PROTEC

What PROTEC does

PROTEC (주식회사 프로텍) is a South Korea-based, KOSDAQ-listed manufacturer of precision semiconductor packaging and assembly equipment, founded in 1997 (operations trace to 1993) and headquartered in Anyang, Gyeonggi-do. The company designs and sells equipment used in back-end semiconductor manufacturing processes — dispensing, die/attach bonding, laser-assisted bonding, laser reflow, and bin sorting — directly to enterprise semiconductor manufacturers through a B2B field-sales model. Its product portfolio includes the Apollo dispenser (600Hz jetting, ±15μm wet accuracy, dual acting pump and dual lane), PCA-200 attach machine, PLA-400RT laser assisted bonder, BP-5000 micro SBM, Cu Pin bonders, Laser Compression Bonder and Reverse Laser Compression Bonder, PROTEC LASER REFLOW, and PWA-500BIN bin sorter (5,000 UPH, ±40μm pickup accuracy). PROTEC also operates a Japan subsidiary (Minami Co., Ltd./ミナミミ株式会社) producing screen printers and Korean subsidiaries covering pneumatic components (P&M), investment/venture capital (PROTEC Investment, PROTEC Ventures), industrial electronics (PROTEC L&H), and semiconductor inspection (PMT).

PROTEC's revenue model is anchored in capital-equipment hardware sales to global semiconductor fabs, augmented by pneumatic component sales and venture/investment income from subsidiaries. The company serves 55+ customers across Korea, China, and other markets, with FY2025 consolidated revenue of 230.5B KRW (~US$172M), operating profit of 46.3B KRW, and net income of 35.4B KRW — a ~35% YoY increase over FY2024 revenue of 170.3B KRW. The company has pursued operational consolidation through two recent absorption mergers (M-SOL in 2022, Strato IT in 2023) and is scheduled to vote on a treasury-stock capital reduction at the March 2026 AGM.

Name

PROTEC

Legal name

주식회사 프로텍 (PROTEC Co., Ltd.)

Website

https://protec21.co.kr

Company type

Public

Founded year

1997

Operating status

Operating

Headcount range

11–50 employees

Short description

PROTEC is a KOSDAQ-listed South Korean manufacturer of precision semiconductor packaging equipment — dispensers, die bonders, laser-assisted bonders, and bin sorters — sold directly to 55+ global semiconductor manufacturers, with subsidiaries in Japan and Korea.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor packaging equipment
• Precision die bonding
• Laser assisted bonding
• Semiconductor dispensers
• Bin sorting systems

Headquarters

HQ city

Anyang

HQ country

South Korea

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Equipment Sales: PROTEC generates revenue primarily through the manufacture and sale of semiconductor equipment including dispensers, die bonders, laser-assisted bonders, and bin sorters. Products are sold directly to semiconductor manufacturers.
2. Automation Pneumatic Components: Sale of automation pneumatic components through subsidiary ㈜피앤엠
3. Investment and Venture Capital: Revenue through subsidiaries engaged in new technology business finance and venture capital operations

Go-to-market motion1 record

Distribution channels1 record

Marketing channels2 records

Core offering

PROTEC manufactures and sells precision semiconductor packaging and assembly equipment, including dispensers (Apollo), die attach machines (PCA-200), laser-assisted bonders (PLA-400RT), micro SBM units (BP-5000), Cu Pin bonding tools, laser compression bonders (standard and reverse), PROTEC LASER REFLOW systems, and high-speed bin sorters (PWA-500BIN). These systems are sold directly to semiconductor chip manufacturers for high-speed, high-accuracy chip packaging processes.

Product overview

PROTEC is a semiconductor equipment manufacturer offering a comprehensive portfolio of precision equipment for semiconductor packaging and assembly. The product lineup includes Apollo dispensers and PCA-200 attach machines as foundational equipment, complemented by laser-based solutions such as PLA-400RT laser assisted bonder, laser compression bonders (standard and reverse configurations), and PROTEC LASER REFLOW systems. Additional offerings include BP-5000 micro SBM, Cu Pin bonding technology, and PWA-500BIN high-speed bin sorter. Together, these products address the semiconductor manufacturing workflow from die attach and bonding through sorting operations, with an emphasis on precision, low thermal stress, and high efficiency.

Differentiator

Problem solved

Functional benefit

Brands

• Apollo: High-speed, high-accuracy dispenser product line with dual acting pump system
• PCA-200
• PLA-400RT
• BP-5000
• PWA-500BIN
• PROTEC LASER REFLOW
• Laser Compression Bonder
• Reverse Laser Compression Bonder

Products and services

• Apollo Dispenser High-speed, high-accuracy semiconductor dispenser equipped with a dual acting pump system and dual lane configuration for high-efficiency dispensing; designed for semiconductor packaging manufacturers.
• PCA-200 Attach Machine Precision die attach machine designed for rapid and accurate bonding with low thermal stress, minimal warpage, and selective heating capability effective for thin substrates; serves semiconductor chip manufacturers.
• PLA-400RT Laser Assisted Bonder Laser-assisted bonder utilizing laser technology for precision die bonding with selective heating and low thermal stress characteristics; intended for advanced semiconductor packaging.
• BP-5000 Micro SBM Micro Saw Blade Machine (SBM) for precision micro-machining applications in semiconductor manufacturing; serves chip packaging and assembly lines.
• Cu Pin Bonding Copper pin bonding technology and equipment for advanced semiconductor packaging applications.
• Laser Compression Bonder Laser-based compression bonder for advanced semiconductor packaging with selective heating and precise temperature control during bonding.
• Reverse Laser Compression Bonder Reverse-configuration laser compression bonder designed for specialized semiconductor bonding requirements.
• PROTEC LASER REFLOW Laser reflow system providing precise thermal control during reflow processes in semiconductor manufacturing.
• PWA-500BIN Bin Sorter High-speed bin sorter with 5,000 UPH throughput (excluding handler time), featuring vision systems for wafer die position accuracy of ±40µm at 3σ for pickup and ±50µm at 3σ for placement; handles die sizes from ⌀3mm to ⌀40mm.

Quantifiable outcome

• Apollo dispenser achieves maximum 600Hz jetting frequency
• +3 more outcomes

Segments1 record

Ideal customer profiles1 record

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

One partnership is on record.

• 주식회사 스트라토아이티 (Strato IT)coreOthers · 20 June 2023PROTEC completed absorption merger with Strato IT in June 2023. Strato IT (software development company) was merged into PROTEC to enhance operational efficiency and achieve synergy effects. The merger was conducted via a 1:0 ratio as PROTEC owned 100% of Strato IT, with an effective date of June 20, 2023.

Scale indicators11 records

Recent moves8 records

Expansion highlights6 records

Direct peers

• Hanmi Semiconductor: Korean semiconductor back-end equipment maker specializing in saw singulation and die attachers. Highly comparable to PROTEC's die-bonding and precision-cutting products, and a direct Korean-market competitor for the same fab customers.
• Toray Engineering: Japanese semiconductor equipment manufacturer with offerings in die bonding and packaging processes. Comparable as an Asia-based specialist competitor to PROTEC's core die attach and laser bonding products.
• Techwing: Korean semiconductor test handler manufacturer serving Korean memory customers. Comparable Korean back-end equipment peer with overlapping customer set in Korean semiconductor packaging lines.
• SÜSS MicroTec: German supplier of semiconductor equipment for advanced packaging, lithography, and bonding. Overlaps with PROTEC's laser-assisted bonding and precision attach products for advanced packaging applications.
• ASMPT: Hong Kong-listed global supplier of semiconductor assembly and packaging materials and equipment. Direct competitor in die bonding, wire bonding, and advanced packaging tooling used by the same global semiconductor manufacturers PROTEC serves.
• Besi: Dutch-headquartered leader in die bonding and advanced packaging assembly equipment. Direct competitor in hybrid bonding, flip-chip, and die attach — overlapping with PROTEC's PCA-200 and laser-assisted bonding portfolio.

Broad incumbents

• Disco Corporation: Japanese leader in semiconductor back-end equipment, especially dicing and grinding. Adjacent to PROTEC's BP-5000 micro SBM (saw blade machine) and serves the same Korean and global semiconductor fab customers.
• Kulicke & Soffa Industries: Large established semiconductor packaging equipment supplier with broad portfolio spanning wire bonders, advanced packaging, and electronics assembly. Competes with PROTEC in adjacent back-end equipment categories with materially greater scale.
• Nidec: Global Japanese motor and precision automation conglomerate with semiconductor equipment exposure through subsidiaries. Compares to PROTEC's automation pneumatic and precision motion-control competencies at PROTEC subsidiary P&M.
• LEENO Industrial: Korean supplier of semiconductor test equipment, sockets, and probes. Larger incumbent peer in Korean back-end semiconductor equipment market, serving many of the same memory and foundry customers as PROTEC.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/proteckorea

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries6 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about PROTEC