Teramount
- Company typePrivate
- Founded2013
- HeadquartersJerusalem, Israel
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
Teramount firmographics
Firmographics- Name
- Teramount
- Legal name
- Teramount Ltd.
- Website
- https://teramount.com
- Company type
- Private
- Founded year
- 2013
- Operating status
- Acquired
- Headcount range
- 11–50 employees
- Ownership category
- akta.pro rank
Teramount industry classification
Industry- Product category
- Silicon Photonics Interconnect
- NAICS
- Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441), Electronic Connector Manufacturing (334417)
- SIC
- Semiconductors & Related Devices (3674), Electronic Connectors (3678), Computer Communications Equipment (3576)
- akta.pro primary industry
- Optoelectronic Receivers & Transceivers (Photodetectors/Optical Modules) (HDAHALAM)
- akta.pro secondary industries
- Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser) (HDAHACAG), Optical Transceivers (SFP/SFP+/SFP28/QSFP/QSFP-DD/OSFP) (HDAFAEAE), Networking & Data Center Silicon (Switch/NIC/DPU/SerDes) (HDAHABAB)
Keywords
Where Teramount is headquartered
LocationHeadquarters
- HQ city
- Jerusalem
- HQ country
- Israel
- HQ region
- Middle East
Offices1 record
Markets served
Teramount business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Technology or R&D, Operations, Marketing or Sales, Supply Chain
Revenue model
- Silicon photonics component/IP licensing: Pre-acquisition: Teramount generated revenue by licensing its Universal Photonic Coupler, Photonic-Plug and Photonic-Bump designs and supplying engineering expertise to foundries and OSATs for integration into high-volume silicon photonics manufacturing. Revenue model relies on design wins, PDK integrations (e.g., Tower PH18, GlobalFoundries 45CLO Fotonix), and component supply.
- Component / engineering services revenue (now via Molex Optical Solutions): Post-acquisition (May 2026): Teramount operates as a design and engineering hub for Molex's Optical Connectivity segment. Revenue streams flow through Molex's global optical interconnect portfolio, combining component supply with system-level optical solutions for CPO and silicon photonics customers.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | — | Quote-based enterprise pricing for foundry/OSAT integrations |
Go-to-market motion3 records
Distribution channels4 records
Marketing channels6 records
Teramount product offering
Product offeringCore offering
Teramount develops and supplies the Universal Photonic Coupler — a wafer-level fiber-to-chip interconnect platform combining proprietary self-aligning optics, Photonic-Plug fiber connectors, Photonic-Bump wafer-level optical elements, and wideband surface coupling. Its products (TeraVERSE, TeraVERSE-XD, TeraSPOT) deliver detachable, passive-alignment fiber-to-chip connectivity for silicon photonics chips used in co-packaged optics, pluggable transceivers, AI/ML processors, switches, and HPC fabrics. The technology is sold and licensed to semiconductor foundries, OSATs, equipment vendors, and (post-acquisition) hyperscalers via Molex's global optical interconnect portfolio.
Differentiator
Problem solved
Functional benefit
Brands
- TeraVERSE: Detachable and serviceable fiber connectivity product optimized for co-packaged optics (CPO), supporting single-mode and polarization-maintaining optical fibers on a silicon photonics chip.
- TeraSPOT
- Universal Photonic Coupler
- PhotonicPlug
- PhotonicBump
Products and services
- Universal Photonic Coupler Platform-level fiber-to-chip interconnect product family connecting single-mode and polarization-maintaining fibers to silicon photonics chips for co-packaged optics, transceivers, sensors, AI/ML processors, switches, and HPC applications; enables high-volume manufacturing of high-bandwidth, low-power products by aligning photonics with electronics.
- TeraVERSE Detachable, surface-coupling fiber connectivity product optimized for co-packaged optics (CPO), supporting single-mode and polarization-maintaining optical fibers on a silicon photonics chip; enables HVM-ready, field-serviceable fiber attach for next-generation 102.4 Tbps CPO-enabled switches.
- TeraVERSE-XD Extreme-density detachable fiber connector for co-packaged optics with 64µm fiber pitch in a Double-Decker configuration, enabling 64+ SM/PM fibers per 7mm PIC width and 3000+ fibers per 100x100mm² MCM CPO package.
- TeraSPOT Bonded surface-coupling fiber connectivity product optimized for pluggable transceivers, supporting single-mode optical fibers on a silicon photonics chip with 127/250µm fiber pitch, up to 16 SM fibers, and assembly tolerances better than ±30µm / 0.5dB.
- Photonic-Plug Patented fiber connector component of the Universal Photonic Coupler supporting various customer use cases, optical arrangements and fiber characteristics (single-mode and polarization-maintaining); enables high bandwidth with 127µm fiber pitch and 32+ SM/PM fibers and is the detachable mating interface for CPO.
- Photonic-Bump Patented set of wafer-level optical elements (wideband deflector and lens mirror) attached to the customer's silicon photonics wafer to enable beam expansion for relaxed tolerances, vertical beam deflection, and wafer-level optical testing; available via foundry PDKs (e.g., Tower PH18, GlobalFoundries 45CLO Fotonix).
Quantifiable outcome
- 100x improvement in fiber-to-chip assembly tolerance vs. existing methods
- +4 more outcomes
Companies that use Teramount
Customer profileSegments6 records
Ideal customer profiles4 records
Teramount technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Integration6 records
Feature7 records
Teramount partnerships and signals
Strategic signalPartnerships
Six partnerships are on record, tiered flagship and core.
- Molex IncorporatedflagshipMolex completed the acquisition of Teramount on May 7, 2026. Agreement announced April 15, 2026. Teramount continues to operate as a design and engineering hub in Jerusalem, becoming part of Molex's Optical Connectivity segment within the Optical Solutions Business. Combines Teramount's TeraVERSE IP and engineering talent with Molex's manufacturing scale, supply-chain expertise and systems know-how to deliver scalable CPO. Builds on the strong commercial relationship that followed Koch Disruptive Technologies' lead investment in Teramount's $50M Series A.
- GlobalFoundries (GF)flagshipCollaboration announced March 26, 2024 to integrate Teramount's Universal Photonic Coupler solution with GF's 45CLO silicon photonics platform (GF Fotonix) to provide a scalable fiber packaging solution for AI/ML and data center customers. Enables deeper integration of optics into semiconductors through innovative packaging technologies supporting next-gen advanced computing.
- ASMPT AMICRA GmbHcoreCollaboration announced September 26, 2023 addressing the challenge of connecting fibers to silicon photonic chips. Uses ASMPT's advanced precision die attach machinery to place Teramount's pioneering wafer-level self-aligning optical elements on customer SiPh wafers, enabling high-volume silicon photonics packaging.
- Tower SemiconductorflagshipCollaboration announced March 6, 2023 to integrate Teramount's self-aligning optics solution into Tower's high-volume PH18 silicon photonic platform, producing 'Bump-ready' wafers. Customers can select Teramount's Photonic-Bump during the chip-design stage and access Photonic-Bump PDKs through Tower's standard silicon photonics platform, enabling scalable SiPh packaging for transceivers, high-bandwidth switches and Co-Packaged Optics.
- I-PEX Inc.coreCollaboration announced March 2, 2023 to advance SiPh CPO optical detachable connectivity for data centers and high-speed datacom/telecom applications. Combines Teramount's self-aligning optics with I-PEX's ultra-precision plug and holder systems to deliver a detachable fiber-to-chip connectivity solution for silicon photonics.
- EV Group (EVG)flagshipCollaboration announced March 2, 2022 in which EVG and Teramount jointly implement wafer-level optics to solve silicon photonics fiber-chip packaging. EVG's nanoimprint lithography (NIL) technology and NILPhotonics Competence Center in St. Florian, Austria are used to post-process standard CMOS wafers implementing silicon photonics chips with optical elements (mirrors, lenses) for Teramount's self-aligning optics. Marks a foundational technology partnership for wafer-level Photonic-Bump manufacturing.
Scale indicators10 records
Recent moves6 records
Expansion highlights6 records
Teramount competitors and assessment
Company assessmentDirect peers
- Ayar Labs: Ayar Labs is a direct competitor in chip-to-chip optical interconnect and co-packaged optics for AI infrastructure, building in-package optical I/O solutions — overlapping directly with Teramount's Universal Photonic Coupler and TeraVERSE targeting AI/HPC customers.
- Ranovus: Ranovus develops silicon photonics-based optical interconnect for data centers and AI, including CPO and chip-to-chip solutions, making it one of the closest direct competitors to Teramount in the CPO/silicon photonics interconnect market.
- Celestial AI: Celestial AI builds photonic fabric interconnect for AI accelerators and data centers — a direct competitor pursuing CPO and optical chip-to-chip links for the same hyperscaler and AI-chip customer base as Teramount.
- DustPhotonics: DustPhotonics manufactures silicon photonics-based optical transceivers and interconnect modules for data centers, directly competing with Teramount's TeraSPOT pluggable transceiver solution and CPO offerings in the same hyperscaler customer segment.
Broad incumbents
- Intel (Silicon Photonics): Intel runs a silicon photonics transceiver business and is actively pursuing co-packaged optics for data center and AI infrastructure, making it a broad incumbent competitor with overlapping CPO and silicon photonics capabilities.
- Broadcom: Broadcom is a dominant supplier of switching silicon and optical components (including silicon photonics-based interconnect) to hyperscalers, and a broad incumbent competitor in the CPO and data center optical interconnect market Teramount targets.
- Cisco (Acacia Communications): Cisco's Acacia division designs coherent optical interconnect and silicon photonics-based transceivers for telecom and data center networks, making it a broad incumbent peer in optical interconnect technology serving overlapping hyperscale and telecom customers.
- Marvell (Inphi): Marvell, via its Inphi acquisition, supplies DSPs and silicon photonics components for cloud optical networking and is a broad incumbent competitor to Teramount in optical interconnect for AI and hyperscale data centers.
Emerging players
- OpenLight: OpenLight provides open silicon photonics platforms with integrated lasers and PDK components, partially overlapping with Teramount's foundry-PDK distribution motion for silicon photonics interconnect designers.
Others
- Molex (parent / acquirer): Molex acquired Teramount in May 2026 and is now the parent and primary commercial channel via its Optical Solutions Business, including the VersaBeam CPO platform; included as an adjacent ecosystem participant rather than a direct competitor.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat6 records
Key risks1 record
Key highlights7 records
Customer concentration
Teramount social profiles
Digital presenceTeramount financial estimates
Financial estimateRevenue estimate
Valuation estimate
Teramount leadership team
Management profileNumber of profiles
Profiles5 records
Teramount funding detail
Funding detailFunding overview
Funding rounds3 records
Investors9 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Teramount M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Teramount
What does Teramount do?
Teramount develops and supplies the Universal Photonic Coupler — a wafer-level fiber-to-chip interconnect platform combining proprietary self-aligning optics, Photonic-Plug fiber connectors, Photonic-Bump wafer-level optical elements, and wideband surface coupling. Its products (TeraVERSE, TeraVERSE-XD, TeraSPOT) deliver detachable, passive-alignment fiber-to-chip connectivity for silicon photonics chips used in co-packaged optics, pluggable transceivers, AI/ML processors, switches, and HPC fabrics. The technology is sold and licensed to semiconductor foundries, OSATs, equipment vendors, and (post-acquisition) hyperscalers via Molex's global optical interconnect portfolio.
Is Teramount a public or private company?
Teramount is a private company. It is classified as corporate owned and is currently acquired.
When was Teramount founded?
Teramount was founded in 2013. It employs 11 to 50 people.
Where is Teramount based?
Teramount is headquartered in Jerusalem, Israel, in the Middle East region.
How does Teramount make money?
Two revenue lines are on record. Silicon photonics component/IP licensing is the primary driver. The others are component / engineering services revenue (now via Molex Optical Solutions).
Who are Teramount's main competitors?
Direct peers on record are Ayar Labs, Ranovus, Celestial AI and DustPhotonics. Broad incumbents are Intel (Silicon Photonics), Broadcom, Cisco (Acacia Communications) and Marvell (Inphi). OpenLight is listed as an emerging player. Molex (parent / acquirer) is listed as an others.
Does Teramount have an API?
No public API is recorded for Teramount.
What industry is Teramount in?
Teramount's product category is Silicon Photonics Interconnect. Its primary akta.pro industry code is HDAHALAM, Optoelectronic Receivers & Transceivers (Photodetectors/Optical Modules), with a secondary code of HDAHACAG, Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser). Its NAICS code is 334413 and its SIC code is 3674.