What 3d Glass Solutions does

3D Glass Solutions (3DGS), founded in 2005 in Albuquerque, New Mexico and operating as a privately held, venture-backed pure-play glass foundry, manufactures advanced glass substrates used in semiconductor packaging. Its core technology platform is APEX® Glass — a proprietary photosensitive glass-ceramic material processed through a three-step EXPOSE/BAKE/ETCH flow that enables wafer-level fabrication of through-glass vias (TGVs), air-filled substrate integrated waveguides (eSIWs), RF bridges, integrated passive devices (IPDs), co-packaged optics (CPO) substrates, and 3D heterogeneous integration (3DHI) stacks. The company's TGV process supports via diameters of 30–300µm, aspect ratios up to 8:1, and 10/10µm line/space routing, while glass properties such as tunable dielectric constant (Dk 3.5–7.0), loss tangent below 0.001 at 30 GHz, and CTE of 3–8 ppm/°C are positioned for RF, HPC, photonic, and defense applications. The Albuquerque facility is ISO 9001 and AS9100 certified and serves as an ITAR-compliant onshore foundry.

3DGS monetizes primarily through custom fabrication services and foundry revenue — producing glass interposers, antenna-in-package substrates, IPDs, fan-out glass packages, and 3DHI modules for commercial semiconductor firms, defense prime contractors, and government agencies — supplemented by technology licensing (notably its exclusive APEX® material and the Corning-licensed TGV formation process). The company runs a direct, enterprise field-sales motion reinforced by a "Talk to an Engineer" consultative engagement model, with documented letters of intent or commitments from Marvell (70,000+ panels/year), Intel (10,000+ panels/year), Applied Materials, Xscape Photonics, AAYUNA, and Xpeedic. Pricing is quote-based with multi-year contracts typical of advanced packaging engagements. The customer base spans wireless communications/RF (5G/6G), HPC/AI (chiplet integration, data center processors), photonics (LiDAR, CPO), aerospace & defense (RAD HARD, ITAR), and sensors (bio, MEMS).

The company has accumulated approximately $54 million in disclosed venture funding across Series A/B/B1/C rounds (2019–2023) from a strategic investor syndicate including Intel Capital, Lockheed Martin Ventures, Applied Ventures, Walden Catalyst Ventures, Nagase & Co., Corning, Menlo Microsystems, and Sun Mountain Capital. In 2026, 3DGS signed a $3.3 billion tripartite MoU with Intel and the Government of Odisha (India) — implemented through wholly-owned subsidiary HIPSPL — to build India's first advanced 3D chip packaging and embedded glass substrate ATMP facility in Bhubaneswar, targeting commercial production in August 2028 and full-scale operations by 2030. Headcount currently sits at 51–100, with the India project alone expected to generate approximately 2,500 direct and indirect jobs once at scale.

Name

3d Glass Solutions

Legal name

3DGS Inc.

Website

https://3dgsinc.com

Company type

Private

Founded year

2005

Operating status

Operating

Headcount range

51–100 employees

Short description

3D Glass Solutions (3DGS) is a privately held pure-play glass foundry in Albuquerque, NM that manufactures proprietary APEX® photosensitive glass-ceramic substrates, TGVs, and 3DHI packaging solutions for semiconductor, RF/5G/6G, HPC/AI, photonics, and defense customers.

Ownership category

akta.pro rank

Headquarters

HQ city

Albuquerque

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain

Revenue model

1. Glass Substrate Manufacturing Services: Custom fabrication and manufacturing of glass substrates for semiconductor packaging. The company operates as a pure-play glass foundry providing production-ready glass interposers, AiP substrates, glass IPDs, and fan-out glass packages with integrated TGVs, multilayer copper RDL, and wafer-level reliability.
2. Licensing Royalties: Technology licensing including the APEX® Glass technology (exclusive to 3DGS) and licensed TGV formation process from Corning for semiconductor grade glasses.
3. Foundry Services: 3DHI foundry services to commercial and defense manufacturers, academia and government agencies for glass-based packaging solutions.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels6 records

Core offering

3DGS is a pure-play glass foundry manufacturing advanced glass substrates for semiconductor packaging using its proprietary APEX® photosensitive glass-ceramic technology. The company produces glass interposers, Through Glass Vias (TGVs), Co-Packaged Optics (CPO) substrates, glass 3D Heterogeneous Integration (3DHI) foundry services, RF bridges, and Substrate Integrated Waveguides (SIW) for RF, HPC/AI, photonics, aerospace & defense, and sensor applications. It also provides custom fabrication services and Process Design Kits (PDK) for design enablement, operating from an ISO 9001 and AS9100 certified facility in Albuquerque, New Mexico.

Product overview

3D Glass Solutions (3DGS) is a pure-play glass foundry providing advanced packaging substrate solutions for the semiconductor industry. The company's product portfolio centers on its proprietary APEX® Glass Technology platform, which enables manufacturing of Through Glass Vias (TGVs) and 3D microstructures through a proprietary photosensitive glass-ceramic process. Key products include glass interposers for chiplet integration, Co-Packaged Optics (CPO) glass substrates for data center and HPC applications, Glass 3D Heterogeneous Integration (3DHI) foundry services, High Performance Fused Silica (HPFS) solutions, and custom fabrication services including ADAS/5G/6G Radio on Glass (RoG), RF bridges, and Substrate Integrated Waveguides (SIW). The company serves market segments spanning Wireless Communications (RF front-ends, 5G/6G infrastructure), Aerospace & Defense (RAD HARD, ITAR-compliant), Photonics (LiDAR, optical communications, quantum photonics), HPC/AI (AI accelerators, data centers), and Sensors (bio-sensors, MEMS, medical diagnostics). They also offer Process Design Kits (PDK) for design enablement. The technology enables applications from RF through mmWave (up to 500 GHz) frequencies for defense, commercial, and government sectors.

Differentiator

Problem solved

Functional benefit

Brands

• APEX® Glass: Proprietary photosensitive glass-ceramic material technology for microstructuring precision features, enabling low-cost, high-volume production for RF, IC packaging, life science, and integrated photonics applications
• 3DHI
• APEX® Glass Technology

Products and services

• APEX Glass Technology Proprietary photosensitive glass-ceramic material that enables wafer-level batch manufacturing of through-glass vias and 3D microstructures through a UV exposure, bake, and etch process. Used for RF signal conditioning, IC packaging, life science, and integrated photonics applications.
• Through Glass Vias (TGVs) Vertical electrical interconnects through glass substrates enabling compact and high-density routing for 2.5D and 3D semiconductor packaging. Supports aspect ratios up to 8:1 with via diameters 30-300um, vertical sidewalls exceeding 88 degrees, and edge-to-edge spacing down to 10um. Improves signal integrity, reduces parasitics, and provides reliable power delivery.
• Co-Packaged Optics (CPO) Glass Substrates High-performance glass substrates for co-packaged optics integrating optical and electronic components into single packages for higher bandwidth, lower latency, and improved energy efficiency in data centers and HPC architectures.
• Glass 3D Heterogeneous Integration (3DHI) Foundry Services Foundry services for glass three-dimensional heterogeneous integration enabling stacking of multiple layers of glass to provide significant SWaP-C benefits to RF subsystems for commercial, defense, academia, and government applications.
• High Performance Fused Silica (HPFS) Glass Solutions Ultra-low loss coefficient glass solutions enabling Automotive Radar substrates in 70-150 GHz frequency range and high frequency filters in 10-100 GHz frequency range.
• Glass Interposer Glass-based interposer technology supporting large panel formats, ultra-high density interconnects (HDI), and fine-pitch redistribution layers (RDL) for advanced chiplet integration targeting AI accelerator and data center processor markets.
• Custom

Quantifiable outcome

• 2.2x more parts per wafer compared to laminates and silicon
• +5 more outcomes

Named customers9 records

Segments6 records

Ideal customer profiles4 records

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Eight partnerships are on record, tiered core/flagship, core, strategic and minor.

• Government of Odishacore/flagshipStrategic or Co-development Partner · 2 June 2026State government partner for establishing advanced substrate manufacturing facility in Bhubaneswar, India. One of the largest high-technology investments in India. MoU signed for $3.3 billion project with Rs 399.5 crore state fiscal support.
• Intel Corporationcore/flagshipTechnology or Integration · 29 May 2026Intel providing technology know-how and process expertise for India semiconductor facility. Intel also a major customer with letters of intent for 10,000+ panels/year and investor through Intel Capital. MoU valued at approximately $3.3 billion for glass core substrate manufacturing facility in Odisha.
• Heterogeneous Integration Packaging Solutions Pvt Ltd (HIPSPL)coreStrategic or Co-development Partner · 21 April 2026Indian subsidiary of 3DGS established for the India manufacturing facility. Wholly owned by 3DGS Inc. implementing the Rs 1,943.53 crore greenfield advanced packaging and embedded glass substrate ATMP facility at Info Valley, Bhubaneswar.
• Spectrum ControlstrategicStrategic or Co-development Partner · 17 June 2024Cooperation to develop high-performance RF filter family with wafer-scale manufacturing on glass substrates. Developed surface-mount BGA devices from 500 MHz to 10 GHz with physical size of only 2.6 x 5.4 mm.
• Corning IncorporatedcoreTechnology or Integration · 31 January 2022Follow-on investment in Series B1 extension. Also licensor of glass via technology to 3DGS for HPFS and applications in HPC, MEMS, and photonics.
• Nokia Bell LabsstrategicStrategic or Co-development PartnerCollaboration to create 64-element air-filled slot antenna array operating from 77 to 81 GHz using patented air-cavity manufacturing process; technology scalable for frequencies up to 200 GHz.
• SiCSem Private LimitedminorStrategic or Co-development PartnerFellow semiconductor company also approved under India Semiconductor Mission in Odisha, generating nearly 1,000 direct jobs in silicon carbide semiconductor devices. Both part of Odisha's semiconductor ecosystem.
• University of Texas (Texas Institute for Electronics)strategicStrategic or Co-development Partner3DGS part of NGMM (National Gibbons Microelectronics Margin) at University of Texas. UT's Texas Institute for Electronics awarded $840M to build DOD Microelectronics Manufacturing Center.

Scale indicators18 records

Recent moves8 records

Expansion highlights6 records

Direct peers

• Absolics (SKC): Absolics, a subsidiary of SKC, manufactures glass substrates for advanced semiconductor packaging — the same product category 3DGS targets. Both companies compete for design wins with leading chipmakers including Intel and other AI accelerator customers, and operate large-scale glass-substrate fabs at the leading edge of 2.5D/3D packaging.
• Mosaic Microsystems: Mosaic Microsystems provides thin-glass substrates and interposers for advanced semiconductor packaging and RF applications, directly overlapping 3DGS's glass interposer and TGV product lines. The companies compete for design wins with defense, RF, and HPC packaging customers.

Broad incumbents

• Corning Incorporated: Corning licenses TGV technology to 3DGS and supplies HPFS glass for its products, while concurrently pursuing its own glass substrate efforts for advanced semiconductor packaging. Corning's specialty glass and photonics businesses make it both a critical supplier and a strategic competitor.
• Amkor Technology: Amkor is one of the largest OSATs globally and offers advanced packaging services (2.5D/3D, fan-out wafer-level packaging) that compete with 3DGS's glass-based packaging platform. Amkor's scale and customer relationships with Apple, AMD, and Nvidia make it a benchmark for advanced packaging incumbents.
• ASE Technology Holding: ASE is the world's largest OSAT, providing advanced packaging services including fan-out wafer-level packaging, 2.5D/3D IC integration, and silicon interposer solutions that overlap with 3DGS's heterogeneous integration offering. ASE's scale and broad customer base set competitive context for advanced packaging foundries.
• TSMC (Advanced Packaging): TSMC's advanced packaging business (CoWoS, InFO, SoIC) provides 2.5D and 3D integrated circuit packaging using primarily silicon interposers. TSMC's CoWoS platform dominates AI accelerator packaging and represents the primary incumbent that any glass-interposer challenger like 3DGS must displace.
• Schott AG: Schott produces specialty glasses including HERATIO for semiconductor packaging applications and is a major player in advanced electronics glass. Schott's portfolio of glasses for electronics overlaps with 3DGS's materials platform across RF, photonics, and sensor markets.
• AGC Inc. (Asahi Glass): AGC is a global specialty glass manufacturer developing glass substrates for semiconductor packaging applications. Its electronics glass business overlaps with 3DGS's specialty glass interposer offering and provides competitive context in the broader materials space.
• JCET Group: JCET is a leading Chinese OSAT providing advanced packaging services including 3D fan-out and chiplet integration. JCET's scale and emerging advanced packaging capabilities overlap with 3DGS's foundry services in the broader chiplet and heterogeneous integration market.

Emerging players

• SUSS MicroTec: SUSS MicroTec manufactures lithography and bonding equipment for advanced packaging including 3D heterogeneous integration and wafer-level packaging. Its equipment enables similar heterogeneous integration processes used in 3DGS's foundry services.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/3d-glass-solutions

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles10 records

Subsidiaries2 records

Funding overview

Funding rounds5 records

Investors13 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about 3d Glass Solutions