What 3dis Technologies does

3DiS Technologies is a French deep-tech company founded in 2014 by Ayad Ghannam (CEO/CTO) that develops 3D integration and wafer-level 3D packaging solutions for the semiconductor industry. The core technology portfolio comprises 3D Integrated Passive Devices (3D IPD), conformal peripheral 3D Interconnect, 3D Redistribution Layer (3D-RDL), and Wafer-Level 3D Packaging, all rooted in research originally conducted at the LAAS-CNRS laboratory. These capabilities enable the miniaturization of electronic systems and passive components (filters, couplers, baluns, inductors, transformers, 3D antennas) while shortening interconnect lengths and increasing integration density, with demonstrated technical milestones including 10:1 aspect-ratio thru-package-vias and ultra-thin 200μm QFN-like packages.

The company operates a services-led model spanning design and EM/RF simulation, custom development, prototyping, in-house small-volume production, and technology licensing to partners with volume production needs. It engages directly with enterprise clients across consumer electronics, medical, defense, and space verticals; named engagements include CNES and Thales Alenia Space (space/defense), NXP France (semiconductors), Ampleon (RF semiconductors), and equipment partners Besi and EV Group under the EU-funded EuroPAT-MaSiP consortium. The team is small and founder-led, anchored by co-founders Thierry Parra (LAAS-CNRS Professor, Scientific Adviser) and David Bourrier (electroplating specialist).

Name

3dis Technologies

Legal name

3DiS Technologies

Website

https://3dis-tech.com

Company type

Private

Founded year

2014

Operating status

Operating

Headcount range

1–10 employees

Short description

3DiS Technologies is a French deep-tech company founded in 2014 that develops wafer-level 3D packaging, 3D interconnect, and 3D-IPD technologies for semiconductor miniaturization, serving consumer, medical, defense, and space electronics clients via design, prototyping, small-volume production, and licensing services.

Ownership category

akta.pro rank

Product category

Semiconductor Advanced Packaging

NAICS

Semiconductor and Other Electronic Component Manufacturing (3344), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Additive Manufacturing & Connected 3D Printing (IMAIAMAL)

akta.pro secondary industry

Electronics & Industrial Component 3D Printing Services (enclosures, fixtures, functional parts) (IMAAADAL)

Keywords

• 3D integration packaging
• Wafer-level packaging
• Integrated passive devices
• Semiconductor packaging services
• 3D redistribution layer

Headquarters

HQ city

Labège

HQ country

France

HQ region

Europe

Offices2 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Technology or R&D, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Design & Simulation Services: EM simulation, RF measurement, and custom 3D IPD design services for clients
2. Development Services: Custom wafer-level packaging solutions and 3D IPD products (Filters, Baluns, etc.) development
3. Prototyping Services: Prototyping services based on 3D technology portfolio including MEMS packaging, 3D SiP, 3D IPD
4. Small Volume Production: In-house small-volume production for wafer-level 3D packaging services and 3D IPD
5. Technology Licensing: Innovative 3D technologies available for licensing to clients and partners with volume production needs

Go-to-market motion1 record

Distribution channels2 records

Marketing channels5 records

Core offering

3DiS Technologies provides proprietary 3D integration and 3D packaging technologies (3D IPD, 3D Interconnect, 3D-RDL, Wafer-Level 3D Packaging) that enable miniaturization of electronic systems and passive devices. These technologies are delivered to clients through design and simulation, custom development, prototyping, small-volume production, and technology licensing services targeting consumer, medical, defense, and space electronics applications.

Product overview

3DiS Technologies is a specialized provider of 3D integration and 3D packaging solutions based on its innovative 3D interconnection technologies. The company's portfolio consists of four core technology pillars: 3D Integrated Passive Device (3D IPD) for high-performance passive components, 3D Interconnect Technology for semiconductor connections, 3D Redistribution Layer (3D-RDL) for fine-pitch routing, and Wafer-Level 3D Packaging for stacked die integration. These technologies are delivered through a comprehensive service offering including Design & Simulation, Development, Prototyping, Small-Volume Production, and Technology Licensing. The company focuses on enabling miniaturization of electronic systems while improving performance through direct 3D integration and increased integration density, targeting applications in consumer, medical, defense, and space electronics.

Differentiator

Problem solved

Functional benefit

Products and services

• Design & Simulation Services Comprehensive design and simulation services for clients including EM simulation, RF measurement, system integration, packaging design, 3D electromagnetic simulation, and characterization of RF systems and devices. Aimed at clients needing custom 3D IPD design and electromagnetic analysis.
• Development Services Custom development of wafer-level packaging solutions and 3D IPD products (Filters, Baluns, etc.) tailored to client requirements, including MEMS packaging, packaging on special substrates, and 3D antennas. Targets clients with specific 3D packaging and passive component needs.
• Prototyping Services Prototyping services based on 3DiS's 3D technology portfolio, including MEMS packaging, 3D SiP, and 3D IPD. Supports clients from early-stage concept to functional prototypes.
• Small-Volume Production In-house small-volume production of wafer-level 3D packaging and 3D IPD products for clients requiring limited production runs before scaling.
• Technology Licensing Licensing of 3DiS's innovative 3D technologies to clients and partners with volume production needs, enabling partners to manufacture 3D-packaged products at scale.

Quantifiable outcome

• Multi-height, high aspect ratio TPVs (10:1) simultaneously with 3D-RDL
• +1 more outcomes

Named customers7 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Eleven partnerships are on record, tiered core and minor.

• AmpleoncoreStrategic or Co-development Partner · 1 January 2020RF semiconductor company collaboration for 3D RF SiP with stacked dies inside the package using dielectric-core-based HAR TPV technology
• NXP FrancecoreStrategic or Co-development Partner · 1 January 2019Collaboration under EuroPAT-MaSiIP project for ultra-thin QFN-like 3D Package development with 3D Integrated Passive Devices
• Besi NetherlandscoreStrategic or Co-development Partner · 1 January 2019EuroPAT-MaSiIP project partner contributing equipment and expertise for 3D packaging development
• Besi AustriacoreStrategic or Co-development Partner · 1 January 2019EuroPAT-MaSiIP project partner for advanced die placement and thin-cap molding development
• EV GroupcoreStrategic or Co-development Partner · 1 January 2019EuroPAT-MaSiIP project partner contributing bonding and debonding technology
• Centre National d'Etudes Spatiales (CNES)coreStrategic or Co-development PartnerSpace agency client and partner working on space electronics applications requiring advanced 3D packaging solutions
• Thales Alenia SpacecoreStrategic or Co-development PartnerAerospace and defense company partner for 3D packaging solutions in space applications
• LAAS-CNRScoreTechnology or IntegrationResearch laboratory partner where core 3D interconnect technology was developed; co-founder David Bourrier has extensive experience gained at LAAS-CNRS clean room
• Intraspec TechnologiesminorChannel Partner/ Reseller/ DistributorListed as client and partner in the 3D integration ecosystem
• Aerospace ValleyminorGTM or Marketing PartnerCompetitiveness cluster member for aerospace industry networking and collaboration
• SEMI AssociationminorGTM or Marketing PartnerIndustry association member for semiconductor and electronics manufacturing ecosystem engagement

Scale indicators3 records

Recent moves6 records

Expansion highlights5 records

Emerging players

• Deca Technologies: Deca Technologies specializes in fan-out wafer-level packaging (M-Series, Adaptive Patterning) for advanced semiconductor integration, overlapping with 3DiS's wafer-level 3D packaging and 3D-RDL process focus. Both target cost-effective 3D integration for chiplet and stacked-die architectures.
• Plan Optik: Plan Optik supplies precision glass and Si-based substrates used in advanced packaging and MEMS — adjacent to 3DiS's 3D integration materials. Listed as a 2020 3DInCites award competitor, making it a niche but technically comparable peer in Europe.

Broad incumbents

• ChipMOS Technologies: ChipMOS offers semiconductor packaging services including advanced and mixed-signal packages, overlapping end markets (consumer, RF, automotive) with 3DiS. Positioned as a broad incumbent in the OSAT competitive set.
• Amkor Technology: Amkor is a global OSAT offering advanced packaging including 3D TSV, wafer-level, and SiP services. While broader in scope than 3DiS, Amkor is the incumbent scale provider against which 3DiS's 3D IPD and wafer-level packaging compete for design wins in RF, 5G, and aerospace customer programs.
• ASE Technology Holding: ASE is the world's largest OSAT with extensive 3D/advanced packaging capacity (TSV, FOCoS, FOEB). 3DiS's 3D-RDL and wafer-level packaging targets workflows that ASE serves at scale, making ASE the dominant incumbent benchmark for adoption of any 3DiS-licensed processes.
• Powertech Technology (PTI): PTI is a leading Taiwanese OSAT providing 3D IC and advanced packaging services. Comparable to Amkor/ASE as a broad incumbent whose scale and customer relationships define the playing field for specialized 3D packaging entrants like 3DiS.

Others

• Yield Engineering Systems (YES): YES provides process equipment for advanced packaging, including temporary bonding and surface preparation for 3D integration. An equipment-side counterpart in the same 3D packaging value chain, also named alongside 3DiS in the 2020 3DInCites competition.
• CEA-Leti: CEA-Leti is a French semiconductor R&D lab developing 300mm 3D integration, FOWLP, and hybrid bonding. Listed alongside 3DiS as a competitor for the 2020 3DInCites Process of the Year; comparable in technological depth but positioned as a research/incubator rather than a licensing company.
• Imec: Imec's 3D packaging and chiplet programs (e.g., 3D SoC, CFET) compete for the same advanced packaging roadmaps 3DiS targets. Imec is broader and research-led, but represents the same European advanced-packaging ecosystem in which 3DiS operates.

Direct peers

• Xperi (Invensas/Ziptronix): Xperi's Invensas division develops advanced 3D interconnect and wafer-level packaging technologies (e.g., DBI, ZiBond), directly competing with 3DiS's conformal 3D interconnect and 3D-RDL offerings for stacked-die integration. Xperi was named alongside 3DiS in the 2020 3DInCites Process of the Year competition, underscoring direct comparability.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks7 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/3dis-technologies

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about 3dis Technologies