What Tlmi Corporation does

TLMI Corporation is an Austin, Texas-based, employee-owned contract manufacturer specializing in wafer bumping and pad redistribution services for flip chip interconnect applications. Founded in September 2002, the company operates a single facility in Austin and targets North American semiconductor manufacturers — including integrated device manufacturers (IDMs) and fabless firms — that need prototype development, initial production ramps, and specialty bumping for advanced packaging. The company holds AS9100D, ISO 9001:2015, and ITAR registrations, qualifying it for aerospace, defense, and other regulated end-markets.

The core technology is electroplating-based bumping across multiple metallurgies — solder, gold (99.9+% purity), copper (with stacked capability up to 250 microns tall), and indium — with fine pitch capability under 100 microns. TLMI complements its bumping services with pad redistribution (RDL) using aluminum, copper/nickel, copper experimental, and gold trace materials, plus in-house mask layout/procurement and outsourced backgrinding, dicing, and pick & place via partner networks. The stated process advantages relative to C4 (controlled collapse chip connection) include lower cost, higher throughput, and flexible thickness/composition combinations.

Revenue is generated through quote-based, project-driven contract services rather than recurring subscriptions. Pricing is not publicly disclosed, and the go-to-market is sales-led with direct outreach, a website presence (tlmicorp.com), and industry reputation as the primary acquisition channels. The company's lifecycle positioning — supporting customers from prototype through transfer to high-volume bumping partners — creates an embedded advisory role within the customer development cycle, though no named customers, revenue figures, or contracted volumes are publicly disclosed.

Name

Tlmi Corporation

Legal name

TLMI Corporation

Website

https://tlmicorp.com

Company type

Private

Founded year

2002

Operating status

Operating

Headcount range

11–50 employees

Short description

TLMI Corporation is an Austin, Texas-based contract wafer bumping and pad redistribution service provider, offering electroplating-based solder, gold, copper, and indium bumping for North American semiconductor manufacturers requiring prototype development, initial production ramps, and specialty flip chip interconnect applications.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Services

akta.pro primary industry

Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC)

akta.pro secondary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• Wafer bumping
• Semiconductor packaging
• Flip chip bumping
• Pad redistribution
• Electroplating services

Headquarters

HQ city

Austin

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain

Revenue model

1. Wafer Bumping Services: TLMI provides contract wafer bumping services including solder, gold, copper, and indium bumping, as well as pad redistribution and mask layout services. Revenue is generated through one-time service fees for bumping operations, with focus on prototype development and initial production ramps for semiconductor manufacturers.
2. Custom Engineering Services: Offers specialty bumping services and custom requirements for flip chip interconnect applications requiring high engineering skill, as well as mask layout and procurement services.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

TLMI Corporation provides contract wafer bumping and pad redistribution services for semiconductor manufacturers using electroplating-based technology. The company offers gold, copper, indium, and solder bumping along with pad redistribution (RDL) and mask layout services, focusing on prototype development, initial production ramps, and specialty flip chip interconnect applications requiring fine pitch capability under 100 microns.

Product overview

TLMI Corporation is a wafer bumping services provider offering a portfolio of electroplating-based bumping technologies including Solder Bumping, Gold Bumping, Copper Bumping, and Indium Bumping, along with Pad Redistribution (RDL) and mask layout services. The company specializes in prototype development and initial production ramps for flip chip interconnect applications, providing fine pitch bumping under 100 microns and stacked copper bumping up to 250 microns tall. Additional outsourced processing options include backgrinding, dicing, and pick & place services.

Differentiator

Problem solved

Functional benefit

Products and services

• Solder Bumping Electroplating-based solder bumping service for wafer-level chip scale packaging, supporting bump heights of 100 µm standard (15-150 µm available) and fine pitch capability down to 25 µm.
• Gold Bumping Electroplating-based gold bumping service using 99.9+% pure gold, with standard bump heights of 18 µm and 25 µm, and minimum bump pitch of 50 µm. Used in flip chip interconnect applications for semiconductor manufacturers.
• Copper Bumping Advanced copper bumping service with 100 µm standard bump height (10-250 µm stacked available), 150 µm standard pitch, and solder, nickel, gold or indium cap options for semiconductor packaging applications.
• Indium Bumping Electroplating-based indium bumping using 99.9+% indium with 35 µm standard bump height (5-50 µm capability) and minimum bump pitch of 20 µm. Used for specialty semiconductor and optoelectronic applications.
• Pad Redistribution (RDL) Wafer level chip scale packaging redistribution service with aluminum, copper/nickel, copper experimental, and gold trace materials supporting various minimum trace widths and spacing for semiconductor devices.
• Mask Layout and Procurement In-house mask layout and procurement service for wafer bumping requirements, requiring GDSII, stepping distance, and wafer map data. Provided as a turn-key support offering for semiconductor customers.

Named customers1 record

Segments2 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Three partnerships are on record, tiered minor.

• Industry InsightsminorStrategic or Co-development PartnerPartnership for Compensation and Benefits Study announced for 2026 initiatives (referenced in TLMI association news, separate from TLMI Corp entity).
• FTA (Flexographic Trade Association)minorStrategic or Co-development PartnerEducation partnership through FTA and iLearning+ for expanded education offerings (referenced in TLMI association news context).
• iLearning+minorStrategic or Co-development PartnerEducation partnership for expanded education offerings.

Scale indicators3 records

Recent moves6 records

Expansion highlights3 records

Direct peers

• JCET Group: JCET is a top-tier OSAT (formed via STATS ChipPAC acquisition) with extensive wafer bumping and flip chip packaging capabilities; directly competes with TLMI across bumping metallurgy and pitch ranges.
• Amkor Technology: Amkor Technology is one of the world's largest independent OSAT providers, offering wafer bumping (solder, copper pillar, gold), redistribution, and flip chip packaging services; directly comparable to TLMI's core offering at much greater scale.
• ASE Technology Holding: ASE Technology is the largest global OSAT, providing a full suite of wafer bumping, flip chip, and RDL services; directly competes with TLMI in advanced bumping metallurgy and fine-pitch offerings.
• Powertech Technology: Powertech is a Taiwan-based OSAT providing wafer bumping, flip chip, and advanced packaging services including copper pillar and RDL; competes with TLMI in flip chip bumping across Asia and globally.
• ChipMOS Technologies: ChipMOS is a Taiwan-based OSAT offering gold bumping, solder bumping, and wafer-level packaging services; comparable to TLMI for gold and solder bumping foundry customers.
• Tongfu Microelectronics: Tongfu Microelectronics is a major Chinese OSAT providing wafer bumping, flip chip BGA, and advanced packaging services; directly comparable to TLMI for high-volume bumping and flip chip interconnect offerings.

Broad incumbents

• GlobalFoundries: GlobalFoundries is a large semiconductor foundry providing bumping and back-end packaging as part of its broader process offerings; overlaps with TLMI on advanced packaging geometries, particularly for US and European customers.
• SkyWater Technology: SkyWater is a US-based semiconductor foundry offering specialty process technology including bumping services for defense and aerospace customers; comparable to TLMI's onshore US focus and AS9100/ITAR positioning, though bumping is only part of a much broader process portfolio.

Regional players

• UTAC Holdings: UTAC is a Singapore-headquartered OSAT offering bumping, RDL, and flip chip packaging; comparable to TLMI in metallurgies (Cu pillar, solder, gold) but primarily serves Asia-based customers.

Emerging players

• Deca Technologies: Deca Technologies is an emerging advanced packaging company specializing in wafer-level fan-out and bumping technologies for chiplet and heterogeneous integration; similar specialty-bumping positioning to TLMI but oriented toward next-gen fan-out architectures.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Tlmi Corporation