Silicon Box
Silicon Box is a Singapore-based advanced semiconductor integration service provider specializing in panel-level packaging and chiplet integration via its proprietary SiPlet® technology. It serves enterprise customers in AI/HPC, automotive, mobile, IoT, robotics, and space technology through custom foundry services.
- Company typePrivate
- Founded2021
- HeadquartersSingapore, Singapore
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Silicon Box does
Silicon Box is a Singapore-headquartered advanced semiconductor integration service provider founded in May 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. The company specializes in panel-level packaging (PLP) and chiplet integration through its proprietary SiPlet® technology platform, which features sub-5 micron interconnect capability and large-format panels delivering more than 6x the productive area of standard 300mm wafers. Silicon Box operates a $2 billion, 73,000 sqm flagship foundry in Singapore that commenced commercial shipments in January 2024 and has cumulatively shipped over 250 million units at a record 99.7% wafer-scale yield, and is constructing a second €3.2 billion facility in Novara, Italy, targeting 2028 production. The company has achieved Open EU Foundry status under the European Chips Act and received €1.3 billion in approved Italian state aid for the European expansion.
The company generates revenue through contract manufacturing fees for advanced semiconductor packaging and end-to-end chiplet design-to-production services, priced via custom enterprise quotes on multi-year engagements. Silicon Box sells directly to enterprise customers across six target end-markets: AI and HPC, automotive, mobile and consumer electronics, IoT and robotics, and space technology, with the automotive segment growing at 436% annualized in Q1 2026 following receipt of an IATF 16949 Letter of Conformance. It is a member of imec's Automotive Chiplet Program alongside 22+ partners including GlobalFoundries, Infineon, STATS ChipPAC, and TIER IV, and its technology is designed to comply with BoW and UCle chiplet interconnect standards.
The go-to-market is direct enterprise field sales with upfront co-design collaboration, supported by a strong investor base including EDBI, Tata Electronics, Ares Management, Hillhouse Investment, NEA, TDK Ventures, Intel Capital, Maverick Capital, and the three co-founders. The company has raised over $500 million across SAFE, Series A, Series B, Series B2, and debt tranches to reach unicorn status at a $1B+ valuation in January 2024. Customer-facing certifications include ISO 9001:2015, ISO 14001:2015, and ISO 45001:2018, with full IATF 16949 automotive certification expected imminently.
Silicon Box firmographics
Firmographics- Name
- Silicon Box
- Legal name
- Silicon Box Pte Ltd
- Website
- https://silicon-box.com
- Company type
- Private
- Founded year
- 2021
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Short description
- Silicon Box is a Singapore-based advanced semiconductor integration service provider specializing in panel-level packaging and chiplet integration via its proprietary SiPlet® technology. It serves enterprise customers in AI/HPC, automotive, mobile, IoT, robotics, and space technology through custom foundry services.
- Ownership category
- akta.pro rank
Silicon Box industry classification
Industry- Product category
- Advanced Semiconductor Packaging and Foundry
- NAICS
- Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Other Electronic Component Manufacturing (3344)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
- akta.pro secondary industries
- Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC), Silicon IP Subsystems & Chiplet IP (Die-to-Die, UCIe, NoC, I/O chiplets) (HDAHAFAH), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)
Keywords
Where Silicon Box is headquartered
LocationHeadquarters
- HQ city
- Singapore
- HQ country
- Singapore
- HQ region
- Asia
Offices3 records
Markets served
Silicon Box business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Infrastructure, Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales
Revenue model
- Advanced Semiconductor Packaging Services: Contract manufacturing for advanced semiconductor packaging and chiplet integration. Revenue generated through manufacturing fees for AI processors, general processors, HPC, RF frontend, power management modules, analog and motor drives. Q1 2026 revenue already at three-quarters of 2025's full-year total.
- Chiplet Integration Services: End-to-end chiplet design and manufacturing services from initial design to final manufacturing of chiplets
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Enterprise custom packaging solutions |
Go-to-market motion1 record
Distribution channels2 records
Marketing channels5 records
Silicon Box product offering
Product offeringCore offering
Silicon Box is an advanced semiconductor integration service provider offering a unified platform for chiplet-based system integration, from initial design to final manufacturing. The company's core offering is its proprietary SiPlet® panel-level packaging (PLP) technology with sub-5 micron interconnects, delivered through contract manufacturing at its Singapore foundry. Services include collaborative and flexible design, IC integration and interconnection, high-yield large-format manufacturing, and ecosystem collaboration with co-designing partners, advanced materials suppliers, and key equipment suppliers, serving AI, HPC, data centers, automotive, mobile, IoT, robotics, and space tech sectors globally.
Product overview
Silicon Box is an advanced semiconductor integration service provider offering a unified platform for chiplet-based system integration. The company provides end-to-end solutions from initial design to final manufacturing of chiplets, with its proprietary SiPlet® technology and panel-level packaging solutions as the core offerings. Services include collaborative and flexible design, fine design-rule solutions in compliance with BoW & UCle standards, IC integration and interconnection using sub-5 micron technology, high-yield large format manufacturing, and ecosystem collaboration with co-designing partners, advanced materials suppliers, and key equipment suppliers. The company operates manufacturing facilities in Singapore (flagship, 73,000 sqm) and is expanding to Novara, Italy (€3.2B investment) to serve AI, HPC, data centers, automotive, mobile, IoT, robotics, and space tech sectors globally.
Differentiator
Problem solved
Functional benefit
Products and services
- SiPlet® Technology Platform
- Advanced Panel-Level Packaging Foundry Services
- End-to-End Chiplet Design and Manufacturing Services
Quantifiable outcome
- Reduces chiplet-based system packaging costs by up to 90%
- +4 more outcomes
Companies that use Silicon Box
Customer profileNamed customers4 records
Segments5 records
Ideal customer profiles4 records
Silicon Box technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
Silicon Box partnerships and signals
Strategic signalPartnerships
Six partnerships are on record, tiered strategic and core.
- GlobalFoundriesstrategicJoined Imec ACP as foundry partner alongside Silicon Box, Infineon, STATS ChipPAC, and TIER IV. Contributing manufacturing capabilities and global fab footprint across US, Europe, and Asia.
- InfineonstrategicSemiconductor company committed to Imec ACP for chiplet architecture adoption in automotive applications.
- STATS ChipPACstrategicSemiconductor company committed to Imec ACP alongside Silicon Box for automotive chiplet development.
- TIER IVstrategicAutonomous driving technology developer committed to Imec ACP for ADAS and autonomous driving chiplet solutions.
- Imec Automotive Chiplet Program (ACP)coreCollaborative research initiative with 22+ partners across automotive value chain. Silicon Box contributes chiplet interconnection expertise including consulting on optimal chiplet architecture and turnkey advanced packaging solutions. Products expected to reach production by 2028.
- Tata ElectronicsstrategicStrategic investor and partner in semiconductor ecosystem; participated in Series A funding alongside co-founders.
Scale indicators11 records
Recent moves7 records
Expansion highlights6 records
Silicon Box competitors and assessment
Company assessmentBroad incumbents
- GlobalFoundries: Major US-based foundry offering advanced packaging including 2.5D/3D and RF packaging for automotive and industrial. GlobalFoundries joined Imec's Automotive Chiplet Program alongside Silicon Box, indicating direct overlap in automotive chiplet service offerings despite GlobalFoundries' primary focus on wafer fabrication.
- Intel Foundry: Intel's foundry business offers Foveros 3D advanced packaging and EMIB, targeting AI/HPC chiplet workloads. Intel Foundry competes with Silicon Box for advanced packaging capacity and is also an investor (Intel Capital listed as a Silicon Box backer), making this a partial strategic overlap rather than pure competition.
- TSMC: Largest pure-play foundry with industry-leading CoWoS advanced packaging for AI/HPC customers including NVIDIA. While TSMC is primarily a wafer foundry, its advanced packaging business competes for the same chiplet integration workloads and is the dominant alternative to Silicon Box's PLP-based services for leading-edge AI customers.
Direct peers
- JCET Group: Chinese OSAT leader that acquired STATS ChipPAC, where Silicon Box's CEO previously led. JCET offers advanced packaging including fan-out and chiplet integration, competing in similar end markets and with overlapping customer relationships in mobile and automotive.
- Hana Microelectronics: Thailand-based OSAT offering IC assembly and test services including QFN and advanced packaging for automotive, industrial, and consumer applications. A smaller-scale but directly comparable peer in advanced packaging services with similar automotive IATF certification requirements.
- Amkor Technology: One of the world's largest OSAT providers offering advanced packaging including 2.5D/3D and fan-out wafer-level packaging. Directly comparable as Silicon Box's leadership team (CEO Dr. BJ Han, COO JH Yee, CTO Billy Ahn) all previously held senior roles at Amkor, and Amkor competes head-on in advanced packaging services for AI, HPC, and automotive customers.
- Powertech Technology: Taiwan-based OSAT provider offering advanced packaging services including fan-out wafer-level packaging and chip-on-wafer-on-substrate (CoWoS) variants. Directly comparable as a peer in the advanced packaging services market serving mobile, AI, and automotive segments.
- ASE Technology Holding: Largest global OSAT provider offering advanced packaging (FOCoS, TSV-based) for AI, HPC, mobile, and automotive. ASE competes directly with Silicon Box in advanced packaging services, with substantially greater scale, customer base, and process maturity.
- SPIL (Siliconware Precision Industries): Taiwanese OSAT provider now consolidated under ASE Technology, offering advanced packaging including fan-out and chip-on-wafer technologies. SPIL/ASE competes directly in advanced packaging services across mobile, AI, and automotive end markets.
Emerging players
- Deca Technologies: US-based startup specializing in fan-out wafer-level packaging (FOWLP) and M-Series adaptive patterning for chiplet and heterogeneous integration applications. Closely comparable as a smaller, technology-focused advanced packaging specialist targeting similar chiplet integration workloads as Silicon Box.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat6 records
Key risks5 records
Key highlights7 records
Customer concentration
Silicon Box social profiles
Digital presenceSilicon Box compliance and trust
Trust signalCompliance5 records
Silicon Box financial estimates
Financial estimateRevenue estimate
Valuation estimate
Silicon Box leadership team
Management profileNumber of profiles
Profiles8 records
Silicon Box funding detail
Funding detailFunding overview
Funding rounds7 records
Investors20 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Silicon Box M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Silicon Box
What does Silicon Box do?
Silicon Box is an advanced semiconductor integration service provider offering a unified platform for chiplet-based system integration, from initial design to final manufacturing. The company's core offering is its proprietary SiPlet® panel-level packaging (PLP) technology with sub-5 micron interconnects, delivered through contract manufacturing at its Singapore foundry. Services include collaborative and flexible design, IC integration and interconnection, high-yield large-format manufacturing, and ecosystem collaboration with co-designing partners, advanced materials suppliers, and key equipment suppliers, serving AI, HPC, data centers, automotive, mobile, IoT, robotics, and space tech sectors globally.
Is Silicon Box a public or private company?
Silicon Box is a private company. It is classified as venture growth investor backed and is currently operating.
When was Silicon Box founded?
Silicon Box was founded in 2021. It employs 101 to 250 people.
Where is Silicon Box based?
Silicon Box is headquartered in Singapore, Singapore, in the Asia region.
How does Silicon Box make money?
Two revenue lines are on record. Advanced Semiconductor Packaging Services are the primary driver. The others are chiplet Integration Services.
Who are Silicon Box's main competitors?
Broad incumbents on record are GlobalFoundries, Intel Foundry and TSMC. Direct peers are JCET Group, Hana Microelectronics, Amkor Technology, Powertech Technology, ASE Technology Holding and SPIL (Siliconware Precision Industries). Deca Technologies is listed as an emerging player.
Does Silicon Box have an API?
No public API is recorded for Silicon Box.
What industry is Silicon Box in?
Silicon Box's product category is Advanced Semiconductor Packaging and Foundry. Its primary akta.pro industry code is HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets), with a secondary code of HDAHADAC, Wafer-Level Packaging (WLP) & Redistribution (RDL). Its NAICS code is 334413 and its SIC code is 3674.