American Semiconductor

Name

American Semiconductor

Legal name

American Semiconductor, Inc.

Website

https://americansemi.com

Company type

Private

Founded year

2001

Operating status

Operating

Headcount range

11–50 employees

Short description

American Semiconductor (ASI) is a Boise-based specialty semiconductor packaging firm that provides ultra-thin, flexible chip packages and advanced substrates (Nobleflex™, Ultraflex™) using its proprietary Semiconductor-on-Polymer™ technology for medical, wearable, IoT, and defense customers.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging

NAICS

Bare Printed Circuit Board Manufacturing (334412), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Printed Circuit Boards (3672), Semiconductors & Related Devices (3674)

akta.pro primary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

akta.pro secondary industries

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)

Keywords

• Semiconductor packaging
• Flexible electronics
• Chip-on-flex assembly
• Advanced substrates
• Thin chip packaging

Headquarters

HQ city

Boise

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Infrastructure, Marketing or Sales

Distribution channels1 record

Marketing channels3 records

Core offering

American Semiconductor manufactures and sells advanced thin and flexible semiconductor chip packages using its proprietary Semiconductor-on-Polymer™ chip scale packaging technology. The company offers Nobleflex™ and Ultraflex™ advanced flexible substrates with 1µm features, Chip-on-Flex Assembly services, packaged ICs/test chips (FleX-ICs), and thin/flexible Bluetooth, ADC, and NFC development kits, supported by design, prototyping, wafer test, and reliability testing services.

Product overview

American Semiconductor provides an integrated platform centered on its proprietary Semiconductor-on-Polymer™ chip scale packaging technology, which enables ultra-thin and flexible semiconductor solutions with features at 1μm. The portfolio is organized around two advanced substrate sub-brands—Nobleflex™ and Ultraflex™—which serve as the foundational flexible platforms. The core packaging technology and substrate products are complemented by a comprehensive suite of services including chip-on-flex assembly, flexible electronics testing, wafer testing, system and reliability testing, prototype services, and design services. Additionally, the company offers a line of development kits (Thin and Flexible Bluetooth™, FleX-ADC, and FleX-NFC) that enable customers to prototype flexible wireless and sensing applications. The Multi-Project Substrate (MPS) Program provides cost-efficient access to the platform for prototyping and low-volume production through shared substrate runs.

Differentiator

Problem solved

Functional benefit

Brands

• Nobleflex™: Advanced substrate product line featuring ultra-thin flexible chip packaging technology.
• Ultraflex™
• FleX-ICs
• Semiconductor-on-Polymer™

Products and services

• Nobleflex™ Advanced Substrates Advanced flexible substrate with features at 1µm pitch, enabling ultra-thin chip packaging for flexible electronics applications such as wearables, medical devices, and IoT sensors.
• Ultraflex™ Advanced Substrates Advanced flexible substrate with features at 1µm, designed for high-performance flexible and wearable electronics requiring bendable/conformable form factors.
• Semiconductor-on-Polymer™ Chip Scale Packaging Proprietary chip scale packaging technology that mounts semiconductor dies on flexible polymer substrates instead of traditional rigid materials, producing ultra-thin, bendable packages for flexible and wearable electronics.
• FleX-ICs (Packaged ICs and Test Chips) Pre-packaged integrated circuits and test chips using Semiconductor-on-Polymer™ technology, available for evaluation, prototyping, and development of flexible electronic designs.
• Chip-on-Flex Assembly Assembly services that attach semiconductor chips directly to flexible polymer substrates, including die attach, wire bonding, and encapsulation for compact, bendable electronics.
• Design & Integration Services Engineering design and integration services for flexible hybrid electronics systems, including circuit layout, thermal management, and flexible hybrid electronics design integration.
• Prototype Services Rapid prototyping services for custom flexible semiconductor and electronics designs, enabling fast iteration from concept to functional flexible hardware.
• Flexible Electronics Testing Testing services for flexible electronic components and assemblies, including wafer test before dicing/packaging and system & reliability testing such as thermal cycling, humidity, mechanical flex testing, and failure analysis.
• Multi-Project Substrate (MPS) Program Cost-sharing program allowing multiple customers' designs to be fabricated on a single substrate wafer, providing economical access to flexible substrate runs for prototyping and low-volume production.
• Thin and Flexible Bluetooth™ Development Kit Development kit with thin and flexible Bluetooth connectivity that enables rapid prototyping of flexible wireless electronics.
• FleX-ADC Development Kit Development kit featuring a flexible analog-to-digital converter for prototyping flexible sensing applications.
• FleX-NFC Starter Kit Development kit that brings Near Field Communication (NFC) functionality onto flexible substrates for prototyping wireless flexible electronics.

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Recent moves6 records

Expansion highlights4 records

Direct peers

• Chipbond Technology: Taiwanese OSAT specializing in driver IC packaging, COF/COG, and advanced thin-package formats. Comparable to ASI on ultra-thin chip-on-flex and flexible substrate handling, particularly for display-driver and small-form-factor ICs.
• JCET Group: China-headquartered OSAT with strengths in advanced packaging including fan-out, wafer-level, and SiP. Directly comparable to ASI as a competing advanced-packaging service provider targeting similar customer profiles, though at substantially greater scale and geographic breadth.
• Nepes Corporation: Korean OSAT with advanced packaging offerings including fan-out wafer-level packaging and embedded die. Directly comparable to ASI as a competing provider of advanced packaging services, including formats that compete with chip-on-flex for space-constrained applications.
• Powertech Technology (PTI): Major OSAT offering assembly, packaging, and test services including advanced packaging formats. Comparable to ASI as a direct competitor in back-end semiconductor packaging services serving similar fabless and IDM customers across logic and memory.

Broad incumbents

• ASE Technology Holding: Largest OSAT globally, offering wirebond, flip-chip, advanced packaging, and substrate-like services. Directly comparable to ASI on advanced packaging, but operates at vastly larger scale across consumer, automotive, and HPC end markets rather than focusing on flexible/conformable substrates.
• Amkor Technology: Global top-3 OSAT with broad advanced packaging capabilities including flip-chip, fan-out, and 2.5D/3D. Comparable to ASI as a competitor in advanced packaging services, though Amkor serves a much wider portfolio rather than specializing in ultra-thin/flexible chip-scale packages.

Others

• NextFlex: U.S. Manufacturing Innovation Institute focused on flexible hybrid electronics (FHE), of which American Semiconductor is a member/contributor. Comparable ecosystem participant that helps fund and qualify FHE technology, with overlapping mission in advancing flexible semiconductor adoption though structured as a public-private consortium.
• SÜSS MicroTec: Supplier of semiconductor manufacturing equipment including tools for advanced packaging, wafer-level processing, and thin-wafer/bonding. Adjacent peer providing enabling capital equipment to OSATs and packaging players like ASI, rather than directly competing in packaging services.
• Brewer Science: Specialty materials supplier enabling advanced semiconductor packaging including temporary bonding, thin-wafer handling, and flexible substrate materials. Adjacent peer to ASI as an enabling materials provider in the thin/flexible semiconductor ecosystem rather than a direct packaging competitor.

Emerging players

• Imec: Leading semiconductor R&D center actively developing thin-film, flexible, and advanced packaging process modules including chip-on-foil and thin-chip handling. Comparable to ASI as an emerging technology developer in flexible semiconductor integration, though Imec is a non-profit research hub rather than a commercial packager.

Market position

Strengths1 record

Weaknesses2 records

Competitive moat3 records

Key risks6 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/user/AmericanSemi
• LinkedInlinkedin.com/company/american-semiconductor-inc-
• Xx.com/FlexibleChips

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about American Semiconductor