Name

Teikoku Taping System

Legal name

Teikoku Taping System Co., Ltd.

Website

https://teikoku-taping.com

Company type

Private

Founded year

1995

Operating status

Operating

Headcount range

1–10 employees

Ownership category

akta.pro rank

Product category

Semiconductor Back-End Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Special Industry Machinery (No Metalworking Machinery) (3550)

akta.pro primary industry

Etch & Strip Equipment (Dry/Wet/Ashing) (HDAHAEAC)

Keywords

• Semiconductor back-end equipment
• Wafer tape laminators
• Tape removal systems
• Wafer mounting equipment
• UV-LED irradiation systems

Headquarters

HQ city

Nagoya

HQ country

Japan

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor Manufacturing Equipment Sales: Sale of tape laminators, tape removers, wafer mounters, UV-LED irradiation machines, and special equipment for semiconductor back-end manufacturing. Equipment includes various models supporting 200mm and 300mm wafers with different carrier configurations.
2. Maintenance and Support Services: After-sales service including consultation on business plans, design, manufacturing, cost studies, and post-installation support services.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels4 records

Core offering

Teikoku Taping System designs, develops, manufactures, sells, and services semiconductor back-end manufacturing equipment specialized in three core processes: "laminating" (Haru/貼り付け), "peeling" (Hagasu/剥がす), and "transporting" (Hakobu/運ぶ). Its portfolio includes tape laminators, tape removers, wafer mounters, UV-LED irradiation machines, and custom special equipment supporting 4- to 12-inch wafers for semiconductor manufacturers and foundries worldwide.

Product overview

Teikoku Taping System is a semiconductor manufacturing equipment manufacturer specializing in back-end process equipment for 'laminating, peeling, and transporting' (Haru, Hagasu, Hakobu). The product portfolio consists of five core product categories: Laminator (tape lamination equipment including vacuum and non-vacuum models for 200-300mm wafers), Remover (tape removal/debonding equipment), Mounter (wafer-to-frame tape mounting equipment), UV-LED (UV irradiation equipment for dicing tape processing), and Special Equipment (custom panel processing equipment). Products range from fully automatic systems with recipe-controlled parameters to models supporting ultra-thin wafers and various cutting methods (digital cutter blade and CO2 laser). The company serves the semiconductor industry with equipment supporting wafer sizes from 4 to 12 inches.

Differentiator

Problem solved

Functional benefit

Products and services

• Laminator (全自動テープラミネーター / Fully Automatic Tape Laminator) A category of tape lamination equipment for semiconductor manufacturing, including vacuum and non-vacuum models supporting 200mm to 300mm wafers. Features digital cutter blade and CO2 laser cutting methods, with maximum vacuum capability up to 100Pa. Used by semiconductor manufacturers for wafer protection during back-end processing.
• Remover (全自動テープリムーバー / Fully Automatic Tape Remover) Tape removal/debonding equipment used to peel wafers from frames after dicing. Supports 200mm and 300mm wafer sizes with 1-carrier or 2-carrier systems and LED UV irradiation peeling method. Used by semiconductor manufacturers for wafer debonding in back-end packaging processes.
• Mounter (全自動ウエハーテープマウンター / Fully Automatic Wafer Tape Mounter) Wafer tape mounter equipment for attaching wafers to frames. Handles ultra-thin wafers and wafers with large warpage, supporting 4 to 12 inch wafers with both roll tape and pre-cut tape options. Used by semiconductor manufacturers for wafer mounting prior to dicing.
• UV-LED (UV照射機 / UV Irradiation Machine) UV-LED irradiation equipment for dicing tape processing, compatible with 300mm ring frame transfer and 8 to 12 inch wafers. Provides recipe-controlled UV parameters for tape curing. Used by semiconductor manufacturers as part of the dicing and packaging process flow.
• Special Equipment (特殊対応装置) Custom special equipment including the fully automatic panel laminator (CPL-300CS) and panel debonder (CMD-300CS) for handling special metal panels using the TTS digital cutter system. Supports pre-cut tape, tape removal, LED UV irradiation, and vacuum lamination options for non-standard semiconductor and panel processing applications.

Quantifiable outcome

• Recipe-controlled parameters ensure consistent processing quality
• +1 more outcomes

Segments2 records

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Seven partnerships are on record, tiered core, major and minor.

• Teikoku Taping System (Singapore) Pte LtdcoreStrategic or Co-development Partner · 1 January 2014Wholly-owned subsidiary established in Singapore in January 2014 to provide service and sales support for Southeast Asian customers. Acts as regional headquarters for Southeast Asia operations.
• Teikoku Taping System, Inc.coreStrategic or Co-development Partner · 1 October 2011Wholly-owned subsidiary established in Phoenix, Arizona, USA in October 2011 to provide service and sales support for North American customers. Acts as regional headquarters for North America operations.
• Jipal Corporation (Taiwan)majorChannel Partner/ Reseller/ DistributorExclusive distributor for Taiwan market. Located at Hsinchu (HQ): 18F-8, 295, Sec.2 Kuang Fu Road, Hsinchu, Taiwan.
• GYL Technology Co., Ltd. (Korea)majorChannel Partner/ Reseller/ DistributorDistributor for Korea market. Located at #101, 30-29 Tongjeong 8-ro, Dongnam-gu, Cheonan-si, Chungnam, Korea 31207.
• S3 Alliance (UK, Germany, Russia, Italy)majorChannel Partner/ Reseller/ DistributorEuropean distributor network covering UK, Germany, Russia, and Italy markets. UK office: Skeoge Industrial Estate, Beraghmore Road, Derry, BT48 8SE, N. Ireland. Germany office: MahdenstraBe 23, D-72138 Kirchentellinsfurt, Germany.
• M7 TECHNOLOGY SOLUTIONS, INC. (Philippines)minorChannel Partner/ Reseller/ DistributorDistributor for Philippines market. Located at Unit 2513 Entrata Urban Complex, Civic Drive, Filinvest Corporate City, Alabang, Muntinlupia City, Philippines.
• Jipal Hi-Tech Pte Ltd (Malaysia)minorChannel Partner/ Reseller/ DistributorDistributor for Malaysia market. Located at A POSH Bizhub, 1 Yishun Industrial Street 1, #05-07, Singapore 768160.

Scale indicators6 records

Recent moves9 records

Expansion highlights4 records

Broad incumbents

• ULVAC, Inc. Japanese supplier of vacuum and semiconductor manufacturing equipment spanning deposition, etching, and packaging. A broader incumbent in the same semiconductor equipment category serving overlapping fab customers.
• BE Semiconductor Industries N.V. (Besi): Netherlands-based leader in die-bonding and advanced packaging equipment for semiconductor back-end. A broadly overlapping back-end equipment incumbent addressing the same advanced packaging customers and similar wafer-to-package workflows.
• ASMPT Limited: Hong Kong-headquartered global leader in semiconductor packaging and SMT assembly equipment. A much larger incumbent serving the same back-end packaging customers with broader portfolios including die bonding and encapsulation that overlap with TTS's tape-and-mount workflow.
• Kulicke & Soffa Industries: Singapore-headquartered semiconductor and LED packaging equipment supplier, particularly in wire bonding. A broader incumbent serving back-end semiconductor assembly customers where TTS also participates in adjacent process steps.

Direct peers

• TOWA Corporation: Japanese manufacturer of semiconductor molding equipment for back-end packaging. Adjacent peer operating in the same back-end semiconductor equipment category serving IDMs and OSATs with related production equipment.
• DISCO Corporation: Japanese leader in semiconductor dicing and grinding equipment serving the same back-end wafer processing customers. Direct competitor in dicing preparation equipment where TTS supplies tape laminators, mounters, and removers.
• Tokyo Seimitsu (Accretech): Japanese maker of semiconductor dicing saws, probes, and inspection equipment. Competes with TTS in back-end dicing prep and shares a similar focus on precision wafer-handling equipment for semiconductor manufacturers.

Others

• Nitto Denko Corporation: Japanese specialty materials producer including industrial and semiconductor adhesive tapes. A materials supplier whose products are consumed in the back-end tape processes where TTS's equipment operates.

Emerging players

• LINTEC Corporation: Japanese specialty adhesive tape manufacturer including dicing tape and back-grinding tape used with TTS equipment. An adjacent/emerging peer whose semiconductor tape consumables interface directly with TTS's lamination and debonding tools.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/teikoku-taping-system-inc

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Teikoku Taping System