronics and Circular Technologies Conference focused on sustainable electronics manufacturing, design for circularity, and digital product passports.
• POP2 Conference (Photonics and Opto Packaging) International Conference on Photonics and Opto Packaging linking optoelectronics designers and manufacturers.
• IMAPS Symposium 2026 (59th International Symposium on Microelectronics) 59th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society, held in Boston, Massachusetts.
• CPE Conference (Centre for Power Electronics Annual Conference) Centre for Power Electronics Annual Conference addressing power electronics packaging and related technologies.
• Microelectronics Packaging Workshop Workshop covering main packaging processes and methods including wafer preparation, die attach and interconnection, encapsulation, and test and inspection, designed for upskilling engineers and researchers.
• Advanced Packaging and Heterogeneous Integration Workshop Technical workshop providing an overview of current developments in advanced packaging and heterogeneous integration in the UK, with speakers from industry and academia, co-organised with the UK Microsystems Network.
• Electronics Packaging Failure Analysis Workshop Focused hands-on workshop dedicated to strengthening failure analysis capabilities within the electronics packaging community, hosted at the ZEISS site in Lutterworth with ZEISS and Forensic Eyes.
• Introduction to Wire Bonding Online Course Online training course created by Cardiff University in conjunction with IMAPS-UK providing theoretical and practical understanding of the wire bonding process as a key microelectronic interconnection technique, with fully funded places for eligible UK residents and workers.
• IMAPS-UK Academy Educational initiatives and training programmes targeting skills development in microelectronics packaging, including workshops, professional development courses, and the Introduction to Wire Bonding Online Course.
• Next Generation Sintering Solutions Webinar Free technical webinar presented by INSETO UK Ltd (an IMAPS-UK Corporate Member) on Inventec's ECOREL SINTEC product range and next-generation sintering solutions for microelectronics packaging.

Quantifiable outcome

• 96% of MicroTech 2017 delegates rated the event as excellent or very good

Named customers10 records

Segments3 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Partnerships

Ten partnerships are on record, tiered core and minor.

• Cardiff UniversitycoreStrategic or Co-development Partner · 21 July 2026Cardiff University collaborated with IMAPS-UK to create and deliver the Introduction to Wire Bonding Online Course. This educational partnership helps address skills development needs in the microelectronics packaging sector with fully funded places available for eligible UK residents.
• University of SouthamptoncoreStrategic or Co-development Partner · 14 June 2026University of Southampton is hosting the 29th World Micromachining Summit (MMS2026), a prestigious global summit bringing together experts from academia, industry, and government to discuss micro-nano technologies and advanced packaging integration.
• REWIREcoreStrategic or Co-development Partner · 20 April 2026REWIRE (The Next Generation of Power Semiconductors: From Concept to Commercialisation) is a key semiconductor partner collaborating with IMAPS-UK on initiatives including the EDI Pilot Study to investigate barriers to diversity in the semiconductor research workforce. This partnership brings together industry knowledge and workforce expertise.
• CHIMEScoreStrategic or Co-development Partner · 20 April 2026CHIMES (Innovation and Knowledge Centre for Heterogeneous Integration of MicroElectronic and Semiconductor Systems) partners with IMAPS-UK on semiconductor research workforce diversity initiatives. CHIMES provides expertise in heterogeneous integration technology.
• National Epitaxy FacilitycoreStrategic or Co-development Partner · 20 April 2026The National Epitaxy Facility (Providing High Quality Epitaxy Wafers) collaborates with IMAPS-UK on semiconductor sector workforce diversity initiatives, bringing specialized semiconductor manufacturing expertise.
• CS Hub (Compound Semiconductor Manufacturing Hub)coreStrategic or Co-development Partner · 20 April 2026CS Hub (The Compound Semiconductor Manufacturing Hub for a Sustainable Future) partners with IMAPS-UK on EDI initiatives, contributing expertise in compound semiconductor manufacturing for the UK semiconductor sector.
• International IMAPScoreStrategic or Co-development PartnerIMAPS-UK is the UK Chapter of the International Microelectronics Assembly & Packaging Society (IMAPS). This parent organization affiliation provides access to global knowledge networks, international standards, and worldwide membership benefits for UK members.
• UK Microsystems NetworkminorStrategic or Co-development PartnerThe UK Microsystems Network, organized by the Packaging and Integration Special Interest Group (SIG), collaborates with IMAPS-UK to host the Advanced Packaging and Heterogeneous Integration Workshop at University of Southampton.
• ZEISS / Forensic EyesminorStrategic or Co-development PartnerZEISS and Forensic Eyes organized a focused hands-on Electronic Packaging Failure Analysis Workshop dedicated to strengthening failure analysis capabilities within the electronics packaging community, hosted at the ZEISS site in Lutterworth.
• INSETO UK LtdminorGTM or Marketing PartnerINSETO UK Ltd, an IMAPS-UK Corporate Member, presented the Next Generation Sintering Solutions Webinar on Inventec's ECOREL SINTEC product range. This demonstrates corporate member engagement through educational content.

Scale indicators4 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• JEDEC: Global standards body for the microelectronics industry — adjacent peer operating in the same semiconductor ecosystem, engaging overlapping member companies on packaging-related standards.
• SEMI: Global semiconductor and electronics manufacturing industry association — a much larger incumbent offering overlapping events (SEMICON), standards, and advocacy across the same microelectronics value chain.

Regional players

• TechWorks: UK deep tech and electronics industry association — regional peer addressing similar UK-based semiconductor and advanced-manufacturing audiences and policy stakeholders.

Direct peers

• iNEMI (International Electronics Manufacturing Initiative): Industry consortium driving collaborative R&D roadmaps in electronics manufacturing and packaging — comparable membership-based, ecosystem-convening model serving the same semiconductor packaging community.
• ECIA (Electronic Components Industry Association): Trade association for the electronic components supply chain — overlaps with IMAPS-UK's supply-chain and equipment-member ecosystem and runs comparable industry events and training.
• IEEE Components, Packaging and Manufacturing Technology Society (CPMT): IEEE's technical society for components, packaging, and manufacturing technology — overlaps heavily with IMAPS-UK's packaging and heterogeneous integration focus and runs the major ECTC conference.
• MEPTEC (Microelectronics Packaging and Test Engineering Council): Technical community focused on microelectronics packaging and test, running technical conferences and networking events — directly comparable content focus and audience to IMAPS-UK's workshops.
• SMTA (Surface Mount Technology Association): International professional society for electronics assembly and surface mount technology — directly comparable membership-and-events model serving overlapping engineers and supply-chain companies.
• International Microelectronics Assembly and Packaging Society (IMAPS): Global parent professional society for microelectronics assembly and packaging — the same body IMAPS-UK is the UK chapter of. Comparable mission, event format, and member base, operating at worldwide scale.
• IPC International: Global electronics manufacturing association offering standards, training, certification, and events for interconnection and assembly — closely aligned with IMAPS-UK's industry-development and training programmes.

Market position

Strengths4 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xtwitter.com/IMAPS_UK
• LinkedInlinkedin.com/company/imaps-uk

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about IMAPS-UK