Attach Point
- Company typePrivate
- Founded2016
- HeadquartersDongguang, China
- Headcount251–500
- GTM typeB2B
- OfferingHardware or Manufacturing
Attach Point firmographics
Firmographics- Name
- Attach Point
- Legal name
- Dongguan Attach Point Intelligent Equipment Co., Ltd. (东莞触点智能装备有限公司)
- Website
- https://cdapie.com
- Company type
- Private
- Founded year
- 2016
- Operating status
- Operating
- Headcount range
- 251–500 employees
- Ownership category
- akta.pro rank
Attach Point industry classification
Industry- Product category
- Semiconductor Packaging Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242), Semiconductor and Related Device Manufacturing (334413)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)
- akta.pro secondary industries
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)
Keywords
Where Attach Point is headquartered
LocationHeadquarters
- HQ city
- Dongguang
- HQ country
- China
- HQ region
- Asia
Offices5 records
Markets served
Attach Point business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure
Revenue model
- Semiconductor Packaging Equipment Sales: Sale of advanced packaging equipment including TCB (Thermo-Compression Bonder), die bonders, and intelligent inline solutions to semiconductor manufacturers
Go-to-market motion2 records
Distribution channels2 records
Marketing channels7 records
Attach Point product offering
Product offeringCore offering
Attach Point (APIE) designs and manufactures advanced semiconductor packaging equipment, including wafer-level thermo-compression bonders (TCB) and multi-chip, ultra-thin-die, and intelligent inline die bonders, which it sells directly to global OSATs, IDMs, memory manufacturers, and camera module makers for HBM, AI chip, optical module, and 3D stacking packaging applications. The company also develops the underlying precision mechanics, motion control, vision, CAE simulation, motor, and software technologies that power these systems.
Product overview
APIE (Attach Point Intelligent Equipment) is a high-tech enterprise specializing in advanced semiconductor packaging equipment. The product portfolio consists of four core product lines: AP-TC2000 Series (wafer-level thermo-compression bonder for HBM/AI chips), AP-M3500 Series (multi-chip SiP die bonder for optical communications), AP-M2000 Series (ultra-thin-die stacking bonder for 3D memory packaging), and AP-Smart Inline (intelligent packaging line for automotive/consumer applications). These equipment lines serve the semiconductor advanced packaging ecosystem, enabling 2.5D/3D integration, HBM stacking, optical module packaging, and high-volume manufacturing of dies for AI, memory, optical communications, and automotive electronics markets. The company also develops core technologies including precision mechanics, motion control, vision systems, CAE simulation, and high-performance motors as foundational capabilities supporting their equipment portfolio.
Differentiator
Problem solved
Functional benefit
Brands
- AP-Smart Inline: Semiconductor Packaging Intelligent Inline Solution - automotive-grade precision placement system with ±7μm accuracy for CMOS modules and LiDAR
- AP-M2000 Series
- AP-M3500 Series
- AP-TC2000 Series
Products and services
- AP-TC2000 Series Thermo-Compression Bonder Wafer-level thermo-compression bonder (TCB) for ultra-fine pitch memory and logic chip packaging (HBM/xPU) and CoWoS applications, featuring ±1.5μm@3σ placement accuracy, 0.7–50N force control, and support for TC-MUF/MR-MUF/FC bonding processes. Targeted at OSATs, IDMs, and memory manufacturers producing HBM and AI chips.
- AP-M3500 Series Multi-Chip SiP Die Bonder Multi-chip SiP die bonder for high-speed optical modules and diverse applications including photonics, transceivers, LiDAR, and camera modules. Offers ±3μm@3σ placement accuracy with Industry 4.0 integration, automatic 6-collet exchange, and multi-material handling for fully automated manufacturing. Targeted at optical communications, silicon photonics, and camera module manufacturers.
- AP-M2000 Series Ultra-Thin-Die SiP Die Bonder Ultra-thin-die SiP die bonder for 3D multi-layer stacking applications. Features ±5μm@3σ placement accuracy, 25μm ultra-thin die handling, 32-Hi stacking capability, and supports DAF & Epoxy processes for BGA/QFP/QFN packaging. Targeted at memory and storage manufacturers requiring 3D NAND and DRAM stacking.
- AP-Smart Inline Semiconductor Packaging Intelligent Inline Solution Semiconductor packaging intelligent inline solution for automotive and consumer electronics. Provides ±7μm@3σ bonding accuracy with Cpk ≥1.67, supports COB/BGA/DAF processes for smartphone and automotive CMOS modules and LiDAR modules, and features MES traceability with flexible automation. Targeted at camera module manufacturers serving smartphone and automotive markets.
Quantifiable outcome
- Equipment stabilization time of 84+ months for mass production
- +4 more outcomes
Companies that use Attach Point
Customer profileNamed customers4 records
Segments4 records
Ideal customer profiles3 records
Attach Point technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Integration5 records
AI capability4 records
Feature6 records
Attach Point partnerships and signals
Strategic signalPartnerships
Three partnerships are on record, tiered core.
- Professor Liu Hancheng (劉漢誠教授)coreRenowned semiconductor expert and IEEE Fellow visited APIE to deliver lecture on 'AI-Driven Innovation in Advanced Packaging.' Professor Liu holds 51 global invention patents, authored 23 advanced semiconductor textbooks, and published nearly 600 academic papers. Collaboration focuses on advanced packaging technology knowledge exchange and industry development.
- Tsinghua University (清华大学)coreAPIE CEO Chen Shubin and CTO Yang Yang visited Vice President Academician Jiang and research team to discuss advanced packaging technology trends, project cooperation, and key technology research. Collaboration aims to integrate university talent advantages with enterprise industrial capabilities to promote China's advanced packaging technology development.
- Peking University (北京大学)coreAPIE CEO Chen Shubin and CTO Yang Yang visited Dean Cai of the School of Integrated Circuits and research team for in-depth exchanges on advanced packaging technology trends, project cooperation, and key technology research. Partnership seeks to combine top university talent with enterprise industry advantages.
Scale indicators8 records
Recent moves6 records
Expansion highlights7 records
Attach Point competitors and assessment
Company assessmentDirect peers
- Besi: Besi is a Dutch semiconductor assembly equipment manufacturer and the global leader in TCB and hybrid bonding equipment. Directly comparable as the primary incumbent APIE competes against in advanced packaging for HBM and AI applications.
- Toray Engineering: Toray Engineering is a Japanese supplier of TCB equipment for HBM and advanced semiconductor packaging. Directly comparable to APIE's AP-TC2000 in serving memory manufacturers.
- Hanmi Semiconductor: Hanmi Semiconductor is a South Korean manufacturer of TCB equipment and die bonders serving the global HBM and memory market. Directly competes with APIE for memory manufacturer customers.
- Kulicke & Soffa Industries: Kulicke & Soffa is a Singapore/US-headquartered semiconductor and LED assembly equipment supplier. Competes with APIE in die bonding equipment and is expanding into advanced packaging.
- ASMPT (ASM Pacific Technology): ASMPT is a Hong Kong-headquartered global supplier of semiconductor assembly equipment including die bonders, TCB, and packaging solutions. Directly competes with APIE in advanced packaging equipment for memory and logic customers.
Emerging players
- Shinkawa Ltd. Shinkawa is a Japanese manufacturer of die bonders and flip-chip bonders serving the semiconductor packaging market. Comparable as a regional competitor in precision die bonding equipment.
- SET Corporation (Smart Equipment Technology): SET Corporation is a French specialist in die-to-wafer and wafer-to-wafer hybrid bonding equipment. Comparable as an emerging technology provider that could complement or compete with APIE's TCB offerings as hybrid bonding adoption grows.
- Yamaha Robotics (IMS): Yamaha Robotics' IMS division produces high-speed surface mounters and die bonders for semiconductor applications. Comparable as an adjacent equipment vendor expanding into semiconductor precision packaging.
Broad incumbents
- Canon (Canon Nanotechnologies): Canon has acquired nanoimprint and advanced packaging lithography assets and is a broader incumbent in semiconductor equipment. Relevant as a competitor in hybrid bonding and advanced packaging technology development.
- SÜSS MicroTec: SÜSS MicroTec is a German supplier of equipment for semiconductor advanced packaging, MEMS, and compound semiconductors. Comparable as a broader incumbent in advanced packaging equipment including bonding technologies.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat7 records
Key risks5 records
Key highlights7 records
Customer concentration
Attach Point social profiles
Digital presenceAttach Point compliance and trust
Trust signalCompliance3 records
Attach Point financial estimates
Financial estimateRevenue estimate
Valuation estimate
Attach Point leadership team
Management profileNumber of profiles
Profiles8 records
Attach Point funding detail
Funding detailFunding overview
Funding rounds1 record
Investors1 record
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Attach Point M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Attach Point
What does Attach Point do?
Attach Point (APIE) designs and manufactures advanced semiconductor packaging equipment, including wafer-level thermo-compression bonders (TCB) and multi-chip, ultra-thin-die, and intelligent inline die bonders, which it sells directly to global OSATs, IDMs, memory manufacturers, and camera module makers for HBM, AI chip, optical module, and 3D stacking packaging applications. The company also develops the underlying precision mechanics, motion control, vision, CAE simulation, motor, and software technologies that power these systems.
Is Attach Point a public or private company?
Attach Point is a private company. It is classified as venture growth investor backed and is currently operating.
When was Attach Point founded?
Attach Point was founded in 2016. It employs 251 to 500 people.
Where is Attach Point based?
Attach Point is headquartered in Dongguang, China, in the Asia region.
How does Attach Point make money?
One revenue line is on record: semiconductor Packaging Equipment Sales.
Who are Attach Point's main competitors?
Direct peers on record are Besi, Toray Engineering, Hanmi Semiconductor, Kulicke & Soffa Industries and ASMPT (ASM Pacific Technology). Emerging players are Shinkawa Ltd., SET Corporation (Smart Equipment Technology) and Yamaha Robotics (IMS). Broad incumbents are Canon (Canon Nanotechnologies) and SÜSS MicroTec.
Does Attach Point have an API?
No public API is recorded for Attach Point.
What industry is Attach Point in?
Attach Point's product category is Semiconductor Packaging Equipment. Its primary akta.pro industry code is HDAHAEAL, Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB), with a secondary code of HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets). Its NAICS code is 333242 and its SIC code is 3674.