What Pentamaster Corporation Berhad does

Pentamaster Corporation Berhad is a Malaysia-headquartered automation manufacturing and technology solutions provider, founded in 1991 and publicly listed on Bursa Malaysia (stock code 7160), with operations spanning semiconductor, medical device, and industrial factory automation markets. The company designs and builds custom precision automation equipment, AI-enabled vision inspection systems, and integrated factory automation platforms, including i-Flex (Micro AI Automation for micrometer-scale precision), i-ARMS (manufacturing execution system integration), SCOOT-CAR (warehouse automation delivering approximately 40% floor-space savings), and the AI-powered ZANX-2000 wafer automated optical inspection system with sub-micron defect detectability. Its newest platform, the Samurai Series, targets 5-10 micron precision in advanced semiconductor packaging and is being prepared for end-2026 launch with a 2027 production ramp. Pentamaster is a member of the Malaysia Advanced Packaging Consortium, a five-company initiative supported by the Ministry of Science, Technology and Innovation Malaysia.

The company generates revenue through design, manufacture, and integration of custom automation systems sold to multinational OEMs and device manufacturers across semiconductor (Dell, Knowles, Unisem, Asyst, National Instruments, and a major GPU/CPU customer), medical devices (Dexcom and others), automotive, food and beverage, solar, and poultry verticals. In Q2 2026, revenue reached RM180.9 million (+24.8% YoY) with net profit of RM19 million (+64% YoY), supported by an order book of RM480-550 million, of which approximately 20% relates to AI applications. The company holds ISO 13485:2016 and ISO 9001:2015 certifications and maintains direct sales and service offices in the USA, Japan, Germany, Singapore, Vietnam, Taiwan, and China.

Name

Pentamaster Corporation Berhad

Legal name

Pentamaster Corporation Berhad

Website

https://pentamaster.com

Company type

Public

Founded year

1991

Operating status

Operating

Short description

Pentamaster Corporation Berhad is a Malaysia-based automation manufacturing and technology solutions provider serving semiconductor, medical device, and industrial customers globally through custom precision automation, AI-powered inspection systems, and integrated factory automation platforms.

Ownership category

akta.pro rank

Product category

Semiconductor Automation Equipment

NAICS

Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables (334513), Industrial Machinery Manufacturing (3332), Industrial Machinery Manufacturing (33324)

SIC

Industrial Instruments For Measurement, Display, And Control (3823), Special Industry Machinery (No Metalworking Machinery) (3550), Special Industry Machinery, Nec (3559)

akta.pro primary industry

Factory Automation Cells & Integrated Systems (Assembly, Welding, Painting Lines) (IMAHAHAL)

akta.pro secondary industries

Industrial Controllers & Control Systems (PLCs, PACs, CNC Controllers) (IMAHAHAH), Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware) (IMAGAGAK), Filling & Dosing Machines (Liquid/Powder/Solid) (IMAHAOAF)

Keywords

• Semiconductor automation equipment
• Automated test equipment
• Factory automation solutions
• Advanced packaging systems
• Warehouse automation solutions

Headquarters

HQ city

Bayan Lepas

HQ country

Malaysia

HQ region

Asia

Offices9 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales

Revenue model

1. Automated Test Equipment (ATE): Customized test equipment including turret test handlers, gravity feed test handlers, linear pick & place handlers, and vision inspection systems for semiconductor discrete & IC testing.
2. Factory Automation Solutions: Comprehensive factory automation including i-ARMS systems, warehouse automation, and industrial robotics solutions for various manufacturing sectors. Near-doubling of revenue to RM121 million in Q2 2026.
3. Healthcare/Medical Device Automation: Medical device automation technology solutions including assembly, testing, and manufacturing automation for medical devices. More than 20-fold surge in healthcare segment revenue to RM20.4 million in Q2 2026.
4. Machine & Product Contract Manufacturing: Build-to-print equipment manufacturing services for complex machines including design, fabrication, supply chain sourcing, assembly, testing, and site commissioning.
5. Advanced Packaging Solutions: Advanced semiconductor packaging equipment including Samurai Series for AI chip applications, wafer-level inspection, and system-level testing solutions.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels4 records

Core offering

Pentamaster designs, manufactures and sells advanced automation equipment for semiconductor, medical device, automotive and factory automation industries. Its portfolio spans automated test handlers, wafer-level inspection, burn-in systems, AI-powered optical inspection (ZANX-2000), advanced packaging machines (Samurai Series), factory automation systems (i-ARMS), warehouse automation and contract manufacturing of build-to-print complex machinery.

Product overview

Pentamaster Corporation Berhad is a leading provider of advanced automation manufacturing and technology solutions established in 1991 in Penang, Malaysia. The company offers a comprehensive portfolio of products organized into eight core solution areas: (1) Discrete & Integrated Circuits Solutions covering turret test handlers, gravity feed systems, linear pick & place handlers, and automated vision inspection systems; (2) Electro-Optical/MEMS Sensors Solutions including active alignment assembly equipment (Queen-AAC, Queen-AAD, Queen-AAP, Queen-AAL) and test/burn-in solutions; (3) SiC | GaN | Power Modules Solutions for assembly, inspection, burn-in, and testing; (4) Advanced Packaging Solutions (Samurai Series) for AI semiconductor technology with 5-10 micron precision; (5) Factory Automation via the i-ARMS system with MES (i-MEX); (6) Warehouse Automation including SCOOT-CAR, Mini Stocker, and shuttle systems; (7) Micro AI Automation combining micrometer-scale precision with i-Flex AI; and (8) Machine & Product Contract Manufacturing services. The portfolio serves semiconductor, medical devices, automotive, food & beverage, and renewable energy industries globally.

Differentiator

Problem solved

Functional benefit

Brands

• i-ARMS: intelligent-Automated Robotics Manufacturing System - a fully integrated system combining material handling equipment and advanced technologies into a single customizable production line for various industries.
• Samurai Series

Products and services

• Discrete & Integrated Circuits Test and Inspection Equipment Comprehensive semiconductor test, inspection, laser marking and vision inspection equipment (turret test handlers, gravity feed systems, linear pick & place handlers, wafer-level die sorters, automated vision inspection systems) used by semiconductor manufacturers for discrete and IC final test, vision inspection and packaging processes.
• Electro-Optical / MEMS Sensors Assembly and Test Equipment Active alignment assembly equipment (Queen-AAC, Queen-AAD, Queen-AAP, Queen-AAL), wafer/module-level test handlers (Trooper-T, GIDEON) and burn-in solutions for VCSEL, LED and MEMS sensor manufacturers producing optical, projection and lighting components.
• SiC / GaN / Power Modules Manufacturing Equipment End-to-end assembly, AOI, burn-in and test solutions for silicon carbide, gallium nitride and power module manufacturers, including laser marking/welding handlers, DBC/AMB segregation and placement, ultrasonic welding, wafer-level probers, KGD die-level test handlers and wafer-level burn-in systems.
• Samurai Series Advanced Packaging Equipment Next-generation advanced packaging machines for AI chip applications offering 5-10 micron precision versus 100 microns for conventional equipment, designed for AI semiconductor manufacturers.
• Advanced Packaging Solutions Suite of advanced packaging equipment for AI semiconductor technology including wafer-level 2D+3D inspection, SiPh probing and test, 3D X-ray inspection, die-level chiplet prober, HPC burn-in and system-level test solutions.
• i-ARMS Intelligent-Automated Robotics Manufacturing System Fully integrated factory automation system combining material handling equipment (conveyors, industrial lifters, robots, AGVs), vision systems, sensors, RFID and the proprietary i-MEX Manufacturing Execution System (MES) for custom production lines across automotive, semiconductor, medical, F&B, consumer products, renewable energy and poultry sectors.
• i-MEX Manufacturing Execution System Proprietary MES software providing real-time monitoring of production processes with process tracking, traceability, flow control and paperless workflow, integrated within the i-ARMS automation platform.
• Warehouse Automation Solutions Automated storage and retrieval systems including SCOOT-CAR pallet storage, Mini Stocker ASRS, high-speed sortation, auto storage dry cabinet and 4-way shuttle systems for warehousing and distribution customers across multiple industries.
• Micro AI Automation (i-Flex) Combines micro automation for micrometer-scale precision handling with i-Flex AI for real-time detection, alignment and decision-making, including micro grippers, vacuum handling, AI path planning and real-time 3D vision inspection for micro-component manufacturing.
• Machine & Product Contract Manufacturing Turnkey build-to-print equipment manufacturing services for complex machines including design, supply chain management, fabrication, assembly, testing, factory acceptance test and site acceptance test for industrial customers.
• ZANX-2000 Advanced Wafer AOI System AI-powered wafer automated optical inspection system with sub-micron detectability, AI defect classification, macro inspection (240µm min) and micro inspection (0.5µm min) for wafer-level inspection customers.
• Trooper-BI8-G Octa Chuck SiC Wafer-Level Burn-in System Automated octa chuck burn-in system supporting simultaneous burn-in of 8 wafers with up to 32,000 channels, processing up to 1,304 wafers in 24 hours for SiC and power module manufacturers.
• Queen-AAC Active Alignment Collimator Assembly Equipment High precision active alignment equipment for assembling laser and lens modules into collimator modules with up to 4 active alignment sites, serving optical module and MEMS sensor manufacturers.
• EV Automation (EVA) Solutions Complete turnkey automation solutions for electric vehicle manufacturers covering battery cells/modules/packs, electric transmission and electric axles, including welding and smart assembly for EV OEMs.

Quantifiable outcome

• 64% increase in net profit for Q2FY2026
• +5 more outcomes

Named customers7 records

Segments6 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability7 records

Feature6 records

Partnerships

Five partnerships are on record, tiered core.

• Malaysia Advanced Packaging ConsortiumcoreStrategic or Co-development Partner · 8 May 2026Five Malaysian companies (Inari Amertron, Pentamaster, NSW Automation, SkyeChip, and FusionAP) formally launched the Malaysia Advanced Packaging Consortium at SEMICON Southeast Asia 2026, targeting 7% of global advanced packaging market by 2035. The consortium's initial project is an HBM4 pilot line.
• Inari AmertroncoreStrategic or Co-development PartnerPartner in Malaysia Advanced Packaging Consortium targeting advanced packaging market. Inari Amertron is a Malaysian semiconductor company specializing in test and assembly services.
• FusionAPcoreStrategic or Co-development PartnerCentral partner in Malaysia Advanced Packaging Consortium requiring approximately RM400 million in funding for HBM4 pilot line development.
• NSW AutomationcoreStrategic or Co-development PartnerPartner in Malaysia Advanced Packaging Consortium focused on advanced packaging solutions for AI semiconductor applications.
• SkyeChipcoreStrategic or Co-development PartnerPartner in Malaysia Advanced Packaging Consortium developing advanced packaging capabilities for Malaysian semiconductor industry.

Scale indicators11 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• ASMPT: ASMPT is the global leader in semiconductor assembly and packaging equipment, directly competing with Pentamaster in advanced packaging, wire bonding, and die bonding. Both companies serve the same OSAT and IDM customers across logic, memory, and power semiconductor segments, with ASMPT being substantially larger but operating in the same core equipment categories.
• Cohu: Cohu is a semiconductor test handling equipment manufacturer with overlapping products in turret test handlers, gravity feed handlers, and pick-and-place handlers that directly compete with Pentamaster's PM31/PM35/PM38 series. Both companies target the same semiconductor test customers globally with comparable equipment architectures.
• FormFactor: FormFactor is a US-based semiconductor test and measurement equipment provider competing with Pentamaster in wafer-level probing, test handlers, and inspection systems. Both companies serve semiconductor manufacturers needing precision test and measurement solutions for advanced packaging, with FormFactor having stronger presence in the US and Pentamaster stronger in Asia.
• BE Semiconductor Industries (Besi): Besi is a Dutch semiconductor assembly equipment specialist competing directly with Pentamaster in die bonding, advanced packaging, and hybrid bonding for AI/HBM applications. Both companies target the high-end advanced packaging segment for AI chips and HBM stacks, with Besi currently holding technology leadership in hybrid bonding that Pentamaster's Samurai Series seeks to challenge.
• Kulicke & Soffa Industries: Kulicke & Soffa is a major semiconductor and LED assembly equipment provider with overlapping product lines in wire bonding, advanced packaging, and test. Both companies serve global semiconductor manufacturers, with K&S having a broader portfolio and longer track record in advanced packaging, while Pentamaster differentiates through its integrated automation solutions.
• Inari Amertron Berhad: Inari Amertron is a Malaysian peer in the semiconductor back-end equipment and OSAT services market, and a co-partner with Pentamaster in the Malaysia Advanced Packaging Consortium. Both companies serve global semiconductor customers from Malaysia and target RF, optoelectronics, and advanced packaging opportunities, making them direct competitors for Malaysian semiconductor ecosystem opportunities.

Emerging players

• Universal Robots / Teradyne Robotics: Universal Robots is a leading collaborative robot manufacturer whose products overlap with Pentamaster's i-ARMS factory automation platform in the robotics integration space. While Universal Robots focuses on the cobot segment and Pentamaster on integrated factory automation systems, both compete for factory automation budgets across manufacturing customers globally.

Broad incumbents

• Disco Corporation: Disco is a Japanese semiconductor back-end equipment manufacturer specializing in dicing, grinding, and polishing equipment that serves as a broader incumbent in the semiconductor packaging equipment value chain. While Disco's product portfolio is narrower than Pentamaster's, both companies serve advanced semiconductor packaging customers and compete for capex budgets at OSAT and IDM customers.
• Teradyne: Teradyne is a major US-based semiconductor automatic test equipment (ATE) manufacturer serving logic, memory, and analog test markets. While Pentamaster focuses more on test handlers and packaging, both companies serve the broader semiconductor test ecosystem and often partner with each other to deliver complete test solutions to manufacturers.
• Yaskawa Electric: Yaskawa is a global Japanese industrial automation and robotics giant with significant overlap with Pentamaster's factory automation business through servo motors, motion control, and industrial robots. While Yaskawa operates at much larger scale across multiple industrial verticals, both companies compete for factory automation integration projects in semiconductor, automotive, and electronics manufacturing.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/pentamaster-corporation-berhad

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Pentamaster Corporation Berhad