What ASIP Technologies does

ASIP Technologies Private Limited is an India-based semiconductor OSAT/ATMP (Outsourced Semiconductor Assembly and Test / Assembly, Testing, Marking and Packaging) company headquartered in Hyderabad. It was founded by a team of Silicon Valley semiconductor professionals to establish India's first commercial-scale OSAT/ATMP facility, and is approved by MeitY under the India Semiconductor Mission with 50% Capex support from the Government of India. The company's service portfolio is organized into two groups: Design Enablement (IC Package Design, Design-for-Test, and Test Development) and OSAT/ATMP operations (8" and 12" Wafer Bumping, IC Package & Assembly including leadframe, laminate, wafer-level, substrate and multichip modules, IC Testing across Teradyne/Advantest/Credence/Schlumberger platforms, and last-mile Dropship).

ASIP operates a B2B enterprise model, selling turn-key packaging-and-test services directly to fabless semiconductor companies, IDMs, and chip designers. Its customer segments are horizontal: mobile devices, consumer devices, automotive, IoT, and enterprise/data center silicon. Commercial scale-up is anchored by a Rs. 890 crore (~USD 107 million) joint venture with South Korean OSAT specialist APACT for a Hyderabad facility, Indian Cabinet approval for additional plants in Andhra Pradesh, Odisha, and Punjab, and an MoU with IIT Hyderabad for packaging and testing research and talent development.

The business is in pre-revenue build-out as of the available data: headcount is 1–10, no revenue is disclosed, and the senior team is being assembled (CEO Venkata Simhadri ex-Moschip/AMD/IDT; CFO Anil Kumar Upadhyay; VP Engineering Shankar Umapathi ex-Intel/AMD) alongside a heavyweight advisory board that includes Raja Koduri (ex-Intel EVP & Chief Architect), B.J. Han (Chairman/CEO STATS ChipPAC), Dr. Subramanian Iyer (IBM Fellow, UCLA), and Michel Villemain (CEO Presto Engineering). Pricing is project- and quote-based, not publicly disclosed, consistent with project-based B2B OSAT contracting.

Name

ASIP Technologies

Legal name

ASIP Technologies Private Limited

Website

https://asip-tech.com

Company type

Private

Founded year

2024

Operating status

Operating

Headcount range

1–10 employees

Short description

ASIP Technologies is an India-based, pre-revenue OSAT/ATMP semiconductor services provider building the country's first commercial-scale assembly and test facility in Hyderabad, offering turn-key design enablement, bumping, package assembly, testing, and dropship to enterprise fabless and IDM customers.

Ownership category

akta.pro rank

Product category

Semiconductor OSAT/ATMP Services

NAICS

Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Measuring & Controlling Devices, Nec (3829), Industrial Instruments For Measurement, Display, And Control (3823)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI), Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD)

Keywords

• Semiconductor packaging services
• OSAT ATMP services
• IC assembly testing
• Chip package design
• Semiconductor test development

Headquarters

HQ city

Hyderabad

HQ country

India

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Technology or R&D, Infrastructure, Operations, Marketing or Sales, Supply Chain

Revenue model

1. OSAT/ATMP Services: Full-spectrum semiconductor assembly and testing services including bumping, IC package assembly, IC testing, and dropship. Provides complete turn-key solutions from DFT/test development, package design, bumping, assembly, testing, to dropship. Revenue generated from service fees for each stage of the semiconductor packaging and testing process.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels7 records

Core offering

ASIP Technologies provides turn-key outsourced semiconductor assembly, testing, marking, and packaging (OSAT/ATMP) services from its Hyderabad facility. The portfolio spans Design Enablement (Package Design, Design-for-Test, Test Development) and OSAT/ATMP operations (Bumping, IC Package & Assembly, IC Testing, Dropship), delivered as integrated solutions to enterprise semiconductor customers. The company is approved by MeitY under the India Semiconductor Mission and operates a joint venture with South Korea's APACT.

Product overview

ASIP Technologies is an OSAT/ATMP (Outsourced Semiconductor Assembly and Test/Assembly, Testing, Marking and Packaging) company. The company's product and service portfolio consists of two integrated service groups: Design Enablement (Package Design, Design for Test/DFT, Test Development) and OSAT/ATMP operations (Bumping, IC Package & Assembly, IC Testing, Dropship). ASIP provides complete turn-key solutions spanning the full semiconductor packaging and test lifecycle — from DFT strategy and package design through bumping, assembly, testing, and final dropship delivery — approved by MeitY under the India Semiconductor Mission for setting up an OSAT/ATMP facility to serve India's growing domestic needs and provide an alternate supply chain to the global ecosystem.

Differentiator

Problem solved

Functional benefit

Products and services

• Package Design Turn-key IC package design service covering package architecture, package design and layout, SI/PI and thermal simulations, and substrate/interposer design to meet product IC package KPIs and quality requirements. Aimed at semiconductor chip designers and fabless companies needing advanced packaging solutions.
• Design for Test (DFT) Complete turn-key Design-for-Test solution covering test strategy definition, DFT architecture, DFT implementation, test time and cost analysis, scan ATPG, power-on of test patterns, and all post-silicon activities including failure debug, diagnosis, and yield analysis. Targets semiconductor companies needing product DPM, test cost, and yield targets.
• Test Development Complete test solution for all DFT scenarios including development and conversion of test content, pattern optimization, test time reduction, and failure and yield analysis over the product lifetime, meeting test cost, yield, and DPM requirements. Built for semiconductor companies running high-volume production test.
• Bumping Wafer bumping service equipped with 8-inch and 12-inch bumping lines supporting several layers of RDL, ball drop, plated bump, or printed bump of different dimensions to meet growing demand for advanced packages. Targets semiconductor companies needing advanced packaging bumping capacity.
• IC Package & Assembly Assembly services for advanced and basic packages including leadframe packages, laminate packages, wafer-level packages, substrate-based packages, modules, and multichip modules (MCM) for advanced applications. Designed for semiconductor companies serving mobile, consumer, automotive, IoT, and enterprise end markets.
• IC Testing Complete test solution with wafer sort and final test lines, including test program development on industry-standard platforms Teradyne, Advantest, Credence, and Schlumberger. Deploys the highest number of test engineers for test program generation and maintenance; targets enterprise semiconductor customers running high-volume production test.
• Dropship Last-mile shipping service delivering the final IC unit to any part of the world. Bundled with ASIP's turn-key OSAT/ATMP offering to provide direct-to-customer delivery for global semiconductor clients.

Segments5 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Six partnerships are on record, tiered major and core.

• Raja KodurimajorStrategic or Co-development Partner · 15 December 2025Semiconductor industry veteran Raja Koduri (former Executive Vice President and Chief Architect at Intel, General Manager of Radeon Technology Group at AMD, Director of GPU Architecture at Apple) joined ASIP Technologies' Advisory Board to support strategic development in advanced packaging technologies for AI and data center applications.
• IIT HyderabadmajorStrategic or Co-development PartnerASIP Technologies and IIT Hyderabad signed a Memorandum of Understanding (MoU) for IC packaging testing education and innovation. The partnership was highlighted in a gallery section on the company website and covered by Telangana Today and The Hans India.
• Government of India - India Semiconductor Mission (ISM)coreStrategic or Co-development PartnerASIP Technologies is approved by MeitY-India Semiconductor Mission for setting up an OSAT/ATMP facility. The company receives 50% Capex support from the Government of India under the India Semiconductor Mission, a flagship program for building India's semiconductor ecosystem.
• APACT (South Korea)coreStrategic or Co-development PartnerASIP Technologies formed a joint venture with South Korean company APACT to set up an OSAT/ATMP unit in Hyderabad with a Rs. 890 crore investment. The OSAT/ATMP project launch was covered by Times of India, The Hindu, Economic Times, Businessline, Manufacturing Today India, and other major publications.
• Dr. Pallam Raju (Founding Partner)majorStrategic or Co-development PartnerDr. M.M. Pallam Raju, former Union Minister in the Government of India (Ministry of Defense and Human Resources Development), is a Founding Partner and Board Member. He is a co-founder of Time To Market Inc (semiconductor design services company), which was successfully acquired by Infotech Enterprises in 2008.
• Sreenivas Vaddi (Founding Member)majorStrategic or Co-development PartnerSreenivas Vaddi is a Founding Member of ASIP Technologies with 28+ years of experience in Silicon Valley at leading semiconductor companies and startups. He has broad experience in semiconductor manufacturing, Test & Product Engineering, and Operations, having taken many products to volume production.

Scale indicators6 records

Recent moves7 records

Expansion highlights6 records

Regional players

• Hana Microelectronics: Thailand-based OSAT and semiconductor services company with assembly and test operations across Asia. Hana is a regional comparable for the OSAT business model and customer mix ASIP is building toward in the India/Asia corridor.
• SFA Semicon: South Korea-based OSAT — and a relevant peer given ASIP's JV with Korean partner APACT. SFA is a Korea-domestic OSAT with a similar customer base to APACT, providing a regional and capability benchmark for the India unit's ramp profile.
• Unisem Group: Malaysia-based OSAT offering bumping, wafer probing, assembly, and final test. Unisem is a comparable Southeast Asia OSAT peer with similar end-market exposure (mobile, consumer, automotive), relevant for ASIP's India positioning within the broader Asia supply chain.

Direct peers

• Powertech Technology (PTI): Taiwan-listed OSAT providing bumping, wafer sort, assembly, and final test services. PTI's service mix — especially bumping and advanced packaging — closely mirrors ASIP's planned offering, making it a directly comparable mid-tier OSAT peer.
• Tongfu Microelectronics: China-based OSAT with comprehensive packaging and test capabilities, including advanced packaging. TFME is a scale and capability peer ASIP will be benchmarked against on cost and advanced packaging readiness.
• Tessolve: India-headquartered semiconductor engineering services and OSAT-adjacent provider, offering test, packaging design, and turnkey solutions. Tessolve is the most direct Indian peer to ASIP and a likely partner or competitor for the same domestic customer base.
• ChipMOS Technologies: Taiwan-listed OSAT with comprehensive assembly and test services including bumping, mixed-signal, memory, and display driver IC packaging. ChipMOS is a closely comparable mid-cap OSAT for benchmarking service mix and end-market exposure.

Broad incumbents

• JCET Group: China's largest OSAT, with broad assembly/test capabilities and growing advanced packaging capacity. JCET represents the Asia-scale incumbent ASIP must differentiate against, particularly for customers diversifying away from concentrated supply chains.
• Amkor Technology: US-headquartered top-tier global OSAT with advanced packaging leadership (2.5D/3D, fan-out, chiplet-ready). Amkor is a direct competitor for the AI/data-center advanced packaging business ASIP is targeting, and a benchmark on technology and customer roster.
• ASE Technology Holding: The world's largest OSAT provider headquartered in Taiwan, offering a full suite of assembly and test services. ASE is the scale benchmark ASIP must compete against and a likely supply-chain alternative for the same global fabless and IDM customers ASIP targets.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/asip_tech
• YouTubeyoutube.com/channel/UCICymUmX8CHcl2e9Na54Tyw
• Facebookfacebook.com/asiptechnologies
• LinkedInlinkedin.com/company/asiptechnologies
• Instagraminstagram.com/asip_tech

Revenue estimate

Valuation estimate

Number of profiles

Profiles15 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about ASIP Technologies