TPT Wire Bonder

What TPT Wire Bonder does

TPT Wire Bonder GmbH & Co. KG is a German family-owned manufacturer of wire bonding and die bonding equipment for microelectronics development and production. Founded in 1996 by Franz Hickmann and now managed by his sons Fabian and Tobias Hickmann, the company designs and produces manual, semi-automatic, and automatic wire bonders (the HB02, HB05, HB10, HB16, HB100, and HB30 models) plus the HB75 die bonder, with supporting accessories including heater stages, microscopes, bond tools, and bonding wires. The equipment supports wedge-wedge, ball-wedge, bump, and ribbon bonding across gold, aluminum, copper, and platinum wires ranging from 17µm to 500µm in diameter, with ribbon capability up to 2000µm, enabling applications from university R&D prototyping to automotive and battery power electronics assembly.

The company operates from a purpose-built headquarters in Karlsfeld near Munich, constructed in 2017, and generates revenue through three streams: hardware sales of equipment and accessories, contract manufacturing services (prototyping, small-to-medium series production with 5–8 day turnaround), and training/technical support. Distribution spans over 60 countries through a mix of direct sales in Germany/Austria, wholly-owned subsidiaries TPT Japan Co., Ltd. and TPT do Brasil, and a network of regional distributors covering all major semiconductor markets including China, South Korea, Taiwan, India, and Southeast Asia. Pricing is quote-based, reflecting capital equipment configuration variability rather than standardized list pricing.

Customers include research institutions, technology start-ups, and microelectronics manufacturers producing chip-on-board, multi-chip modules, and chip-to-chip assemblies, as well as heavy-wire and ribbon bonding users in power electronics, LED, battery, and automotive segments. The company differentiates on German manufacturing quality, over 30 years of process know-how, a modular equipment architecture (notably the H80 Pick & Place extension that converts wire bonders into die bonders), and a comprehensive consumables and accessories ecosystem. No external institutional investors or funding rounds are associated with the company, which has remained in Hickmann family ownership since founding.

Name

TPT Wire Bonder

Legal name

TPT Wire Bonder GmbH & Co. KG

Website

https://tpt.de

Company type

Private

Founded year

1996

Operating status

Operating

Headcount range

11–50 employees

Short description

TPT Wire Bonder GmbH & Co. KG, founded in 1996 and based in Karlsfeld, Germany, is a family-owned manufacturer of manual, semi-automatic, and automatic wire bonders and die bonders used by universities, microelectronics manufacturers, and power electronics producers in over 60 countries.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• Wire bonding equipment
• Die bonding machines
• Semiconductor packaging equipment
• Microelectronics assembly
• Heavy wire bonding

Headquarters

HQ city

Munich

HQ country

Germany

HQ region

Europe

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Operations, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Wire Bonder and Die Bonder Equipment Sales: Sale of manual, semi-automatic, and automatic wire bonders and die bonders manufactured in Germany. Products include HB02, HB05, HB10, HB16, HB30, HB75, and HB100 models with various automation levels and capabilities.
2. Accessories and Consumables: Sale of complementary products including heater stages, microscopes, cameras, bond tools (wedges, capillaries), bond wires (gold, aluminum, copper), and add-on modules.
3. Contract Manufacturing Services: Wire bonding and die bonding contract services including prototyping, small to medium series production, and microelectronics assembly. Turnaround time of 5-8 working days for typical orders.
4. Training and Support Services: Video training, demonstrations, and technical support services for customers to maximize equipment utilization and process optimization.

Pricing tiers

Go-to-market motion2 records

Distribution channels4 records

Marketing channels3 records

Core offering

TPT Wire Bonder GmbH & Co. KG manufactures manual, semi-automatic, and automatic wire bonders and die bonders used in microelectronics production and research. The company also offers bonding accessories, consumables, and contract manufacturing services including prototyping and small-series production.

Product overview

TPT Wire Bonder is a German manufacturer of manual, semi-automatic, and automatic wire bonders and die bonders used in the development and production of microchips. The product portfolio includes: HB02 (manual wedge-wedge bonder), HB05 (manual wedge/ball bonder), HB10 (semi-automatic with motorized Z-axis), HB16 (semi-automatic with motorized Z- & Y-axis), HB100 R&D and Automatic (fully automatic with motorized XYZ axis and pattern recognition), HB30 (heavy wire bonder for 100-500µm wire and ribbon up to 2000µm), and HB75 (die bonder with Pick & Place capability). The H80 Pick & Place extension kit enables wire bonders to function as die bonders. Supporting equipment includes heater stages (60mm to 150x200mm), microscopes (H220/H240 video measuring, Leica S9E/S9D, Nikon SMZ-460), laser target systems, pull testers, bonding tools and capillaries, and various bond wires (gold, aluminum, copper, ribbon). Services include wire/die bonding, prototyping, and series production.

Differentiator

Problem solved

Functional benefit

Products and services

• HB02 Wire Bonder

Quantifiable outcome

• Contract manufacturing turnaround time of 5-8 working days for typical orders
• +2 more outcomes

Named customers3 records

Segments3 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Ten partnerships are on record, tiered core and major.

• Be First Technology CO., LTDcoreChannel Partner/ Reseller/ DistributorPrimary distributor for China with offices in Beijing, Xi'an, Shenzhen, Chengdu, and Shanghai. Handles sales and support for Chinese market.
• Accelonix BV/SAS/LimitedcoreChannel Partner/ Reseller/ DistributorDistributor covering France, Netherlands, Belgium, and Ireland/UK markets. Multiple offices including France (Evreux), Netherlands (Eindhoven), and UK (Cambridge).
• MCube Technologies Pvt Ltd.coreChannel Partner/ Reseller/ DistributorDistributor for India market based in Pune. Handles sales and technical support for Indian customers.
• AxendmajorChannel Partner/ Reseller/ DistributorDistributor covering Singapore, Indonesia, Malaysia, Philippines, and other Southeast Asian markets. Contact: Mark Barden.
• Three H Corp., Ltd.coreChannel Partner/ Reseller/ DistributorDistributor for South Korea market. Office in Bundang-gu, Seongnam-si, Gyeonggi-do. Contact: Scott Lee.
• Schmidtek Ltd.coreChannel Partner/ Reseller/ DistributorDistributor for Taiwan market. Office in Taipei City. Contact: Chris Liang.
• TPT Japan Co., Ltd.coreChannel Partner/ Reseller/ DistributorDedicated subsidiary in Japan for sales and support. Office in Yokohama. Contact: Toru Chiba.
• COMEF Sp. z o.omajorChannel Partner/ Reseller/ DistributorDistributor for Poland market based in Katowice. Contact: Boguslaw Burak.
• ELECTRON MEC s.r.l.majorChannel Partner/ Reseller/ DistributorDistributor for Italy market based in Gorgonzola, Milan. Contact: Roberto Radice.
• Orbilectron Consulting (Pty) Ltd.majorChannel Partner/ Reseller/ DistributorDistributor for South Africa market. Contact: Chris Botha.

Scale indicators3 records

Recent moves8 records

Expansion highlights5 records

Direct peers

• West·Bond: US-based manufacturer of manual, semi-automatic, and automatic wire bonders and die bonders for microelectronics and hybrid assembly. Overlaps with TPT in the manual and semi-automatic fine-wire segment, particularly for university R&D and defense customers.
• Palomar Technologies: US-based (now part of Coherent) supplier of manual and automatic wire/die bonders for photonic, RF, and microelectronic packaging. Competes with TPT for specialty R&D bonding applications and small-series microelectronics production.
• Kulicke & Soffa Industries: Global market leader in wire bonding equipment and a publicly traded Singapore/US-listed semiconductor equipment company. Directly competes with TPT across manual, semi-automatic, and automatic wire bonders serving microelectronics packaging, though at vastly larger scale and with broader product breadth.
• ASMPT: Hong Kong-listed back-end semiconductor equipment leader with the Hesse & Knipps wire bonder line (acquired German specialty manufacturer). Overlaps with TPT's wedge and ball wire bonder portfolio and competes for both R&D and production customers in advanced packaging.
• F&K Delvotec: German-headquartered manufacturer of manual and automatic wire bonders serving R&D and small-batch production. Closest direct head-to-head competitor to TPT, with overlapping product positioning in flexible, fine-wire bonding for European microelectronics customers.
• Micro Point Pro: Singapore-based precision wire bonder manufacturer targeting small-batch and R&D microelectronics. Overlaps with TPT's manual/semi-automatic product range in Southeast Asia and competes for similar university/start-up customers.

Broad incumbents

• DISCO Corporation: Japanese precision machinery leader focused on back-end semiconductor equipment (dicing, grinding, lasers). Adjacent to TPT's die bonding capability through shared customer base and complementary back-end tooling.
• BE Semiconductor Industries (Besi): Dutch-listed back-end semiconductor equipment vendor with wire bonders, die bonders, and hybrid bonding tools. Overlaps with TPT's die bonding portfolio and competes across the microelectronics assembly value chain with significantly broader scope.
• Canon (formerly Canon Machinery / Wire Bonder Business): Japanese conglomerate's wire bonder division produces manual and automatic wire bonders sold primarily to Japanese semiconductor and electronics manufacturers. Competes with TPT in fine-wire ball bonding, especially in Japan where TPT operates through TPT Japan Co., Ltd.

Emerging players

• FINETECH (Dr. Finetech): German micro-assembly equipment specialist focused on die bonders and flip-chip bonders. Competes more directly with TPT's HB75 die bonder / H80 Pick & Place extension than its wire bonder business, particularly in optoelectronic and MEMS assembly.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/user/TPTWirebonders
• LinkedInlinkedin.com/company/tpt-wire-bonder

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about TPT Wire Bonder