Elead Tech
Elead Tech designs and manufactures vacuum-pressure de-voiding equipment and wafer-level vacuum lamination systems that eliminate bubbles in advanced semiconductor packaging. The Nanjing-based company serves semiconductor, automotive electronics, new energy, and 5G/IoT manufacturers across Asia, Europe, and the Americas.
- Company typePrivate
- Founded2021
- HeadquartersNanjing, China
- Headcount—
- GTM typeB2B
- OfferingHardware or Manufacturing
What Elead Tech does
Elead Tech (屹立芯创), formally incorporated in 2021 in Nanjing's Jiangbei New Area, designs and manufactures specialized vacuum and pressure equipment that eliminates bubbles and voids during advanced semiconductor packaging. The company operates two primary product lines. The De-Void System family spans entry-level pressure de-foaming (PCS), vacuum-pressure alternating switching (VPS), fully-automated vacuum-pressure de-foaming (VPSA), high-temperature vacuum-pressure de-foaming (PIS), and fully-automatic high-temperature vacuum-pressure de-foaming (PISA) configurations. The Wafer Vacuum Lamination System family includes manual (WVLM), semi-automatic (WVLS), and fully-automatic (WVLA) models designed for 8" and 12" wafer-level film lamination. Both families are built on a proprietary thermal-flow and pressure-vacuum technology stack protected through multi-country patents, including vacuum-pressure multi-stage switching degassing and soft airbag compression methods, with claimed capability of 1:20 high aspect ratio filling for TSV, RDL, NCF, Mini/Micro LED, and Wafer Molding processes.
The company serves semiconductor advanced packaging manufacturers, automotive electronics suppliers (ADAS sensors, EV power modules), new energy and power electronics manufacturers (IGBT module encapsulation, EV power systems, renewable energy inverters), and 5G/IoT device makers, primarily across Asia, Southeast Asia, Europe, and the Americas. It claims more than 500 global customers, over 1,000 accumulated application cases, and a proprietary big-data application platform covering 200+ packaging materials. Revenue is generated through direct enterprise sales of customized hardware systems with full lifecycle service (R&D, testing, production, after-sales), supported by R&D and application centers in Nanjing (headquarters with digital smart factory), Suzhou (joint laboratory with Shanghai Jiao Tong University Suzhou AI Research Institute), Taiwan, and Tokyo (linked to the WOW Alliance at Tokyo Institute of Technology). Pricing is configuration-based and is not publicly disclosed.
Elead Tech firmographics
Firmographics- Name
- Elead Tech
- Legal name
- Elead Technology Co., Ltd.
- Website
- https://eleadtech.cn
- Company type
- Private
- Founded year
- 2021
- Operating status
- Operating
- Short description
- Elead Tech designs and manufactures vacuum-pressure de-voiding equipment and wafer-level vacuum lamination systems that eliminate bubbles in advanced semiconductor packaging. The Nanjing-based company serves semiconductor, automotive electronics, new energy, and 5G/IoT manufacturers across Asia, Europe, and the Americas.
- Ownership category
- akta.pro rank
Elead Tech industry classification
Industry- Product category
- Semiconductor Packaging Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Electronic & Other Electrical Equipment (No Computer Equip) (3600)
- akta.pro primary industry
- Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)
- akta.pro secondary industry
- Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)
Keywords
Where Elead Tech is headquartered
LocationHeadquarters
- HQ city
- Nanjing
- HQ country
- China
- HQ region
- Asia
Offices5 records
Markets served
Elead Tech business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Operations, Personnel, Marketing or Sales, Supply Chain
Revenue model
- De-Voiding Equipment (Hardware Sales): Sale of proprietary de-voiding systems including PCS, VPS, VPSA, PIS, PISA series, and wafer-level vacuum lamination systems WVLM, WVLS, WVLA. Equipment is sold with customization options and full lifecycle service support including R&D, testing, production, and after-sales.
- Customized Equipment Solutions: Equipment function optional configuration services based on customer needs, providing customized equipment. Also includes industrial non-standard customization and yield improvement consultation for advanced packaging technology.
- Testing and Process Services: Provides package testing services and overall bubble problem solutions for advanced packaging processes.
Go-to-market motion1 record
Distribution channels3 records
Marketing channels6 records
Elead Tech product offering
Product offeringCore offering
Elead Tech designs, manufactures and services proprietary de-voiding (defoaming) equipment and wafer-level vacuum film lamination systems used by semiconductor advanced-packaging manufacturers. Its De-Void System family (PCS, VPS, VPSA, PIS, PISA) and Wafer Vacuum Lamination family (WVLM, WVLS, WVLA) remove bubbles and voids from underfills, encapsulants, chip-bonding, OCA, IGBT potting, TSV and wafer-molding processes. Customers receive customized configuration, process testing, installation and full after-sales support.
Product overview
Elead Tech (屹立芯创) is a provider of semiconductor advanced packaging bubble elimination (除泡品类) solutions. The company operates two core product lines: the De-Void System (除泡系统) product family and the Wafer Vacuum Lamination System (晶圆级真空贴压膜系统) product family. The De-Void System product family ranges from entry-level pressure de-foaming (PCS) to advanced fully-automatic high-temperature vacuum pressure systems (PISA), addressing bubble problems in various packaging processes including underfill, encapsulation, chip bonding, and OCA lamination. The Wafer Vacuum Lamination System family includes manual (WVLM), semi-automatic (WVLS), and full-automatic (WVLA) models, designed for wafer-level thin film lamination processes including TSV, RDL, and Fan-in/out applications. Both product lines are powered by the company's core thermal flow and pressure vacuum technologies, providing integrated bubble elimination solutions for the semiconductor, automotive, new energy, and 5G/IoT industries.
Differentiator
Problem solved
Functional benefit
Products and services
- PCS - Pressure De-foaming System Entry-level pressure-based de-foaming system that uses positive pressure to remove bubbles from semiconductor packaging materials, providing basic bubble elimination for chip packaging processes.
- VPS - Vacuum Pressure De-foaming System Vacuum and pressure alternating technology system that solves bubble problems in encapsulant materials using multi-stage vacuum and pressure switching with configurable pressure and vacuum values based on material characteristics; equipped with dual pressurization and dual temperature control protection systems, with single/dual/triple/quad chamber configurations.
- VPSA - Automatic Vacuum Pressure De-foaming System Fully automated de-foaming system using vacuum and pressure switching technology, designed for high-throughput production environments requiring minimal manual intervention in advanced packaging lines.
- PIS - High-Temperature Vacuum Pressure De-foaming System High-temperature capable vacuum pressure de-foaming system for processes requiring elevated temperatures to achieve optimal bubble removal in thermally-sensitive encapsulant materials used in advanced packaging.
- PISA - Full-Automatic High-Temperature Vacuum Pressure De-foaming System Fully automated high-temperature vacuum pressure de-foaming system combining elevated-temperature processing with full automation for maximum throughput and yield in advanced semiconductor packaging applications.
- WVLM - Manual Wafer Vacuum Lamination System Manual wafer vacuum lamination system compatible with 8" and 12" wafers, featuring vacuum-assisted film pressing and soft cushion air-bag pressing patent technology to eliminate bubbles and achieve high film filling rates during wafer-level lamination.
- WVLS - Semi-Automatic Wafer Vacuum Lamination System Semi-automatic wafer vacuum lamination system offering a balance between manual operation and automated control for wafer film lamination processes including TSV, RDL, PR/PI film and Fan-in/out applications.
- WVLA - Full-Automatic Wafer Vacuum Lamination System Full-automatic wafer vacuum lamination system with exclusive vacuum film pressing and soft cushion air-bag pressing patent technology, compatible with 8" and 12" wafers, achieving up to 1:20 depth-to-width aspect ratio filling; applied to TSV filling, groove filling, NCF, Mini/Micro LED and Wafer Molding processes; recognized with the SEMI China Product Innovation Award 2023.
- Package Testing and Bubble-Solution Services Package testing services and overall bubble-problem solutions for advanced packaging processes, including yield-improvement consultation, advanced packaging technology testing and customized process recipe development for semiconductor manufacturers.
Quantifiable outcome
- 1:20 high aspect ratio filling capability for wafer lamination
- +3 more outcomes
Companies that use Elead Tech
Customer profileNamed customers2 records
Segments4 records
Ideal customer profiles3 records
Elead Tech technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature7 records
Elead Tech partnerships and signals
Strategic signalPartnerships
Eleven partnerships are on record, tiered core.
- Shanghai Jiao Tong University - Suzhou Artificial Intelligence Research InstitutecoreJointly established the 'Semiconductor Advanced Packaging Suzhou Joint Laboratory' (热流与气压智能技术联合研创平台) at Suzhou. The laboratory combines Shanghai Jiao Tong University's strong research capabilities with Elead Tech's 20 years of technical experience to develop efficient degassing solutions and promote thermal flow and air pressure engineering applications. The lab is equipped with vacuum pressure degassing systems, stereo optical microscopes, and dispensing machines for joint R&D and testing.
- Tsinghua University - School of Integrated CircuitscoreTsinghua University is a top Chinese university and a key talent cultivation base for IC industry research. Elead Tech participates in the '芯火力量' (Spark Power) industry-academia collaboration program, delivering lectures on 'Semiconductor Packaging Process - Degassing Technology' to students. The partnership focuses on talent cultivation and前沿技术 development in semiconductor packaging.
- Shenzhen University - Semiconductor Manufacturing Research InstitutecoreShenzhen University established the Semiconductor Manufacturing Research Institute in 2019, focusing on semiconductor 'bottleneck' manufacturing technology R&D. Elead Tech participates in the '芯火力量' program, delivering technical lectures and conducting academic exchanges with university researchers including Vice Dean Guo Dengji (Tokyo University graduate). Both parties discuss plans for future universityenterprise cooperation.
- Huazhong University of Science and TechnologycorePartner university in the '芯火力量' industry-academia collaboration initiative, jointly exploring IC industry talent cultivation models and advancing semiconductor packaging technology education and research.
- Nanjing University of Posts and TelecommunicationscoreMicroelectronics students visited Elead Tech headquarters to learn about the company's products and joint laboratory. Both parties agreed to jointly develop core technologies, enhance R&D application capabilities and patent technology innovation, and expand the university-enterprise cooperation in semiconductor packaging.
- Southern University of Science and Technology - SZU Microelectronics InstitutecoreSouthern University of Science and Technology (SUSTech) is a national 'Double First-Class' university. Elead Tech's GM and CTO Zhang Jingnan delivered a seminar on 'Semiconductor Packaging Process - Degassing Technology' to SZU Microelectronics Institute students and faculty. Both parties aim to accelerate technology transfer and create a mature industry chain through cooperation.
- China Semiconductor Industry Association - Packaging and Testing Sub-Committee (中半协封测分会)coreElead Tech participates as a member unit in the China Semiconductor Industry Association Packaging and Testing Sub-Committee. The company was invited to a matchmaking event with Hualong Microelectronics (华润微电子), engaging in deep technical exchanges with industry chain companies to enhance overall competitiveness.
- Yangtze River Delta Third Generation Semiconductor Industry Intellectual Property AlliancecoreElead Tech became a founding member and technology expert enterprise of the alliance, which is dedicated to enhancing industrial core competitiveness and maintaining industry interests through IP resource integration. GM Zhang Jingnan was officially appointed as an alliance technology expert.
- Shenzhen Semiconductor Industry AssociationcoreElead Tech Chairman Wei Xiaobing visited the Shenzhen Semiconductor Industry Association for exchanges on semiconductor industry development and technology cooperation. The association connects government and enterprises, promoting industry technical progress and innovation.
- WOW (Wafer-on-Wafer) Advanced Packaging Alliance - Tokyo Institute of TechnologycoreGM Zhang Jingnan serves as a member of the WOW Alliance organized by Professor Ohba Takayuki at Tokyo Institute of Technology. The alliance focuses on 3D packaging technology development including BBCube advanced packaging process using bumpless TSVs. Elead Tech acts as a bridge for international technology exchange, introducing cutting-edge thermal flow and air pressure technologies from the alliance to China.
- Hualong Microelectronics Co., Ltd. (华润微电子)coreElead Tech participated in a matchmaking exchange organized by the China Semiconductor Industry Association, visiting Hualong Microelectronics (世界500强第70位). Zhang Jingnan introduced Elead Tech's degassing product system and overall bubble solutions to Hualong Microelectronics and other member companies, receiving positive interest from attending enterprises.
Scale indicators7 records
Recent moves5 records
Expansion highlights6 records
Elead Tech competitors and assessment
Company assessmentBroad incumbents
- Kulicke & Soffa Industries: Major semiconductor and LED packaging equipment vendor with global customer overlap in advanced packaging and Mini/Micro LED — two of Elead Tech's core end markets. Comparable as a broad incumbent whose product roadmap could encroach on de-voiding/lamination.
- BE Semiconductor Industries (Besi): Leading supplier of assembly equipment for the semiconductor and hybrid industries, with strong positions in die bonding and advanced packaging. Directly competes for advanced packaging tool budgets and could bundle competing void-elimination or lamination capabilities into its portfolio.
- ASMPT (ASM Pacific Technology): Global leader in semiconductor packaging and assembly equipment. Comparable as a broad incumbent supplying OSATs and IDMs across die bonding, packaging, and adjacent process tools; competes for the same advanced packaging capex wallet that Elead Tech targets with its de-voiding and lamination systems.
- Tokyo Electron (TEL): One of the largest global semiconductor equipment makers, with established positions in deposition, etch, and coating that compete for the same wafer-level processing budgets. Relevant as a broad incumbent whose packaging-adjacent tools could substitute for Elead Tech's offerings.
- DISCO Corporation: Japanese leader in precision dicing, grinding, and related semiconductor processing equipment. Adjacent process tool provider to the same advanced packaging customers Elead Tech serves, with potential to extend into void-free lamination/dicing integration.
Direct peers
- SUSS MicroTec: Specialist in lithography, wafer bonding, and advanced packaging equipment. Directly comparable as a focused advanced-packaging equipment vendor competing in wafer-level bonding, coating, and lamination — the same process space where Elead Tech's WVL systems operate.
- Toray Engineering: Japanese equipment maker offering vacuum lamination and film processing systems used in semiconductor and display manufacturing. The most directly comparable peer to Elead Tech's wafer-level vacuum lamination product line, especially for NCF, DAF, and display-related applications.
- Shibaura Mechatronics:
Market position
Strengths1 record
Weaknesses5 records
Competitive moat4 records
Key risks7 records
Key highlights7 records
Customer concentration
Elead Tech social profiles
Digital presenceElead Tech financial estimates
Financial estimateRevenue estimate
Valuation estimate
Elead Tech leadership team
Management profileNumber of profiles
Profiles3 records
Elead Tech funding detail
Funding detailFunding overview
Funding rounds1 record
Investors2 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Elead Tech M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Elead Tech
What does Elead Tech do?
Elead Tech designs, manufactures and services proprietary de-voiding (defoaming) equipment and wafer-level vacuum film lamination systems used by semiconductor advanced-packaging manufacturers. Its De-Void System family (PCS, VPS, VPSA, PIS, PISA) and Wafer Vacuum Lamination family (WVLM, WVLS, WVLA) remove bubbles and voids from underfills, encapsulants, chip-bonding, OCA, IGBT potting, TSV and wafer-molding processes. Customers receive customized configuration, process testing, installation and full after-sales support.
Is Elead Tech a public or private company?
Elead Tech is a private company. It is classified as venture growth investor backed and is currently operating.
When was Elead Tech founded?
Elead Tech was founded in 2021.
Where is Elead Tech based?
Elead Tech is headquartered in Nanjing, China, in the Asia region.
How does Elead Tech make money?
Three revenue lines are on record. De-Voiding Equipment (Hardware Sales) is the primary driver. The others are customized Equipment Solutions and testing and Process Services.
Who are Elead Tech's main competitors?
Broad incumbents on record are Kulicke & Soffa Industries, BE Semiconductor Industries (Besi), ASMPT (ASM Pacific Technology), Tokyo Electron (TEL) and DISCO Corporation. Direct peers are SUSS MicroTec, Toray Engineering and Shibaura Mechatronics.
Does Elead Tech have an API?
No public API is recorded for Elead Tech.
What industry is Elead Tech in?
Elead Tech's product category is Semiconductor Packaging Equipment. Its primary akta.pro industry code is HDAHAEAG, Wafer Cleaning & Surface Preparation Equipment, with a secondary code of HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy). Its NAICS code is 333242 and its SIC code is 3600.