What Noding Intelligence does

Noding Intelligence (Guangzhou Nuoding Intelligent Technology Co., Ltd., 诺顶智能) is a Chinese semiconductor back-end equipment manufacturer headquartered in Guangzhou, Guangdong Province, with formal commercial operations beginning in 2020. The company designs, develops, and manufactures high-precision semiconductor packaging and testing equipment serving advanced packaging (TSV, TGV, WLP, FOPLP, SiP), storage chip (DDR/LPDDR/Flash), power module (SiC, IGBT), optical communication, and microwave/RF end-markets. Its product portfolio spans five equipment families: die bonding/advanced packaging series (PNP6600 with ±3μm placement accuracy, FCB9900FC flip-chip bonder at 6,000 CPH, PNP7000m/pro for 32-layer chip stacking, PNP7000 LA micro-module bonder); semiconductor inspection series (EC200, EC300, EC400 with AI vision capabilities); test sorting series (KGD test sorter for SiC/IGBT, wafer-level die sorter, high-speed three-in-one tester, sub-tower charge tester); press-fit processing series (ACP-3T, SCP-5T, MCP-3T/6T/10T); and three-temperature sorting series (DMH-1000T/3000T, DCT-6000). The company builds on six in-house core technology platforms covering simulation, process analysis, precision machinery, motion control, vision applications, and electronic development, supported by over 100 million RMB in cumulative R&D investment.

The company operates an enterprise direct-sales model targeting semiconductor manufacturers, with 100+ head enterprise customers served across China, and after-sales service points extending to Malaysia and Vietnam. Pricing is not publicly disclosed and operates on a contact basis typical of high-precision capital equipment. Revenue is generated primarily through one-time capital equipment sales, supplemented by professional services including technical support, after-sales service, and process optimization. The company has completed three institutional funding rounds (Series A 2022 with Zhongxin Pujiang, Series B 2023 with Shenzhen Capital Group/CRRC Times/Fosun, Series B+ 2024 with SDIC Venture Capital) and holds National "Little Giant" (MIIT), Future Unicorn (Guangdong Province), and National High-Tech Enterprise designations. Factory capacity scaled from 4,000 sqm (2020) to 10,000 sqm (2024), with 60%+ of staff in R&D and 1,000+ cumulative equipment units shipped by 2025.

Name

Noding Intelligence

Legal name

Guangzhou Nuoding Intelligent Technology Co., Ltd. (广州诺顶智能科技有限公司)

Website

https://top-leading.com

Company type

Private

Founded year

2016

Operating status

Operating

Headcount range

101–250 employees

Short description

Noding Intelligence (诺顶智能) is a Guangzhou-based Chinese manufacturer of high-precision semiconductor packaging and testing equipment, including die bonders, flip-chip bonders, optical inspection systems, and test sorters, serving 100+ enterprise customers across advanced packaging, storage, power, optical, and RF segments.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging and Testing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Special Industry Machinery, Nec (3559)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor packaging equipment
• Die bonding machines
• Flip-chip bonders
• Optical chip inspection
• Test sorting systems

Headquarters

HQ city

Guangzhou

HQ country

China

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor Equipment Sales: Sale of high-precision semiconductor packaging and testing equipment including die bonders, flip-chip bonders, inspection machines, press-fit equipment, and test sorting systems. Equipment is sold as one-time capital purchases to semiconductor manufacturers.
2. Professional Services: Technical support, after-sales service, and process optimization services helping customers transition from pilot production to mass production.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

Noding Intelligence designs, manufactures, and sells high-precision semiconductor advanced packaging and testing equipment, including die bonders, flip-chip bonders, optical inspection machines, KGD test sorting systems, and servo press-fit machines. The company sells capital equipment directly to semiconductor manufacturers across advanced packaging, storage chips, power modules, optical communications, and microwave/RF applications, helping customers transition from trial production to mass production.

Product overview

Noding Intelligence (诺顶智能) is a semiconductor packaging equipment manufacturer specializing in high-precision equipment development since 2016. The company provides complete semiconductor packaging and testing equipment solutions with product lines covering advanced packaging, optical communication, storage, power, and microwave sectors. The portfolio consists of five core product series: (1) Die Bonding/Advanced Packaging Series including PNP6600 multi-function die bonders (±3μm precision), FCB9900FC flip-chip die bonders (6000 CPH), PNP7000m/pro stacked chip die bonders (32-layer stacking), and PNP7000 LA micro-module die bonders (±10μm precision); (2) Semiconductor Inspection/Testing Series featuring EC200 IC inspection (2D+3D sub-micron), EC300 optical module inspection, and EC400 optical chip inspection with AI capabilities; (3) Testing/Sorting Series including KGD test sorting systems for SiC/IGBT, Die Sorter wafer-level sorters, high-speed three-in-one test equipment, and sub-tower charge testing; (4) Press-fit Process Series with ACP-3T online, SCP-5T servo, MCP-10T/6T/3T high-precision press-fit machines; (5) Three-temperature Sorting Series with DMH-1000T/3000T multi-function sorters and DCT-6000 high-low temperature module testers. The company possesses core technologies in process platform, electronics development, software platform, precision machinery, motion control, and optical technology, helping customers transition from trial production to mass production.

Differentiator

Problem solved

Functional benefit

Products and services

• PNP6600 Series Multi-function High-precision Die Bonder High-precision die bonder achieving up to ±3μm placement accuracy, supporting laser height measurement, various dispensing methods (spray, dip, point), UV light processing, and automatic calibration with thermal deformation compensation.
• FCB9900FC High-speed Flip-chip Die Bonder High-speed flip-chip die bonder with dual gantry dual bondhead design achieving ±5μm@3σ placement accuracy and maximum 6000 CPH throughput for large-scale flip-chip reflow soldering applications.
• PNP7000m/pro High-speed Stacked Chip Die Bonder High-speed stacked chip die bonder achieving ±5μm@3σ placement accuracy with support for up to 32-layer chip stacking, maximum 2200 PCS/H throughput with 1-second bonding time, supporting face-up and face-down chip bonding.
• PNP7000 LA High-precision Micro-module Die Bonder High-precision micro-module die bonder achieving global ±10μm@3σ placement accuracy, supporting Uplook or Downlook vision positioning for multi-process, high-precision, high-speed micro-module die bonding applications.
• EC200 Integrated Circuit Appearance Inspection Machine 2D+3D sub-micron full inspection system for IC appearance detection with 2D defect detection ≥10μm and 3D detection repeatability ±10μm, featuring RGB multi-light source combined imaging and AI intelligent recognition.
• EC300 Optical Module Appearance Inspection Machine Optical module appearance inspection with detection capability ≥3μm, 3D repeatability ±10μm, and detection efficiency 1200 UPH, featuring PCBA inspection, DB&WB inspection, AI programming, and automatic focusing.
• EC400 Series Optical Chip Appearance Inspection Machine Optical chip appearance inspection with detection capability ≥0.5μm, accuracy ≥99.5%, and detection efficiency 3-5s/pcs, featuring AI deep learning algorithms, nano-level pixel resolution, sub-pixel algorithms, and multi-dimensional imaging.
• KGD Test Sorting System Known Good Die testing and sorting system for SiC/IGBT bare die, supporting dynamic/static/UIS/SC testing with temperatures up to 200°C, with high/low temperature testing environment and inert gas protection.
• Die Sorter Wafer-level Sorting Machine Wafer-level chip sorting machine supporting wafer, tray, and reel feeding with 180-degree automatic chip flipping, 6-bin reel/6+1 tray sorting, AI deep learning algorithms for defect classification, and closed-loop force control (50g-1000g).
• High-speed Three-in-One Test Equipment Integrated system combining appearance defect inspection, electrical performance testing, and finished product packaging, featuring 2-sided/6-sided/7-sided appearance inspection with AI detection technology and 60K UPH capacity.
• Sub-tower Charge Test Equipment Charging and testing equipment for strip products and loose components supporting chip-type aluminum electrolytic capacitor detection including high-voltage charging-leakage current testing, ESR, capacitance, and dissipation factor measurement.
• ACP-3T Online Fully Automatic Press-fit Machine Online fully automatic press-fit machine for automated production lines with X/Y/Z/R servo four-axis motion, Z-axis floating press head, intelligent automatic width-adjusting track, and full closed-loop control system.
• SCP-5T Fully Automatic Servo Press-fit Machine Fully automatic servo press-fit machine for complex PCBA products with multiple connectors, featuring automatic press mold switching with up to 13 press mold storage, high-precision pressure sensors, and vision positioning system.
• MCP-10T High-precision Press-fit Machine High-precision press-fit machine with strong compatibility for various press-fit products, featuring stroke precision up to μ-level, real distance feedback, and full closed-loop control for pressure, distance, and speed.
• MCP-6T High-precision Press-fit Machine High-precision press-fit machine with 1060L x 900Wmm work area, featuring stroke precision up to μ-level, real distance feedback, and full closed-loop control for pressure, distance, and speed monitoring.
• MCP-3T Desktop High-precision Servo Press-fit Machine Compact desktop press-fit machine suitable for laboratory and small-to-medium production applications, featuring Z-axis real distance feedback, two-stage pressure control, and multiple press-fit control modes (FT, PHT, CAT, FST).
• DMH-1000T Series Multi-function Engineering Sorting Machine Multi-function engineering sorting machine supporting electrical parameter testing, high/low temperature environment testing (-60°C to 180°C), and intelligent pin sorting with ±30μm/±50μm sorting accuracy and 8-site support.
• DMH-3000 Series Multi-function Engineering Sorting Machine Dual-precision engineering sorter with ±30μm/±50μm specifications and dual pick-up nozzles with automatic switching, supporting high/low temperature testing (-60°C to 200°C) with dual bondhead structure for higher production efficiency.
• DCT-6000 Series High-low Temperature Module Testing High-low temperature module testing system for power modules and switching modules with temperature range -55°C to +125°C, ±2°C uniformity and ±0.5°C stability, supporting multi-product small batch production with flexible quick changeover.

Quantifiable outcome

• 99.9% yield rate management in storage chip testing applications
• +4 more outcomes

Named customers1 record

Segments5 records

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability11 records

Feature12 records

Scale indicators12 records

Recent moves10 records

Expansion highlights5 records

Direct peers

• ASM Pacific Technology (ASMPT): ASMPT is the global leader in semiconductor assembly equipment including die bonders, flip-chip bonders, and advanced packaging tools. It is the dominant incumbent in the same product category where Noding competes, with much larger scale and global service network.
• SÜSS MicroTec: SÜSS MicroTec supplies lithography, wafer bonding, coating, and advanced packaging equipment used in 3D-IC, MEMS, and heterogeneous integration. Its advanced packaging equipment portfolio overlaps with Noding's TSV/TGV/WLP/FOPLP support equipment.
• Toray Engineering: Toray Engineering is a Japanese supplier of die bonders and advanced semiconductor assembly equipment. Its high-precision die bonding equipment competes directly with Noding's PNP6600 and FCB9900 series in advanced packaging applications.
• Kulicke & Soffa Industries: Kulicke & Soffa is a long-established leader in wire bonding and die bonding equipment, serving global semiconductor and LED manufacturers. Noding's high-precision die bonders compete for the same downstream sockets at advanced packaging customers.
• Towa Corporation: Towa is a leading Japanese supplier of molding equipment and encapsulation systems for semiconductor packaging. Its advanced packaging molding tools serve the same customer base that Noding addresses with its back-end equipment portfolio.
• BE Semiconductor Industries (Besi): Besi is a leading global supplier of die-bonding and advanced packaging equipment for the semiconductor industry, with strong positions in flip-chip and hybrid bonding. Its product portfolio directly overlaps with Noding's PNP and FCB series.
• Hanmi Semiconductor: Hanmi Semiconductor is a Korean supplier specializing in KGD test, vision inspection, and die-bonding equipment with strong positioning in HBM and advanced memory packaging. Its product focus closely matches Noding's KGD test sorting and vision inspection lines.
• DISCO Corporation: DISCO is the global leader in dicing, grinding, and inspection equipment for semiconductor back-end processing. Its inspection and back-end workflow equipment complement and partially overlap with Noding's semiconductor inspection product line.

Broad incumbents

• Advanced Micro-Fabrication Equipment Inc. (AMEC): AMEC is a major Chinese semiconductor equipment company specializing in etch technology. Like NAURA, it represents a broader Chinese semi equipment incumbent that competes with international players and provides reference points for the valuation of Chinese semi equipment champions.
• NAURA Technology Group: NAURA is a leading Chinese semiconductor equipment manufacturer with broad coverage in etch, deposition, and thermal processes. While not directly competing in back-end packaging, it is a relevant Chinese semi equipment peer and a comparable platform for capital markets positioning.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries1 record

Funding overview

Funding rounds2 records

Investors6 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Noding Intelligence