Laserssel

What Laserssel does

Laserssel Corporation (KOSDAQ: 412350) is a South Korea-based semiconductor capital equipment manufacturer founded in 2015 by CEO Ahn Geon-jun. The company's core innovation is Area Laser technology — a proprietary method that transforms conventional spot (Gaussian) laser beams into uniform flat-top area beams via its Beam Shaping Optic Module (BSOM), enabling warpage-free selective reflow and compression bonding for advanced semiconductor packaging. Its flagship product lines include LSR (Laser Selective Reflow) equipment in beam sizes from 50x50mm to 300x300mm, LCB (Laser Compression Bonder) for HBM stacking and CPO applications, BSOM optics modules, NBOL high-power laser systems, plus specialized tools such as eLMB (micro solder ball repair), LPB (probe card bonder), rLSR (mini LED rework), and LMT roll-to-roll flexible PCB mounters. Equipment prices are quoted at approximately 7-8 hundred million KRW (~$50-60K USD) per unit, with a maximum production capacity of 200 billion KRW per quarter / 800 billion KRW annually.

Laserssel sells primarily through direct enterprise engagement and 101 global sales partners to semiconductor foundries (notably TSMC, where it holds the only qualification in area laser bonding), consumer electronics OEMs (Apple, for iPad joint development with ~30 units delivered), OSAT companies in Taiwan and Singapore, display manufacturers (Dongwoo Fine-Chem), and probe card makers. The company is the only firm globally to commercialize FOPLP area-laser equipment and the Square Core Fiber micro-laser, holding 219 patents and 12 industry awards including multiple SMTA Mexico Global Technology Awards. Listed on KOSDAQ in 2022 via a technology-specialty route, the company has operated at an accumulated loss for approximately five years while investing in capacity and qualification, and is targeting first profit in Q1 2026 with a 4x revenue growth objective for 2026 supported by recent contract wins and the first CPO-dedicated LCB order.

Name

Laserssel

Legal name

LASERSSEL Corporation

Website

https://laserssel.com

Company type

Public

Founded year

2015

Operating status

Operating

Headcount range

11–50 employees

Short description

Laserssel Corporation is a South Korean KOSDAQ-listed manufacturer of Area Laser equipment (LSR, LCB, BSOM) for warpage-free semiconductor packaging, serving foundries like TSMC, OSATs, and consumer electronics OEMs globally.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674), Optical Instruments & Lenses (3827), Electronic Components, Nec (3679)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Optics & Laser/Light Engine Components (Lenses, Galvos, Laser Modules, UV Engines) (IMAAAIAC), Optoelectronic Emitters (LED/Laser/VCSEL) (HDAHALAL), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• Laser selective reflow
• Semiconductor packaging equipment
• Laser compression bonding
• Beam shaping optics
• Area laser technology

Headquarters

HQ city

Asan

HQ country

South Korea

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Operations, Personnel, Marketing or Sales

Revenue model

1. Semiconductor Equipment Sales: Sale of capital equipment including LSR, LCB, LSR-300 FOPLP, eLMB, LPB, and rLSR machines to semiconductor, display, EV battery, and electronics manufacturers. Equipment pricing is 7-8억원 per unit. Production cycle takes 3 months (2 months for handler outsourcing, 1 month for BSOM and software).
2. Device Business: In addition to equipment business, Laserssel launched device business in 2021, selling components or devices alongside equipment.

Pricing tiers

Go-to-market motion1 record

Distribution channels2 records

Marketing channels4 records

Core offering

Laserssel manufactures and sells Area Laser selective soldering and bonding equipment — capital tools that use proprietary flat-top beam laser technology for warpage-free bonding in advanced semiconductor packaging, mini/micro LED display rework, and EV battery assembly. Core product lines include LSR (Laser Selective Reflow) systems with beam sizes from 50mm to 300mm, LCB (Laser Compression Bonder) for HBM stacking and Co-Packaged Optics, BSOM (Beam Shaping Optic Module) optics, and supporting equipment including eLMB, LPB, rLSR, and LMT roll-to-roll systems. In addition to equipment, the company sells components and devices launched as a device business in 2021, with customers including TSMC, Apple, OSAT companies, and display/EV battery manufacturers.

Product overview

Laserssel is a leading provider of Area Laser selective soldering and bonding technology offering a comprehensive portfolio of equipment and optical components for semiconductor, display, electric vehicle, and SMT industries. The core product lines include: LSR (Laser Selective Reflow) equipment for warpage-free bonding in seconds; LCB (Laser Compression Bonder) for thermal compression bonding in HBM stacking and CPO applications; BSOM (Beam Shaping Optic Module) for transforming spot lasers into uniform area beams; NBOL (iNnovation Bonding Optical Laser) high-power laser systems; and specialized equipment for mini LED rework (rLSR), probe card bonding (LPB), and micro solder ball applications (eLMB). The company also provides the LMT roll-to-roll system for flexible PCB manufacturing. These products address critical packaging challenges including warpage in thin die packages, thermal damage to sensitive components, and production throughput limitations in advanced semiconductor, display, and EV battery applications.

Differentiator

Problem solved

Functional benefit

Brands

• BSOM: Beam Shaping Optic Module — transforms laser spot beam to uniform area beam. World Best & Most various Area Laser Beam Size supported (6 types, 40 models) with over 95% beam uniformity.
• NBOL
• LSR
• LCB
• rLSR
• LMT
• eLMB
• LPB
• fcLCB

Products and services

• LSR (Laser Selective Reflow) Main equipment line using Area Laser technology for selective reflow of selected areas in seconds, eliminating thermal damage and warpage in semiconductor packaging; supports beam sizes from 50mm to 300mm with >90% beam uniformity. Used by semiconductor foundries, OSAT companies, and EV battery manufacturers for advanced packaging.
• LCB (Laser Compression Bonder) Laser-based thermal compression bonder using laser as heat source instead of conventional thermal block. Enables HBM chip stacking and CPO (Co-Packaged Optics) bonding with 10x faster production than conventional TC Bonder while minimizing thermal damage. Targets semiconductor foundries and OSAT companies running advanced packaging for AI/HBM/CPO applications.
• LSR-300 (Large-Area LSR / FOPLP) Large-area laser reflow equipment supporting 300mm x 300mm beam size, with sub-3-second reflow time, real-time temperature monitoring, and >90% beam uniformity. LSR-300POPLP variant supports 500x500mm to 600x600mm glass substrate panels (up to 700x700mm planned) for FOPLP applications. Used by OSAT companies for panel-level packaging and advanced packaging lines.
• eLMB (Micro Solder Ball Laser Equipment) Micro solder ball laser equipment for BGA (Ball Grid Array) packaging processes. Enables solder ball rebonding and repair, reducing defect rate to 0% by eliminating the need to dispose of substrates with defective solder balls. Used by OSAT companies and substrate manufacturers.
• LPB (Probe Card Laser Bonder) Probe card laser bonder for semiconductor wafer chip testing. Bonds thousands to tens of thousands of probe pins to probe cards with micro-meter precision at 5-6 second bonding speed, approximately 50% faster than conventional bonding equipment. Used by semiconductor probe card manufacturers.
• rLSR (Rework Laser Selective Reflow) Rework laser selective reflow equipment for Mini/Micro LED displays. Removes defective mini LED components from substrate and replaces with new components using Area Laser technology without damaging LED or PCB; supports chip sizes from 100um to 600um. Used by display manufacturers and consumer electronics OEMs (e.g., Dongwoo Fine-Chem).
• LMT_r2r (Laser Mounting Technology Roll-to-Roll) Roll-to-roll flexible PCB laser in-line surface mounter for SMT applications. Integrates dispensing, SPI inspection, chip mounting, laser reflow, and AOI in a single machine. Used by FPCB/consumer electronics manufacturers.
• BSOM (Beam Shaping Optic Module) Laser optic module that transforms spot beam laser into uniform area beam, offered as a standalone optic component/device. Supports beam sizes from 0.1mm to 300mm with >95% beam uniformity and >90% optical power efficiency, available in six optic types (PC, LP, SC, DOE, MLA, CD). Sold as a device/component alongside Laserssel equipment and potentially to other laser equipment makers as part of the device business launched in 2021.
• NBOL (iNnovation Bonding Optical Laser)

Quantifiable outcome

• 98% beam uniformity achieved (vs 70%+ industry standard for area laser)
• +4 more outcomes

Named customers7 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Eight partnerships are on record, tiered core and minor.

• Sellingware (Taiwan)coreStrategic or Co-development Partner · 1 March 2026Strengthening strategic partnership through investment cooperation. LSR_300 BGA equipment supply contract worth 13억원 (October 2025). First major customer for FOPLP equipment.
• Ascend Pte (Singapore)coreStrategic or Co-development Partner · 1 October 2025LSR_BGA supply contract worth 8억7000만원 (October 2025). Singapore-based global semiconductor company.
• 동우화인켐minorStrategic or Co-development Partner · 1 July 2025Display rework equipment (rLSR) supply contract worth 7억5000만원 for mini LED display rework equipment.
• Korean Probe Card ManufacturerminorStrategic or Co-development Partner · 1 June 2025LPB (Probe Card Laser Bonder) supply contract worth 6억5000만원 (June 2025) for semiconductor probe card manufacturing.
• 고승욱 (Business Head)coreOthers · 1 January 2025Newly hired business head (사장) in January 2025 with world-class capabilities in global semiconductor sales. Leading global sales expansion efforts.
• TSMCcoreTechnology or IntegrationWorld's only company to receive qualification (core/qual) from TSMC in area laser bonding technology. LSR equipment installed in TSMC advanced packaging operations.
• ApplecoreStrategic or Co-development PartnerJoint development of iPad with Apple engineers in the US. Sold approximately 30 units of equipment for the joint development project.
• World #1 FC-BGA Japanese CompanycoreStrategic or Co-development PartnerJoint development with world's leading FC-BGA substrate company in Japan towards establishing world standards for advanced packaging.

Scale indicators8 records

Recent moves11 records

Expansion highlights6 records

Direct peers

• BE Semiconductor Industries (Besi): Besi is the leading supplier of die-attachment, TCB, and hybrid bonding equipment for advanced semiconductor packaging. Besi's TCB and hybrid bonding product lines directly compete with Laserssel's LCB in HBM stacking and chiplet integration applications at leading foundries and OSATs.
• ASMPT (ASM Pacific Technology): ASMPT is a global leader in semiconductor packaging and assembly materials equipment, including TCB, flip-chip, and advanced packaging tools. ASMPT's TCB and AB339 product family directly competes with Laserssel's LCB for HBM, 2.5D/3D, and advanced-packaging bonding applications.
• Kulicke & Soffa Industries: Kulicke & Soffa is a major semiconductor and LED assembly equipment supplier with TCB, flip-chip, and advanced packaging offerings. K&S competes with Laserssel in advanced packaging bonding and has a strong presence at TSMC and OSAT customers.
• Hanmi Semiconductor: Hanmi Semiconductor is a Korean advanced packaging equipment supplier specializing in TCB, sawing, and sorting equipment. As a Korea-listed peer with deep TSMC and SK hynix relationships, Hanmi is a direct competitor in the TCB and advanced packaging bonding market where Laserssel's LCB competes.

Emerging players

• SÜSS MicroTec: SÜSS MicroTec supplies lithography, coating/developing, and advanced packaging equipment (including temporary bonding/debonding and plasma activation for hybrid bonding). SÜSS is an emerging player in 3D/hybrid bonding adjacent to Laserssel's advanced packaging focus.
• MRSI Systems (Mycronic Group): MRSI, part of Mycronic, produces high-precision die bonders and TCB tools for photonics, datacom, and advanced semiconductor packaging. MRSI is an emerging player in laser/precision die bonding with overlap to Laserssel's CPO and advanced packaging product lines.
• Amicra Microtechnologies: Amicra specializes in sub-micron precision die bonding and TCB equipment for photonics, semiconductor, and MEMS applications. Amicra is an emerging competitor in precision bonding technology overlapping with Laserssel's CPO and advanced packaging use cases.
• SET Corporation (Smart Equipment Technology): SET Corporation is a French supplier of advanced packaging equipment including flip-chip and TCB bonders. SET competes with Laserssel in advanced packaging bonding, particularly for European and select global semiconductor customers.

Regional players

• Toray Engineering: Toray Engineering is a Japanese semiconductor and FPD equipment manufacturer with product lines in die bonding and advanced packaging. As a regional Japanese peer with similar advanced packaging focus, Toray competes with Laserssel in Japan and across Asian foundry customers.

Broad incumbents

• EV Group (EVG): EV Group is a leading supplier of wafer bonding, lithography, and nanoimprint equipment for advanced packaging, MEMS, and photonics. EVG's wafer-level bonding and hybrid bonding solutions compete broadly with Laserssel's laser bonding approach in advanced packaging and CPO applications.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/laserssel

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds3 records

Investors5 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Laserssel