MPE, Inc.
MPE, Inc. is an ITAR-registered contract semiconductor services provider in Greenville, Texas, founded in 1993, offering wafer dicing, wafer resizing (including 300mm downsizing), edge grinding, and laser scribing to semiconductor, defense, medical, optics, and academic customers.
- Company typePrivate
- Founded1993
- HeadquartersGreenville, United States
- Headcount1–10
- GTM typeB2B
- OfferingServices
What MPE, Inc. does
MPE, Inc. (Micro Precision Engineering) is an ITAR-registered, privately held semiconductor services company founded in 1993 and based in an 8,000-square-foot facility in Greenville, Texas, northeast of Dallas. The company performs contract wafer processing — principally wafer dicing (die singulation), wafer resizing/coring (including 300mm downsizing), wafer edge grinding, and fiber laser scribing for wafer ID marking — for semiconductor manufacturers, defense contractors, medical device firms, optics companies, and academic research institutions. Equipment includes Loadpoint dicing saws, wafer coring and edge grinding systems, and fiber laser scribing systems; all work is performed under documented ESD controls (wrist straps, ESD mats, ionized work stations, ESD dicing film).
The company's revenue model is professional-services / project-based, with quote-based pricing submitted through an online form, email, or a toll-free line. Orders range from single wafers to hundreds per month, with standard lead times of 4–5 days and 1–2 business day expedites. Technical capabilities span materials including silicon, SOI, GaN, SiC, germanium, glass, fused silica, alumina, AlN, lithium niobate, SiGe, and Lexan, with wafer sizes from 2" (50mm) through 12" (300mm) and thicknesses from 0.050mm to 6.250mm. Tolerances include kerf widths as thin as 0.020mm, OD tolerance of +/- 0.100mm, and SEMI M1-compliant flats and notches.
MPE positions itself as an overflow and specialty partner: smaller fabs without in-house dicing rely on it for full-service processing, while mid-to-large fabs use it for capacity overflow and R&D projects. There is no public revenue disclosure, no external funding, no M&A activity, and no named customer logos; the company states it has served "hundreds of satisfied customers all over the world" across analog, memory, ROIC, microwave, RF, MEMS, optoelectronic, sensor, and photonic device categories.
MPE, Inc. firmographics
Firmographics- Name
- MPE, Inc.
- Legal name
- MPE, Inc.
- Website
- https://micrope.com
- Company type
- Private
- Founded year
- 1993
- Operating status
- Operating
- Headcount range
- 1–10 employees
- Short description
- MPE, Inc. is an ITAR-registered contract semiconductor services provider in Greenville, Texas, founded in 1993, offering wafer dicing, wafer resizing (including 300mm downsizing), edge grinding, and laser scribing to semiconductor, defense, medical, optics, and academic customers.
- Ownership category
- akta.pro rank
MPE, Inc. industry classification
Industry- Product category
- Semiconductor Wafer Processing Services
- NAICS
- Semiconductor and Related Device Manufacturing (334413)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)
- akta.pro secondary industry
- R&D / Prototyping & MPW Shuttle Foundries (HDAHACAI)
Keywords
Where MPE, Inc. is headquartered
LocationHeadquarters
- HQ city
- Greenville
- HQ country
- United States
- HQ region
- North America
Offices1 record
Markets served
MPE, Inc. business model
Business model- GTM type
- B2B
- Offering type
- Services
- Cost components
- Personnel, Operations, Technology or R&D, Infrastructure
Revenue model
- Wafer Dicing Services: Custom wafer dicing/singulation services for integrated circuits, custom substrates, and advanced dicing projects. Billed per project or per wafer order, ranging from single wafers to hundreds of wafers per month.
- Wafer Resizing/Coring Services: Silicon and SOI wafer resizing services including 300mm wafer downsizing. Also handles glass, germanium, and other materials. Process accepts orders from single wafers to hundreds per month.
- Laser Scribing Services: Fiber laser scribing for wafer ID marking, available as standalone service or bundled with wafer resizing.
- Edge Grinding Services: Wafer edge grinding services for rounded and beveled edge profiles, performed on-site or on wafers cored by outside services.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Pay-as-you-go | Custom quote-based pricing |
Go-to-market motion1 record
Distribution channels2 records
Marketing channels4 records
MPE, Inc. product offering
Product offeringCore offering
MPE, Inc. (Micro Precision Engineering) provides custom wafer dicing, silicon and SOI wafer resizing, 300mm wafer downsizing, wafer edge grinding, and fiber laser wafer scribing services for the semiconductor industry. The company serves as an outsourced processing partner for semiconductor manufacturers, defense contractors, medical device firms, and research institutions needing precision wafer fabrication, die singulation, and wafer size conversion with fast turnaround.
Product overview
MPE, Inc. (Micro Precision Engineering) is a precision engineering services company offering a portfolio of wafer processing services for the semiconductor industry. The core offerings include Wafer Dicing Services (using Loadpoint dicing saws for die singulation), Wafer Resizing/Coring Services (silicon and SOI wafer downsizing), 300mm Wafer Downsizing (converting 300mm wafers to smaller sizes), Wafer Edge Grinding Services (R-type and F-type profiles for edge rounding/beveling), and Laser Scribing/Wafer ID (fiber laser marking per SEMI standards). Supporting services include Diced Wafer Packaging (UV and blue dicing films, grip rings, frames, shippers) and Advanced Dicing Projects (bonded wafer stacks, exotic materials, custom cuts). The company processes various materials including silicon, SOI, GaN, glass, quartz, germanium, SiC, alumina, and others, with wafer sizes from 50mm to 300mm and thicknesses from 0.050mm to 6.250mm.
Differentiator
Problem solved
Functional benefit
Products and services
- Wafer Dicing Services Custom wafer dicing (die singulation/mechanical sawing) using Loadpoint dicing saws with Windows-based operating systems. Processes wafers up to 300mm diameter and 0.050mm to 6.250mm thickness, with kerf widths as thin as 0.020mm. Supports beveled/chamfered cuts, bumped and non-bumped wafers, trench cuts, through cuts, coring cuts, and straight cuts. Serves semiconductor manufacturers needing precise die separation.
- Wafer Resizing/Coring Services Silicon (Si) and silicon-on-insulator (SOI) wafer resizing (wafer coring, downsizing, cut-down). Processes wafers up to 300mm diameter and as thin as 0.150mm, producing resized wafers from 50mm to 200mm with SEMI-standard flats/notches, edge rounding/beveling. Can yield multiple resized wafers from a single parent wafer. Serves semiconductor manufacturers needing wafer size conversion.
- 300mm Wafer Downsizing Specialized downsizing service converting 300mm wafers to smaller sizes, including 300mm to 200mm (single wafer), 300mm to 150mm (up to two wafers), 300mm to 100mm (up to five wafers), and custom layouts. Enables use of 300mm wafers in 200mm and smaller tool sets.
- Wafer Edge Grinding Services Custom wafer edge grinding using multiple systems to create rounded and beveled edge profiles in silicon wafers or other crystalline materials. Equipment handles wafer diameters from 2" (50mm) to 8" (200mm) with R-type and F-type profiles meeting SEMI M1 T/3 Template requirements.
- Laser Scribing/Wafer ID Fiber laser scribing for text/ID marking on silicon and semiconductor wafers using industry-standard SEMI OCR font per SEMI M12/M13 standard. Supports frontside and backside scribing, customizable character heights (2mm standard), ID transposition to downsized wafers, and checksum generation per SEMI algorithm.
- Diced Wafer Packaging Dicing film and packaging services including UV dicing film (Ultron 1043R, Nitto DU-300) and blue dicing film (Ultron 1009R), along with grip rings, frames, and shippers in four sizes (4", 6", 8", and 12"). UV films are UV-exposed before return for easy die removal.
- Advanced Dicing Projects Specialized dicing services for unique requirements beyond basic dicing tools, including stacks of bonded wafers (silicon on glass, GaN on SiC), beveled/chamfered edges, grooves, partial-depth cuts for scribe-and-break, and exotic/uncommon materials with non-standard shapes, thicknesses, and sizes.
Quantifiable outcome
- Normal lead time of 4-5 days
- +5 more outcomes
Companies that use MPE, Inc.
Customer profileNamed customers5 records
Segments5 records
Ideal customer profiles4 records
MPE, Inc. technology and API
TechnologyTechnology focussed No
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature4 records
MPE, Inc. partnerships and signals
Strategic signalScale indicators3 records
Expansion highlights4 records
MPE, Inc. competitors and assessment
Company assessmentOthers
- Nitto Denko: Japan-based materials manufacturer supplying UV and blue dicing tapes (e.g., Nitto DU-300) that MPE uses in its diced wafer packaging service. Comparable as a critical materials supplier in the wafer-dicing workflow MPE executes.
- Ultron Systems: Manufacturer of UV-curable dicing films (e.g., Ultron 1043R, Ultron 1009R) referenced in MPE's diced wafer packaging offering. Comparable as a consumables supplier whose products are specified in MPE's packaging process.
Broad incumbents
- Kulicke & Soffa Industries: Global semiconductor and LED assembly equipment supplier with dicing and related back-end packaging tools. Comparable as a broader incumbent whose dicing equipment competes with the platform MPE relies on and whose customer base overlaps.
- DISCO Corporation: Japan-based global leader in wafer dicing and grinding equipment, also offering dicing service operations. Directly comparable as MPE's core process (dicing + grinding) sits inside DISCO's product and service portfolio, though DISCO is vastly larger and equipment-centric.
- SÜSS MicroTec: Germany-based supplier of lithography, bonding, and back-end semiconductor process equipment. Comparable because SÜSS addresses the adjacent wafer-preparation and advanced-packaging process chain that encompasses MPE's dicing and resizing scope.
Emerging players
- IPG Photonics: U.S.-based fiber laser manufacturer whose products (including fiber lasers for marking/scribing) underpin MPE's laser scribing service. Comparable because IPG's laser technology is a key input to wafer-ID scribing workflows used at MPE.
Direct peers
- Advanced Dicing Technologies (ADT): Israel-based manufacturer of dicing saws and precision dicing equipment serving semiconductor and advanced packaging customers. Comparable because ADT sells the same class of dicing tools MPE operates and serves an overlapping wafer-processing customer base.
- Logitech International: UK/Scotland-based precision equipment supplier for wafer dicing, thinning, polishing, and lapping. Comparable to MPE because its equipment portfolio (dicing saws, edge grinders) underpins the same wafer-preparation services MPE provides.
- Valley Design Corp: U.S.-based specialty precision wafer dicing, lapping, polishing, and thinning services provider. Closely comparable to MPE as a similarly sized service shop offering custom wafer sizing and edge preparation to semiconductor and optics customers.
- Ceia S.p.A. Italy-based manufacturer of dicing and wafer-handling equipment with related service offerings. Comparable to MPE because Ceia's equipment supports the same wafer-dicing workflow MPE performs for its customers.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat4 records
Key risks5 records
Key highlights6 records
Customer concentration
MPE, Inc. social profiles
Digital presenceMPE, Inc. financial estimates
Financial estimateRevenue estimate
Valuation estimate
MPE, Inc. leadership team
Management profileNumber of profiles
MPE, Inc. funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
MPE, Inc. M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about MPE, Inc.
What does MPE, Inc. do?
MPE, Inc. (Micro Precision Engineering) provides custom wafer dicing, silicon and SOI wafer resizing, 300mm wafer downsizing, wafer edge grinding, and fiber laser wafer scribing services for the semiconductor industry. The company serves as an outsourced processing partner for semiconductor manufacturers, defense contractors, medical device firms, and research institutions needing precision wafer fabrication, die singulation, and wafer size conversion with fast turnaround.
When was MPE, Inc. founded?
MPE, Inc. was founded in 1993. It employs 1 to 10 people.
Where is MPE, Inc. based?
MPE, Inc. is headquartered in Greenville, United States, in the North America region.
How does MPE, Inc. make money?
Four revenue lines are on record. Wafer Dicing Services are the primary driver. The others are wafer Resizing/Coring Services, laser Scribing Services and edge Grinding Services.
Who are MPE, Inc.'s main competitors?
Others on record are Nitto Denko and Ultron Systems. Broad incumbents are Kulicke & Soffa Industries, DISCO Corporation and SÜSS MicroTec. IPG Photonics is listed as an emerging player. Direct peers are Advanced Dicing Technologies (ADT), Logitech International, Valley Design Corp and Ceia S.p.A..
Does MPE, Inc. have an API?
No public API is recorded for MPE, Inc..
What industry is MPE, Inc. in?
MPE, Inc.'s product category is Semiconductor Wafer Processing Services. Its primary akta.pro industry code is HDAHACAH, Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim), with a secondary code of HDAHACAI, R&D / Prototyping & MPW Shuttle Foundries. Its NAICS code is 334413 and its SIC code is 3674.