What Raysun Technology does

Raysun Technology (镭神泰克科技 / Lasertc) is a Suzhou-based, privately held developer and manufacturer of high-end precision laser processing equipment for the semiconductor industry, founded in October 2021. The company focuses exclusively on laser applications for wafer manufacturing and advanced packaging, with a five-category product portfolio covering laser cutting, drilling, heat treatment (IGBT and SiC annealing), finishing, and marking — the marking line alone spans wafer front/back/ID, strip, in-tray, and boat-carrier systems. Its technology stack integrates proprietary optical systems, ultra-high-speed marking modules, ultra-precision vision positioning (±5μm to ±50μm depending on product), automatic focus control, fully closed-loop data systems, built-in APC power monitoring, warpage-adaptive wafer handling, and full-fab automation protocol support (SECS/GEM, CIM, MES, E-Mapping).

The company has broken foreign laser technology monopolies in advanced packaging and claims the only domestic mass production case for certain specialized laser applications, serving over 100 leading customers including domestic top-tier wafer manufacturers and international/domestic packaging and testing companies such as 日月新集团 (Sun Yue Xin Group) and 锡圆电子科技(无锡)有限公司 (Xi Yuan Electronic Technology Wuxi). It holds over 50 intellectual property patents, operates a 3,000+ square meter laser laboratory in Suzhou Industrial Park, and was recognized in 2025 as both a Jiangsu Provincial Specialized, Refined, and Innovative Enterprise (专精特新企业) and a Jiangsu Potential Unicorn Enterprise.

Raysun operates a direct enterprise sales model targeting semiconductor wafer fabs and advanced packaging houses, with quote-based pricing (no public list prices), custom configuration, on-site installation, and ongoing technical support. Its go-to-market combines direct field sales with event-driven demand generation — including SEMICON CHINA 2026 (booth E6271), the Dacheny Entrepreneur Summit (November 2025), and direct general-manager customer engagement meetings. The company has raised two institutional rounds in 2025 (Fortune Venture Capital in January and Addor Capital in October), reflecting active capital deployment for R&D scale-up and product portfolio expansion into AI chip, AR device, and HBM memory manufacturing applications.

Name

Raysun Technology

Legal name

镭神泰克科技（苏州）有限公司

Website

https://lasertc.com

Company type

Private

Founded year

2021

Operating status

Operating

Short description

Raysun Technology (镭神泰克) is a Suzhou-based manufacturer of high-end precision laser processing equipment for semiconductor wafer fabrication and advanced packaging, serving 100+ domestic wafer fab and packaging/test customers with cutting, drilling, annealing, finishing, and marking systems.

Ownership category

akta.pro rank

Product category

Semiconductor Laser Processing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Optical Instruments & Lenses (3827)

akta.pro primary industry

Lithography Equipment (DUV/EUV) (HDAHAEAA)

Keywords

• Semiconductor laser equipment
• Laser precision processing
• Advanced packaging equipment
• Wafer manufacturing tools
• Laser marking systems

Headquarters

HQ city

Suzhou

HQ country

China

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Laser Precision Processing Equipment Sales: The company generates revenue primarily through the sale of high-end laser precision processing equipment for semiconductor manufacturing and advanced packaging, including laser cutting, drilling, heat treatment, finishing, and marking systems. As a B2B equipment manufacturer serving leading semiconductor companies, each sale involves significant contract value with custom configuration and professional installation services.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels4 records

Core offering

Raysun Technology (镭神泰克 / Lasertc) designs, develops, and manufactures high-end laser precision processing equipment for semiconductor wafer manufacturing and advanced packaging. Its product matrix covers laser cutting, laser drilling, laser heat treatment (annealing), laser finishing, and laser marking, sold directly to leading domestic semiconductor wafer fabs and packaging and testing customers with custom configuration and on-site installation services.

Product overview

Raysun Technology (镭神泰克) is a leading domestic provider of high-end precision laser processing equipment for semiconductor wafer manufacturing and advanced packaging. The company offers a comprehensive product portfolio organized into five main solution categories: Laser Cutting (激光切割), Laser Drilling (激光钻孔), Laser Heat Treatment (激光热处理), Laser Finishing (激光精加工), and Laser Marking (激光打标). The Laser Cutting line includes LA611UD for full-automatic RF device cutting and SC622U-F for PCB/substrate cutting. Laser Drilling solutions feature the LA644U-P (POP/TMV laser drilling with 4-laser head configuration) and LA611U-MP (semi-automatic drilling). The WA310UF provides laser annealing for IGBT and SiC wafers. The Laser Marking portfolio is the most extensive, covering wafer-level marking (晶圆背打, 晶圆正打, 晶圆ID打标), strip marking (双台车料条打标, 2in2out料条打标, 料条打标), in-tray marking (TM622G, In Tray打标), and boat carrier marking (Boat打标). All equipment integrates industrial protocols including SECS/GEM, CIM, MES, and E-Mapping for semiconductor factory automation.

Differentiator

Problem solved

Functional benefit

Products and services

• LA611UD Laser Cutting System Full-automatic laser cutting system for Saw, Baw, and RF device module film cutting and other high-precision cutting applications, designed for semiconductor manufacturers. Features slot auto loading/unloading, cutting precision of ±15 μm, and vision-based quality inspection.
• SC622U-F Substrate and PCB Laser Cutting System Substrate and PCB laser cutting system for full-cut or partial-cut of PKG products and shaped cutting, featuring automatic image recognition positioning, ±5 μm positioning/repeatability precision, and vision defect detection for semiconductor packaging customers.
• Full-Automatic Laser Film-Opening Equipment (全自动激光开膜设备) Full-automatic laser film-opening equipment used in semiconductor manufacturing processes, designed for opening/debonding films on wafers and packages.
• PCB Cutting Equipment (PCB切割设备) PCB cutting equipment for substrate and package product processing in semiconductor and electronics manufacturing.
• LA644U-P POP (TMV) Laser Drilling System POP (TMV) laser drilling system with 4-station 4-laser head simultaneous operation for ultra-high UPH, targeting semiconductor advanced packaging customers. Features diversified cleaning systems, ultra-high precision vision positioning, auto-focus system, and full AOI-level vision inspection.
• LA611U-MP Semi-Automatic Laser Drilling System Semi-automatic laser drilling system for semiconductor packaging and PCB materials, offering low cost, high operational flexibility, compact footprint, ultra-high precision vision positioning, and auto-focus system.
• Full-Automatic Laser Drilling Equipment (全自动钻孔设备) Full-automatic laser drilling equipment for semiconductor manufacturing, designed for high-throughput via and TSV drilling.
• Semi-Automatic Laser Drilling Equipment (半自动钻孔设备) Semi-automatic laser drilling equipment for flexible production of small batches and multiple varieties, suited to semiconductor R&D and prototyping environments.
• WA310UF Laser Annealing System for IGBT and SiC Wafers Laser annealing system for IGBT and SiC wafer processing. IGBT version achieves activation depth greater than 2 μm without thermo-damage to sensitive areas; SiC version enables MOSFET ohmic contact formation with no heat damage and a high-quality flat-top line beam.
• Laser Finishing Equipment (激光精加工) Laser finishing equipment for semiconductor manufacturing processes, used for surface finishing operations on wafers and packages.
• TM622G In-Tray Laser Marking System In-tray laser marking system with marking accuracy of ±75 μm, suitable for PKG size greater than 2×2 mm, minimum depth marking of 15 μm, AOI quality check function with minimum 50 μm × 50 μm defect detectability, and support for SECS/GEM, CIM, MES, E-Mapping protocols.
• Wafer Back-Side Laser Marking System (晶圆背打) Wafer back-side laser marking system for WLCSP, FO soft wafer, and wafer back-side through-film marking, featuring ±50 μm marking position accuracy, multi-laser beam for high productivity, optimized warpage wafer handling, and built-in APC and vision alignment systems.
• Wafer Front-Side Laser Marking System (晶圆正打) Wafer front-side laser marking system for wafer front-side marking and Reject Dies marking, using a high-precision marble platform, proprietary optical system, and high-speed marking module with CCD imaging for precision alignment.
• Wafer-Level Laser ID Marking System (晶圆ID打标) Wafer-level laser ID marking system for wafer ID and wafer back-transfer ID marking, featuring a high-precision marble platform, proprietary optical system, high-resolution CCD, and fully automated operation.
• Dual-Shuttle Strip Marking System (双台车料条打标) Table shuttle type strip marking system with ±50 μm marking accuracy, suitable for PKG size greater than 0.4×0.2 mm, with Alpha 1/Alpha 2 advanced pitch correction, self-auto grid calibration, depth marking under 10 μm, AOI quality check with minimum 50 μm × 50 μm defect detection, and support for SECS/GEM, CIM, MES, E-Mapping.
• 2-in-2-out Strip Marking System (2in2out料条打标) 2-in-2-out strip marking system supporting QFN, LGA, BGA, QFP, SO packages with EMC, bare die, lid, SR marking. Features 1064nm/532nm/355nm wavelength options, no chip damage marking, low depth marking, AOI quality check, and SECS/GEM, CIM, MES, E-Mapping protocol support.
• Strip Marking System SM622G Platform (料条打标) Strip marking system for semiconductor packaging applications built on the SM622G platform.
• Boat Carrier Laser Marking System (Boat打标) High-precision laser marking equipment for semiconductor boat carriers including EMC marking, bare die marking, SR green paint marking, and metal shell marking. Features a high-precision marble platform, proprietary optical system, customizable beam shape (IR/Green), and built-in APC energy monitoring.

Quantifiable outcome

• Over 100 major semiconductor customers served including domestic leading wafer manufacturers and international packaging and testing companies.
• +3 more outcomes

Named customers3 records

Segments3 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature10 records

Partnerships

One partnership is on record.

• Domestic Leading Wafer Manufacturers and Packaging Test CompaniescoreStrategic or Co-development PartnerThe company has established strategic partnerships with over 100 leading domestic semiconductor wafer manufacturers and packaging test companies. For some specialized laser applications, the company has become the only domestic mass production case, demonstrating deep co-development and collaboration with customers on advanced semiconductor laser processing solutions.

Scale indicators6 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• Hanmi Semiconductor: Korean supplier of laser sawing and sorting equipment for semiconductor packaging, with strong penetration at SK Hynix for HBM. A direct competitor to Raysun's laser cutting/drilling offerings serving similar advanced packaging customers.
• Suzhou Delphi Laser (苏州德龙激光): Chinese laser equipment maker specializing in semiconductor, display, and electronics applications including laser cutting, drilling, and marking. Most direct domestic Chinese peer to Raysun with overlapping laser precision processing product lines for semiconductor customers.
• ADTEC Engineering: Japanese manufacturer of laser dicing, grooving, and scribing systems for semiconductor wafers. Closely comparable product portfolio to Raysun's laser cutting and drilling equipment, serving global wafer fabs and advanced packaging customers.
• Hymson Laser Intelligent Equipment (海目星): Chinese laser equipment maker serving lithium battery, display, and semiconductor applications. Directly comparable as a domestic Chinese supplier of precision laser equipment for semiconductor manufacturing with similar product positioning.

Broad incumbents

• HGTECH (华工科技): Major Chinese laser and optoelectronics equipment maker with semiconductor processing exposure. Comparable as a domestic Chinese laser equipment supplier targeting semiconductor manufacturing customers.
• DISCO Corporation: Japanese global leader in dicing, grinding, and laser-based precision processing equipment for semiconductor wafer manufacturing and advanced packaging. Directly competes with Raysun in laser cutting/drilling for advanced packages but operates at vastly larger scale with a global installed base.
• ASMPT (ASM Pacific Technology): Global semiconductor packaging equipment leader offering die bonding, packaging, and related laser tools. Comparable to Raysun as a global capital equipment supplier to advanced packaging customers, though much larger and broader in scope.
• Han's Laser (大族激光): Large Chinese laser equipment conglomerate serving electronics, semiconductor, and panel industries. Overlaps with Raysun in laser-based semiconductor processing but operates a much broader, more diversified laser equipment portfolio.
• Kulicke & Soffa Industries: Singapore-headquartered semiconductor packaging equipment maker with wire bonding and advanced packaging exposure. Comparable to Raysun in serving OSAT and packaging customers with capital equipment, though from a much larger and more diversified base.

Regional players

• Tokyo Seimitsu (Accretech): Japanese manufacturer of semiconductor wafer probing, dicing, and CMP equipment with laser processing exposure. Comparable product portfolio for wafer-level processing, primarily serving Japanese and broader Asian customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds2 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Raysun Technology