What Amx Automatrix does

AMX Automatrix srl unipersonale is a privately held Italian industrial automation company headquartered in Gavardo (Brescia), Italy, with a registered office in Roè Volciano. Founded in 2011 by the Schivalocchi family on the back of the Copromec Group (1998), the company specializes in pressure sintering equipment and complementary inspection and lamination tools for power electronics die-attach. Its core offering is the X-Sinter series of Ag/Cu pressure sintering presses — ranging from the R&D-oriented X-Sinter P50 and P55 units, through mid-range P100 production presses, to high-throughput mass-production systems (P200X, P201X HS, P201XM) — all built around the worldwide-patented Micro-Punch System that independently applies calibrated force to each die on a substrate. Complementing the sintering line, the X-SAM family (desktop M51 and in-line M201X) provides scanning acoustic microscopy for non-destructive quality inspection, and the X-Wafer P200 W Series handles wafer-level lamination. The equipment is engineered for inert-atmosphere Ag/Cu sintering of SiC, IGBT, and MOSFET dies and is Smart Factory 4.0-ready (SECS/GEM, OPC-UA, OPCON).

AMX monetizes its technology primarily through direct, quote-based capital equipment sales to enterprise customers, supplemented by a Clean Room & Prototyping service at AMX Labs for feasibility testing and process industrialization. Target buyers span automotive OEMs and Tier1 suppliers (EV/HEV powertrain inverters, on-board chargers, fast-charging stations), power-electronics semiconductor manufacturers using SiC and GaN, OSATs, material suppliers, and R&D institutes/universities. The company runs an enterprise field-sales motion with a global footprint covering Italy, the rest of Europe, the UK, the USA, China, Taiwan, Japan, and South Asia Pacific, supported by marketing through its multilingual website, LinkedIn, technical content, and presence at industry events (IEMT, IMAPS, NordPac, EMPC).

Operationally, AMX is family-owned with no disclosed venture capital or institutional investor backing, employs 11-50 people, and is ISO 9001:2015 and TISAX certified. The company is a member of ECPE (European Center for Power Electronics) and a partner in the EU Horizon Europe / Chips Joint Undertaking Project FastLane consortium, alongside named collaborations with Siemens, the University of Nebraska-Lincoln, and DER-IC UK. Its competitive differentiation rests on the Micro-Punch patent, measurable production advantages (up to 100x longer interconnection lifetime versus soldering, -30% electricity and -70% gas consumption versus standard equipment, -70% smaller footprint, -50% SiC scrap), and embedded customer relationships in automotive and European SiC supply-chain programs.

Name

Amx Automatrix

Legal name

AMX Automatrix srl unipersonale

Website

https://amx-automatrix.it

Company type

Private

Founded year

2011

Operating status

Operating

Headcount range

11–50 employees

Short description

AMX Automatrix manufactures pressure sintering equipment (Ag/Cu), scanning acoustic microscopy systems, and wafer lamination tools for power electronics die-attach. The company serves automotive OEMs, Tier1 suppliers, semiconductor manufacturers, OSATs, and R&D institutes globally from Gavardo, Italy.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Machine Tool Manufacturing (333517)

SIC

Machine Tools, Metal Cutting Types (3541)

akta.pro primary industry

CNC Machine Tools (Turning, Milling, Machining Centers) (IMAHADAA)

Keywords

• Pressure sintering equipment
• Power electronics manufacturing
• Die attach technology
• Scanning acoustic microscopy
• Wafer lamination systems

Headquarters

HQ city

Gavardo

HQ country

Italy

HQ region

Europe

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales

Revenue model

1. Sintering Equipment Sales: Sale of production-grade pressure sintering machines (X-Sinter series) ranging from R&D to mass production scale. Equipment includes silver and copper sintering presses, scanning acoustic microscopy systems, and wafer lamination systems.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

AMX Automatrix designs and manufactures pressure sintering equipment for power electronics die-attach, with a primary portfolio of X-Sinter presses based on silver and copper sintering processes. Complementary offerings include in-line Scanning Acoustic Microscope (X-SAM) inspection systems and X-Wafer lamination systems, plus clean-room prototyping and process development through AMX Labs. Customers use the equipment for automotive power modules (EV/HEV, SiC, GaN), semiconductor packaging, and advanced R&D applications.

Product overview

AMX Automatrix offers a full portfolio of pressure sintering equipment for power electronics, spanning R&D to mass production, alongside non-destructive scanning acoustic microscopy inspection systems and wafer lamination tools. The core product line centers on the X-Sinter series of Ag/Cu pressure sintering presses — including the P50 Series (R&D), P100 Series (mid-range production), P200X/P201X Series (high-capacity mass production), and specialized models (P51, P52, P54, P55 for specific applications) — all incorporating the proprietary worldwide-patented Micro-Punch System for independent multi-die pressure application. The complementary X-SAM series (M51 desktop and M201X inline) provides acoustic microscopy for non-destructive quality control of sintered interfaces, while the X-Wafer P200 W Series addresses wafer lamination needs. AMX also provides a Clean Room and Prototyping Lab service for feasibility testing and process development. The equipment supports Smart Factory 4.0 connectivity (Secs Gem, OPCUA, OPCON) and operates under inert atmosphere for copper and silver sintering of SiC, IGBT, and MOSFET power semiconductor dies, clips, and passive components.

Differentiator

Problem solved

Functional benefit

Brands

• X-Sinter Series: Pressure sintering equipment product line including P50 Series, P100 Series, P200X Series, P201X HS Series, and P201XM Series for silver and copper pressure sintering applications.
• X-SAM Series
• X-Wafer Series

Products and services

• X-Sinter P50 Full-area silver/copper sintering press designed for production-scale power semiconductor die-attach on automotive and industrial power modules; targets automotive OEMs, Tier-1s, and power semiconductor manufacturers.
• X-Sinter P100 Mid- to high-volume silver/copper sintering press for power electronics die-attach, offering higher throughput than P50 while maintaining the patented Micro-Punch System and Smart Factory 4.0 connectivity.
• X-Sinter P200X High-volume silver/copper sintering press targeting large-area automotive power modules, semiconductor packaging lines, and high-reliability industrial applications.
• X-Sinter P201X HS High-speed configuration of the P201X sintering platform for higher cycle rates in mass production of silver- and copper-sintered power modules.
• X-Sinter P201XM Multi-chamber high-volume sintering press based on the P201X platform, designed to maximise throughput per square meter in high-mix power packaging lines.
• X-Sinter P51 Compact silver/copper sintering press for lower-volume production, process development, and R&D use in advanced power packaging.
• X-Sinter P52 R&D-oriented silver/copper sintering press for laboratories and pilot lines characterising new sinter materials and stacks.
• X-Sinter P54 Laboratory-grade sintering press for advanced packaging research at universities and R&D institutes, focused on silver and copper sintering process development.
• X-Sinter P55 Pilot-line silver/copper sintering press that bridges laboratory P52/P54 systems and high-volume P201X systems, used for process qualification ahead of mass-production deployment.
• Inline X-SAM M201X In-line Scanning Acoustic Microscope for 100% non-destructive inspection of sintered die-attach, detecting voids and delamination in power modules; designed for integration with high-volume sintering lines.
• X-SAM M51 Compact Scanning Acoustic Microscope for laboratory and pilot-line inspection of sintered and bonded semiconductor components, complementing the M201X production line.
• X-Wafer P200 W Series Wafer-level lamination system for processing power semiconductor substrates prior to dicing and packaging, supporting wafer-level power device assembly.
• AMX Labs Clean Room & Prototyping Services Service offering providing customers access to AMX's clean room and equipment for prototyping, process characterisation, and joint development of sintered and wafer-level packaging processes.

Quantifiable outcome

• Up to 100 times longer lifetime compared to standard soldered interconnection
• +5 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature3 records

Partnerships

Seven partnerships are on record, tiered core and minor.

• Project Fastlane ConsortiumcoreStrategic or Co-development Partner · 1 March 2024AMX is a proud partner of Project Fastlane, launched in March 2024 under Horizon Europe / Chips Joint Undertaking. This collaborative initiative aims to improve the SiC-based technology supply chain in Europe and support construction of a solid network of highly innovative players. AMX contributes its expertise in pressure sintering and supports the project with process activities in AMX Automatrix Labs, including mechanical characterization, assembly and Ag/Cu material investigations.
• ECPE (European Center for Power Electronics)coreStrategic or Co-development PartnerAMX Automatrix is a member of ECPE, driving innovation in power electronics. ECPE is a European technology platform focused on power electronics research and development collaboration.
• University of Nebraska-LincolncoreStrategic or Co-development PartnerAMX collaborated with the Department of Electrical & Computer Engineering at University of Nebraska-Lincoln. The research team used AMX sintering equipment to conduct studies on novel high-frequency press-pack SiC FET modules, including switch cell design and packaging details with double-sided sintering.
• SiemenscoreStrategic or Co-development PartnerAMX Automatrix has a technological synergy with Siemens for efficiency and compactness in power electronics applications, as mentioned in their blog discussing the collaboration.
• DER-IC (Driving the Electric Revolution Industrialisation Centre) UKcoreStrategic or Co-development PartnerUK's DER-IC, funded by UK Research and Innovation, installed AMX P100 sinter press with Micro-Punch system. DER-IC provides open access facilities for electrification research and development, and is the first facility in the UK to have a sinter press as advanced as the AMX P100.
• CSMT (Consorzio per il Sistema Informativo)minorStrategic or Co-development PartnerCSMT is mentioned as a collaborator in the context of the 'Innovatori di ieri e di oggi' project showcasing innovation in Bergamo and Brescia area.
• kilometrorossominorStrategic or Co-development Partnerkilometrorosso is mentioned as a collaborator in the context of the 'Innovatori di ieri e di oggi' project showcasing innovation in the Bergamo and Brescia area.

Scale indicators2 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• ASM Pacific Technology (ASMPT): Global leader in semiconductor assembly equipment with silver and copper pressure sintering tools targeting the same automotive/EV power module manufacturers as AMX. Direct competitor across mass-production press form factors.
• Kulicke & Soffa Industries: Major semiconductor and LED packaging equipment manufacturer with thermo-compression bonding and power semiconductor assembly offerings. Direct competitor to AMX in power electronics die-attach.
• Yield Engineering Systems (YES): Supplier of semiconductor process equipment including vacuum curing, annealing, and bonding tools for advanced packaging and power electronics manufacturing. Direct competitor to AMX in sintering and adjacent thermal processing.
• EV Group (EVG): Leading supplier of wafer-level bonding, nanoimprint, and semiconductor process equipment. Overlaps with AMX in wafer-level power electronics packaging and advanced bonding solutions.
• BE Semiconductor Industries (Besi): Leading supplier of advanced semiconductor packaging equipment including hybrid bonding and die-attach solutions for power electronics. Direct competitor to AMX's sintering product family in the same Tier 1/OSAT customer base.
• Sonoscan: Global leader in scanning acoustic microscopy for non-destructive testing of electronic components. Direct competitor to AMX's X-SAM line (M51 desktop, M201X inline) for inspection of die-attach interfaces in power electronics.
• Heller Industries: Specialized manufacturer of semiconductor packaging and assembly equipment including die-bonding and convection/reflow systems with parallel coverage to AMX's X-Sinter line for power semiconductor packaging customers.

Broad incumbents

• SÜSS MicroTec: Broader semiconductor equipment manufacturer with lithography, wafer processing, and advanced packaging tools. Overlaps with AMX in backend power electronics but with a much wider product portfolio and scale.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/amx-automatrix-srl

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Amx Automatrix