Unisem
- Company typePublic
- Founded1989
- HeadquartersSanta Clara, United States
- Headcount501–1,000
- GTM typeB2B
- OfferingHardware or Manufacturing
Unisem firmographics
Firmographics- Name
- Unisem
- Legal name
- Unisem (M) Berhad
- Website
- https://unisemgroup.com
- Company type
- Public
- Founded year
- 1989
- Operating status
- Operating
- Headcount range
- 501–1,000 employees
- Ownership category
- akta.pro rank
Unisem industry classification
Industry- Product category
- Semiconductor Assembly and Test Services (OSAT)
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441)
- SIC
- Services-Testing Laboratories (8734), Special Industry Machinery, Nec (3559)
- akta.pro primary industry
- Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)
- akta.pro secondary industries
- Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
Keywords
Where Unisem is headquartered
LocationHeadquarters
- HQ city
- Santa Clara
- HQ country
- United States
- HQ region
- North America
Offices3 records
Markets served
Unisem business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Infrastructure, Technology or R&D, Supply Chain, Marketing or Sales
Revenue model
- Semiconductor Assembly Services: Turnkey assembly services for leadless, laminate, leadframe and wafer level packages including package development, assembly, and drop shipping of finished goods.
- Semiconductor Testing Services: Full range of package testing services including analog, digital and mixed signal testing with over 100 test systems.
- Wafer Bumping Services: Wafer bumping services through subsidiary Unisem Advanced Technologies (UAT) offering gold, copper pillar and solder bumping options.
Go-to-market motion2 records
Distribution channels1 record
Marketing channels4 records
Unisem product offering
Product offeringCore offering
Unisem is a global outsourced semiconductor assembly and test (OSAT) provider offering full turnkey packaging and test services. It manufactures and packages integrated circuits for fabless and IDM customers across multiple package families (leadframe, laminate, leadless, MEMS, and wafer-level), complemented by wafer bumping, wafer probing, final test, reliability/failure analysis, warehousing, and drop shipment to OEMs.
Product overview
Unisem is a global provider of semiconductor assembly and test services offering an integrated suite of packaging and test solutions. The product portfolio consists of multiple package types including Leadframe Packages (PDIP, QSOP, SOIC, SSOP, TSOT, TSSOP with 3-484+ pins), Laminate Packages (FBGA/LGA, MCM/SIP, Stacked Die BGA), Leadless Packages (SLP, SLP SIP, Stacked Die SLP, MIS QFN), MEMs Packaging (LGA-FLP, LGA-MCP, LGA-MLP), and Wafer Level Chip Scale Packaging (WLCSP). These are complemented by comprehensive turnkey services including wafer bumping, wafer probing, wafer grinding, assembly, test, reliability testing, failure analysis, and drop shipment capabilities. Unisem operates manufacturing facilities in Ipoh, Malaysia and Chengdu, China, with over 1.5 million square feet of factory floor space and more than 540,000 square feet of clean rooms.
Differentiator
Problem solved
Functional benefit
Products and services
- Leadframe Packages
Quantifiable outcome
- 1 billion packaged MEMS devices shipped by July 2016
Companies that use Unisem
Customer profileNamed customers11 records
Segments4 records
Ideal customer profiles4 records
Unisem technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
Unisem partnerships and signals
Strategic signalPartnerships
Seven partnerships are on record, tiered core.
- Malaysia Advanced Packaging Consortium (MAPC)coreFive local companies including Unisem forming the Malaysia Advanced Packaging Consortium to upgrade Malaysia's semiconductor industry into higher-value advanced packaging activities. The initiative has government-approved R&D grant of RM92 million over 24 months with industry contributing RM93 million, totaling RM185 million investment. Targets advanced testing, precision automation, photonics integration, and chiplet design support capabilities.
- InaricoreCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem, MPI, and other Malaysian semiconductor companies targeting advanced packaging capabilities
- MPIcoreCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies targeting advanced packaging capabilities
- Skyechip BhdcoreCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) targeting chip design operations expansion with planned RM352 million IPO
- FusionAPcoreCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies
- PentamastercoreCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies
- NSW AutomationcoreCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies
Scale indicators11 records
Recent moves9 records
Expansion highlights4 records
Unisem competitors and assessment
Company assessmentBroad incumbents
- ASE Technology Holding: Largest global OSAT with end-to-end assembly, test, and advanced packaging (fan-out, 2.5D/3D, SiP). Comparable to Unisem as the global benchmark OSAT; Unisem operates in the same broad back-end services category but at smaller scale and without ASE's leading-edge advanced-pack leadership.
- Amkor Technology: US-headquartered OSAT and key competitor across test, flip-chip BGA, advanced packaging, and SiP. Amkor's TSMC Arizona adjacency strategy mirrors what Unisem hopes to capture via MAPC; both serve fabless/IDM customers on outsourced back-end workflows.
Direct peers
- Tianshui Huatian Technology: China's largest OSAT and a strategic shareholder of Unisem via Huatian (Malaysia/Hong Kong) entities. Operates the same back-end assembly and test service portfolio as Unisem and provides the technology pipeline underpinning Unisem's advanced-packaging expansion.
- JCET Group: Chinese OSAT offering turnkey assembly and test across leadframe, laminate, WLCSP, and fan-out packaging. Closest direct competitor to Unisem among mainland-China OSATs and competes with Unisem in Chengdu-adjacent customer accounts.
- UTAC Holdings: Singapore-headquartered OSAT offering analog, mixed-signal, RF, and power semiconductor test and assembly services. Comparable product breadth and serves many of the same automotive and industrial customers as Unisem.
- Powertech Technology: Taiwan-listed OSAT providing memory and logic packaging/test services, including bumping and wafer-level packaging. Overlaps with Unisem in leadframe/laminate BGA test services for fabless customers and competes for the same advanced-packaging roadmap.
- Inari Amertron: Malaysian OSAT co-beneficiary of MAPC alongside Unisem. Operates turnkey assembly and test services for RF/wireless semiconductors with the same Penang-based operating footprint, making it the most directly comparable domestic peer.
- ChipMOS Technologies: Taiwanese OSAT focused on test, assembly, and packaging for memory, display drivers, and mixed-signal semiconductors. Direct competitor in laminate/leadframe test services with overlapping customer base among Asian fabless companies.
- Malaysian Pacific Industries (MPI): Malaysian OSAT serving test, assembly, and packaging for automotive, industrial, and consumer semis. Another MAPC co-beneficiary and the closest regional peer in the Ipoh/Penang corridor.
Others
- Cohu: US-headquartered semiconductor test handler and contactor supplier serving OSAT customers including Unisem. Not a direct competitor but an ecosystem peer — Unisem uses comparable test platforms (and just hosted the first locally assembled AccoTEST tester in Penang).
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
Unisem social profiles
Digital presenceUnisem financial estimates
Financial estimateRevenue estimate
Valuation estimate
Unisem leadership team
Management profileNumber of profiles
Profiles10 records
Unisem subsidiaries and ownership
Company hierarchySubsidiaries3 records
Unisem funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Unisem M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Unisem
What does Unisem do?
Unisem is a global outsourced semiconductor assembly and test (OSAT) provider offering full turnkey packaging and test services. It manufactures and packages integrated circuits for fabless and IDM customers across multiple package families (leadframe, laminate, leadless, MEMS, and wafer-level), complemented by wafer bumping, wafer probing, final test, reliability/failure analysis, warehousing, and drop shipment to OEMs.
Is Unisem a public or private company?
Unisem is a public company. It is classified as public and is currently operating.
When was Unisem founded?
Unisem was founded in 1989. It employs 501 to 1,000 people.
Where is Unisem based?
Unisem is headquartered in Santa Clara, United States, in the North America region.
How does Unisem make money?
Three revenue lines are on record. Semiconductor Assembly Services are the primary driver. The others are semiconductor Testing Services and wafer Bumping Services.
Who are Unisem's main competitors?
Broad incumbents on record are ASE Technology Holding and Amkor Technology. Direct peers are Tianshui Huatian Technology, JCET Group, UTAC Holdings, Powertech Technology, Inari Amertron, ChipMOS Technologies and Malaysian Pacific Industries (MPI). Cohu is listed as an others.
Does Unisem have an API?
No public API is recorded for Unisem.
What industry is Unisem in?
Unisem's product category is Semiconductor Assembly and Test Services (OSAT). Its primary akta.pro industry code is HDAHADAJ, Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey), with a secondary code of HDAHADAA, Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA). Its NAICS code is 33441 and its SIC code is 8734.