Pretema GmbH

What Pretema GmbH does

Pretema GmbH, doing business as Possehl Electronics (legal entity Possehl Electronics Deutschland GmbH), is a precision metal-components manufacturer operating as a wholly-owned subsidiary of the German Possehl Group. The company specializes in high-volume precision stamping, reel-to-reel electroplating, leadframe etching, plastic injection molding, and automated assembly of hybrid metal-plastic components, with manufacturing facilities across 9 countries in Europe, Asia, and the Americas. Its production footprint is substantial: approximately 1.7 billion stamped parts, 14,000+ km of galvanized strip, 40 million+ etched parts, and 610 million insert parts are produced annually using 30+ stamping presses, 90+ injection molding machines, and roughly 210 manufacturing robots.

The company's commercial focus spans three primary verticals — semiconductor packaging (leadframes, connectors, hybrid assemblies), automotive electronics (connectors, sensors, control units), and the broader connector/interconnect market — sold via direct B2B OEM and tier-1 supplier relationships. Differentiated technology includes proprietary pretPin® connector technology, Stackpac stacking packaging, Liquid Silicon Rubber molding, a proprietary MSL surface-treatment process, and selective immersion cells with automatic adjustment; the Dutch subsidiary operates what is described as the longest (100 m) and fastest (20 m/min) electroplating line in the PE Group. Pricing is quote-based and not publicly disclosed, consistent with negotiated industrial-supply contracts.

Revenue is not publicly disclosed, and the operating company sits within a privately held diversified conglomerate (Possehl Group), limiting financial transparency. The disclosed headcount figure of 10 for Pretema GmbH appears to reflect the legal entity rather than the broader operating workforce; consolidated employee counts for the Possehl Electronics operating group are not provided in the available data.

Name

Pretema GmbH

Legal name

Possehl Electronics Deutschland GmbH

Website

https://pretema.com

Company type

Private

Operating status

Operating

Headcount range

1–10 employees

Short description

Pretema GmbH (doing business as Possehl Electronics) is a precision metal-component manufacturer serving semiconductor packaging and automotive electronics OEMs with stamping, electroplating, etching, plastic molding, and automated assembly across a 9-country footprint as part of the Possehl Group.

Ownership category

akta.pro rank

Product category

Precision Metal Components Manufacturing

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Leadframes & Package Interconnect Materials (HDAHADAF)

akta.pro secondary industry

Electrical & Electronics Injection Molded Components (Connectors, Housings) (IMANAFAD)

Keywords

• Precision metal stamping
• Leadframe manufacturing
• Electroplating services
• Semiconductor packaging components
• Automotive electronics assemblies

Headquarters

HQ city

Niefern

HQ country

Germany

HQ region

Europe

Offices9 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Infrastructure, Technology or R&D, Marketing or Sales

Distribution channels1 record

Marketing channels7 records

Core offering

Pretema GmbH (operating as Possehl Electronics) manufactures precision metal components for semiconductor and automotive electronics customers using stamping, electroplating, etching, plastic injection molding, and automated assembly. It produces leadframes, connectors, and hybrid assemblies in both reel-to-reel and reel-to-piece formats, and markets proprietary innovations such as pretPin®, Stackpac, and Liquid Silicon Rubber, with annual capacity of roughly 1.7 billion stamped parts, 40+ million etched parts, and 610 million insert parts across nine countries.

Product overview

Possehl Electronics operates as a precision electronics manufacturing company offering a unified portfolio of products and manufacturing capabilities. The core product categories include Semicon (semiconductor components), Automotive electronics, and Baugruppen (electronic assemblies). These products are manufactured using two primary processes: Reel-to-reel (continuous high-volume production) and Reel-to-piece (individual component production). The portfolio is complemented by three proprietary innovations: pretPin® (connector technology), Stackpac (stacking package technology), and Liquid Silicon Rubber (molding technology). The company also provides comprehensive manufacturing expertise including stamping, surface technology, etching, plastic technology, and assembly services.

Differentiator

Problem solved

Functional benefit

Brands

• pretPin®: Innovation product for precision connection solutions
• Stackpac
• Liquid Silicon Rubber
• Future League

Products and services

• Semicon (Semiconductor Components) Semiconductor-related products and components manufactured using precision stamping, etching, and surface technology processes, including leadframes and related interconnect components for semiconductor packaging customers.
• Automotive Electronics Components Automotive-grade electronic components and assemblies meeting industry quality and reliability standards, including precision stamped, plated, and assembled components for connectors, sensors, and control units.
• Baugruppen (Electronic Assemblies) Electronic assemblies and hybrid components combining metal and plastic parts with integrated manufacturing processes, including complex housing assemblies built using fully or partially automated systems.
• pretPin® Proprietary pin technology innovation developed by Possehl Electronics for connector applications, providing a novel connection solution for semiconductor and electronics customers.
• Stackpac Proprietary stacking packaging solution innovation developed by Possehl Electronics for advanced component packaging applications.
• Liquid Silicon Rubber Liquid silicone rubber molding technology for sealing and protection of electronic components, used in component packaging and protection applications.

Quantifiable outcome

• 1.7 billion stamping parts produced annually with 30+ stamping machines
• +5 more outcomes

Segments3 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Scale indicators11 records

Recent moves5 records

Expansion highlights4 records

Emerging players

• ASMPT: Hong Kong-listed supplier of semiconductor assembly and packaging equipment and materials. Competes in adjacent parts of the semiconductor packaging value chain and serves many of the same customers as Possehl Electronics.
• Besi: Dutch-listed supplier of semiconductor assembly equipment for die bonding and advanced packaging. While primarily equipment-focused, it serves overlapping semiconductor packaging customers and represents adjacent exposure to the packaging trend.

Broad incumbents

• Entegris: US-listed provider of specialty materials and fluid handling for semiconductor manufacturing. Broader semiconductor materials player with adjacent offerings in packaging-related materials and services.
• Molex: Molex (Koch Industries subsidiary) manufactures electronic interconnect solutions including precision connectors and terminals. Broad incumbent in automotive and semiconductor connector markets directly overlapping with Possehl's connector business.
• TE Connectivity: Global leader in connectors and sensors serving automotive, industrial, and semiconductor end-markets. While much larger and more diversified than Possehl Electronics, it competes directly in precision connector and interconnect components.
• Amphenol: Large diversified manufacturer of electronic connectors, cable assemblies, and interconnect systems with strong automotive and industrial electronics exposure. Broad incumbent in the same precision connector market as Possehl Electronics.

Direct peers

• Mitsui High-Tec: Japanese-listed global leader in precision leadframes for semiconductor packaging. Direct competitor in etched and stamped leadframes serving automotive and semiconductor OEMs, with comparable multi-decade process expertise.
• Chang Wah Technology: Taiwan-based precision leadframe manufacturer with significant global share in etched and stamped leadframes. Direct competitor to Possehl Electronics in semiconductor packaging components with comparable reel-to-reel production capabilities.
• Shinko Electric Industries: Major Japanese manufacturer of plastic molded leadframes and heat spreaders for IC packaging. Directly competes in the same precision leadframe and IC substrate market as Possehl Electronics, serving semiconductor and automotive customers globally.
• HAESUNG DS: Korean manufacturer specializing in leadframes and semiconductor packaging materials. Directly comparable in product offering (etched leadframes for IC packages) and serves overlapping semiconductor customers in memory and logic packaging.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• Facebookfacebook.com/PossehlElectronics
• LinkedInlinkedin.com/company/pretema-gmbh
• Instagraminstagram.com/possehlelectronics

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Pretema GmbH