Name

NPOS Technologies

Legal name

NPOS Technologies Inc.

Website

https://npos-usa.com

Company type

Private

Founded year

2002

Operating status

Operating

Headcount range

1–10 employees

Ownership category

akta.pro rank

Product category

Semiconductor Assembly Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Electrical Equipment Manufacturing (3353)

SIC

Special Industry Machinery, Nec (3559), Electronic Components, Nec (3679), Industrial Process Furnaces & Ovens (3567)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industry

Thermal Processing Equipment (Furnaces/RTP/Anneal) (HDAHAEAE)

Keywords

• Semiconductor assembly equipment
• Microelectronics manufacturing
• Die bonding systems
• Reflow soldering ovens
• Wire bonding equipment

Headquarters

HQ city

Pasadena

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Technology or R&D, Marketing or Sales, Operations

Revenue model

1. Semiconductor Equipment Sales: Sale of precision semiconductor assembly equipment including AOI systems, die bonders, laser systems, reflow soldering ovens, RTP systems, screen printers, scribe & break systems, and wire bonders. Equipment sales are likely one-time capital purchases with potential service contracts.
2. Technical Consulting Services: Technical consulting services including process development, materials expertise (GaAs, GaN, Gap, LiNbO3, Silica on Silicon, organic support), metallurgical analysis, DOE for process characterization, SPC data analysis with DPO of at least 5 sigma. Services conform to MIL-STD-883 Class K and Class H.
3. Training Services: On-site training programs for back-end process assembly tailored to specific process and equipment needs in manufacturing of military, aerospace, and medical products. Courses designed for engineers, scientists, and management professionals involved in R&D, manufacturing, and process improvement.
4. Maintenance & Qualification Services: Preventive maintenance contracts with limited warranties, tuning to optimize performance, calibration, and repair services. Services extend to KnS and FK Delvotec wire bonders in addition to their own product line.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels2 records

Core offering

NPOS Technologies manufactures and supplies precision semiconductor assembly equipment for microelectronics and photonics manufacturing, including automated optical inspection systems, die bonders, laser scribing and trimming systems, vacuum/pressure reflow soldering ovens, rapid thermal process ovens, screen and stencil printers, scribe-and-break dicing systems, and wire bonders. The company complements this equipment portfolio with process development consulting, manufacturing and training services, and preventive maintenance contracts for its own equipment and selected third-party wire bonders.

Product overview

NPOS Technologies offers a comprehensive portfolio of precision semiconductor assembly equipment for microelectronics and photonics manufacturing. The product lineup includes AOI Systems (EXCEL AOI-45 for automated optical inspection), Die Bonders (PPOne, PP6-HD flip-chip, MPS-5 manual), Wire Bonders (WB200 dual process, PGW100 welder), Laser Systems (ALS200 for cutting/drilling, ALS300 for trimming), Vacuum Reflow Soldering Systems (VSS-300, RSS, RSO, HP series), RTP/RTA Ovens (RTP series, VPO-300), Screen Stencil Printers (VS1520A, VS1520M, C920, VS2025), Scribe & Break Systems (S100-4, S200-8, MS1, BRK-60R), and Thick Film Photoimageable Technology. These equipment products are complemented by consulting services covering process development, manufacturing, training, and maintenance. The company serves semiconductor, RF/microwave, optoelectronic, and photonics assembly markets through distribution partnerships with Aurel SpA, JFP Microtechnic, UniTemp GmbH, and Small Precision Tool Inc.

Differentiator

Problem solved

Functional benefit

Products and services

• EXCEL AOI-45 Automated Optical Inspection System Automated optical inspection equipment for thick film, thin film, LTCC, polymeric, glass and wafer applications, configurable for in-line or stand-alone use by semiconductor and microelectronics manufacturers.
• PPOne Die Bonder & Sorter Fully automated die sorter and epoxy die bonder with a double-head system for picking and placing delicate ASIC, MMIC, MEMS, and VECEL devices in microelectronics assembly.
• PP6-HD Series Flip-Chip Die Bonder Semi-automatic flip-chip and eutectic die bonder achieving placement accuracy below 3µm at 3 sigma, with smart video mixer for substrate and device alignment, designed for high-precision hybrid and photonics assembly.
• MPS-5 Manual Mini Die Placer Manual die placer and inspection station with a rocking head for adhesive application and HD camera with adjustable magnification for small and large chip placement in R&D and prototyping environments.
• ALS200 CO2 Laser System Compact CO2 laser system for scribing, drilling, and cutting ceramic substrates used in thin and thick film hybrid circuits, with a 300x300mm stage and high precision linear motors.
• ALS300 Laser Trimmer Advanced laser trimmer platform for ohmic trimming of chip resistor arrays and active or functional trimming of hybrid, digital, and RF circuits, with optional flying probes and third-party probe card support.
• VSS-300 Vacuum/Pressure Reflow Oven Void-free flux-less soldering system supporting wafer diameters up to 12 inches or substrates up to 12x12 inches with maximum temperatures of 450°C (optional 650°C), with up to four gas lines for active void reduction below 1%.
• RSS Series Reflow Solder System Compact tabletop vacuum reflow solder system for laboratories and clean rooms, available in multiple sizes from 4x4 to 8x8 inches with programmable temperature profiles.
• RSO Series High Temperature Reflow System High-temperature reflow solder system reaching up to 650°C for large substrates up to 200mm x 170mm, designed for laboratory furnace applications and demanding solder profiles.
• HP Series High Precision Hot Plates Compact hot plates with integrated precision controller for reflow of soldering alloys, pre-heating for wire bonding, epoxy curing, and laboratory testing applications.
• RTP Series Rapid Thermal Process Oven High-speed heat treatment system with upper and lower cross lamp arrays for annealing, oxidation, nitriding, diffusion, crystallization, and contact alloying, reaching up to 1200°C with ramp rates up to 150 K/sec and vacuum down to 10exp.-6 hPa.
• VPO-300 Vacuum Process Oven High-temperature vacuum process oven supporting 12-inch wafer diameters and 12x12 inch substrates with strong temperature uniformity and repeatability for thermal processing of microelectronic devices.
• Thick Film Photo-imageable Technology Fine line thick film process technology with line resolution starting from 20µm, providing a cost-effective alternative to thin-film processing for high-density interconnect, RF/microwave (up to 200 GHz), multilayer LTCC/HTCC, fuses, chip inductors, plasma displays, and RF shielding on glass.
• WB200 Dual Process Wire Bonder Advanced semi-automatic wire bonder platform supporting wedge/wedge, ball/wedge, and stud bump bonding for Au, Al, and Cu wires from 17µm to 50µm, with motorized XYZ axis and deep 62KHz transducer for microelectronics packaging.
• PGW100 Parallel Gap Welder Free-standing, fully automatic micro welder for welding metal strips onto metal bases to produce electronic packages, offering six current regulation modes for diverse package welding requirements.
• S100-4 Scribe & Break System Contamination-free and stress-free scribe and break system for singulating GaAs MMIC chips, optical sensors, laser bars, and other delicate devices up to 4 inches using natural cleaving.
• S200-8 Automatic Scribe System User-friendly automatic scribe system for separating components up to 8 inches in diameter, with high-definition CCD camera and vibration-free operation for clean, repeatable dicing of sensitive devices.
• MS1 Manual Scribe System Tabletop 8-inch manual wafer scriber with video interface for Ultra-HD cameras and true vertical movement providing scribe line accuracy below 10µm for low-volume and laboratory dicing applications.
• BRK-60R Roller Breaker Semi-automatic roller breaker for precise and repeatable breaking of small, delicate, sensitive, and hard materials up to 6 inches, with floating roller concept for automatic flatness compensation.
• VS1520A Fine Line Screen Printer Fine line screen printing system for thick film technologies with substrates up to 250x250mm, automatic vision system achieving better than 2µm resolution and modular configuration for R&D and production use.
• VS1520M In-Line Automatic Screen Printer Fully automatic modular screen printing platform designed for multilayer circuits and high throughput, with customizable configuration based on production trends for hybrid and microelectronics manufacturing.
• C920 High Precision Screen Printer High-precision standalone screen and stencil printing device for large area printing up to 350x400mm with ProAlign vision system, suited for multilayer hybrid circuit production.
• VS2025 Large Format Screen Printer Large format high precision screen and stencil printing platform for substrates up to 800x600mm (31x23 inches), ensuring uniform deposition from corner to corner for large-area microelectronics assemblies.
• Process Development Consulting Technical consulting services including materials expertise, process development, and expert witness work for GaAs, GaN, Gap, LiNbO3, silica on silicon, and other semiconductor materials used in microelectronics and photonics assembly.
• Manufacturing Services Manufacturing process improvement services using yield, quality, and production data analysis through SPC with DPO of at least 5 sigma, conforming to MIL-STD-883 Class K and Class H for microelectronics manufacturers.
• Training Services On-site training programs for back-end process assembly tailored to specific process and equipment needs for engineers, scientists, and management professionals in military, aerospace, and medical product manufacturing.
• Maintenance & Qualification Services Preventive maintenance contracts with limited warranties, performance tuning, calibration, and repair services for wire bonders, including KnS and FK Delvotec brands in addition to NPOS's own product line.

Quantifiable outcome

• Fine line resolution down to 20µm with photo-imageable thick film technology
• +3 more outcomes

Segments6 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration1 record

Feature6 records

Partnerships

Four partnerships are on record, tiered core and minor.

• Aurel SpAcoreTechnology or IntegrationAurel SpA provides screen stencil printers, dryer ovens, AOI inspection systems, resistor laser trimming, laser marking, and laser cutting & scribing equipment through partnership with NPOS Technologies.
• JFP Microtechninc SARLcoreTechnology or IntegrationJFP Microtechninc SARL supplies wafer scriber & breaker systems, die bonders, wire bonders, and laser bar stackers integrated into NPOS Technologies' product portfolio.
• UniTemp GmbHcoreTechnology or IntegrationUniTemp GmbH provides vacuum solder systems, RTP ovens, and high vacuum sealers to NPOS Technologies for distribution and integration.
• Small Precision Tool Inc.minorChannel Partner/ Reseller/ DistributorSmall Precision Tool Inc. supplies consumables and accessories including capillaries, wedges, pick up tools, die collets, and cutter blades for semiconductor assembly equipment.

Scale indicators2 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• Hesse Mechatronics: Germany-based wire bonder and ultrasonic bonding specialist serving photonics, semiconductor, and automotive electronics. Closely comparable precision bonder offering to NPOS's WB200 dual-process platform.
• F&K Delvotec: German manufacturer of wire bonders and microelectronics assembly equipment. Directly competes in NPOS's wire-bonding and assembly tooling line; also named by NPOS as a third-party service brand (KnS and F&K Delvotec).
• SET Corporation (Smart Equipment Technology): French manufacturer of precision die bonders and flip-chip assembly tools for photonics, MEMS, and RF customers. Tightly comparable niche competitor to NPOS in high-accuracy die placement.
• MRSI (Mycronic AB): Mycronic's MRSI division makes high-precision die bonders for photonics, datacom, and 5G — directly comparable to NPOS's PP6-HD flip-chip and PPOne epoxy die bonders targeting similar ASIC/MMIC/MEMS customers.
• Palomar Technologies: Palomar Technologies is a US-based precision microelectronics assembly equipment maker with overlapping die bonders, wire bonders, and packaging tools. Most directly comparable niche competitor to NPOS in die/wedge/ball bonding and photonics assembly.

Broad incumbents

• DISCO Corporation: Japanese leader in dicing, grinding, and singulation equipment. Directly comparable to NPOS's S100/S200 scribe-and-break systems for MEMS, photonics, and laser diode dicing.
• ASM Pacific Technology: Large Hong Kong-based back-end semiconductor equipment maker with die bonding, packaging, and SMT lines. Broad incumbent competing for larger accounts where NPOS's smaller integrated portfolio is also pitched.
• Kulicke & Soffa Industries: Global leader in wire bonding equipment and a broad back-end semiconductor equipment portfolio. Sets the competitive benchmark NPOS competes against in wire bonding, and NPOS services KnS machines as a third-party provider.
• Besi (BE Semiconductor Industries): Dutch die-bonding, packaging, and advanced-assembly equipment leader. Competes with NPOS in die bonding and flip-chip placement at the high end, especially for hybrid and advanced packaging customers.
• SUSS MicroTec: German manufacturer of lithography, bonding, and microelectronics process equipment. Comparable in advanced packaging and photonics process tools where NPOS also sells, but at significantly larger scale.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/npos-technologies

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about NPOS Technologies