What budatec does

budatec GmbH is a Berlin-based private limited company (GmbH) founded in 2009 by Alexander Dahlbüdding and Dirk Buße, manufacturing thermal process equipment for the semiconductor, power electronics, and solar industries. The company specializes in vacuum soldering systems (VS 160, VS 320, VS 320 i, VS XL) and sintering presses (SP 60, SP 300), serving customers that require void-free solder joints and low-temperature sintering for high-reliability electronics packaging. The founding team originated from TECA Technologieorientierte Automation GmbH (1991-2009), contributing over 30 years of cumulative experience in vacuum soldering technology.

The product portfolio spans benchtop R&D units (VS 160 with 160mm x 160mm heating plate and rates up to 200 K/min) to fully automated inline production systems (VS 320 i with autonomous loading) and large-format systems (VS XL with 1000mm x 320mm heating plate). Sintering presses complement the soldering line: the SP 60 extends the VS 320 platform for sintering up to 15 kN force, while the SP 300 is a standalone fully automatic servo-electric press with up to 300 kN programmable force, eliminating hydraulic oil leakage risk. Configurable options include hydrogen atmospheres (up to 100%), HCOOH, special gases, and microwave plasma treatment for enhanced wettability and reduced thermal stress. An Application Center in Berlin provides customer-specific process development, prototyping, and small-batch production across paste printing, bonding, sintering, vacuum soldering, and wire bonding.

Revenue is generated primarily through one-time capital equipment sales (hardware) of vacuum soldering systems and sintering presses, supplemented by accessories, spare parts, and Application Center professional services. The company operates a hybrid go-to-market model combining direct enterprise field sales from Berlin with a global network of regional channel partners covering Germany, Italy, Switzerland, India, Japan, Taiwan, USA, Mexico, and Russia. Pricing is quote-based and not publicly disclosed. Marketing relies heavily on trade fair participation (Productronica, PCIM Europe/Asia, ECTC, Semicon Taiwan) and industry association memberships (AENEAS, ECPE, IMAPS, ISA, ZULE). End-customer verticals include semiconductor packaging, power electronics (IGBT/MOSFET modules for EVs and industrial drives), automotive suppliers, laser manufacturing, medical technology, lighting, wind energy, and research institutions. The company is ISO 9001 certified since 2016 and holds TISAX Assessment Scope SC321R for automotive supply chain information security.

Name

budatec

Legal name

budatec GmbH

Website

https://budatec.de

Company type

Private

Founded year

2009

Operating status

Operating

Short description

budatec GmbH, founded in 2009 in Berlin, manufactures vacuum soldering systems and sintering presses for semiconductor packaging and power electronics assembly, serving automotive, laser, medical, and research customers globally through direct sales and a network of regional channel partners.

Ownership category

akta.pro rank

Headquarters

HQ city

Berlin

HQ country

Germany

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Operations, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

1. Vacuum Soldering Systems: Manufacture and sale of vacuum soldering systems ranging from small batch benchtop units (VS 160) to fully automated inline production systems (VS 320 i) and large-area systems (VS XL). One-time capital equipment sales with customization options including hydrogen, plasma, and various gas configurations.
2. Sintering Presses: Production and sale of sintering presses (SP 60, SP 300) for semiconductor chip sintering under controlled atmospheres. Pure servo-electric drive technology eliminates hydraulic components.
3. Accessories and Spare Parts: Sale of accessories including water coolers (WK 20), mandrel bend testers, and custom soldering fixtures. Replacement parts and consumables for installed base.
4. Application Center Services: Customer application development, prototyping, and small/pre-series production services using vacuum soldering, sintering, plasma, and bonding technologies.

Go-to-market motion2 records

Distribution channels11 records

Marketing channels3 records

Core offering

budatec GmbH designs, manufactures, and sells thermal process systems for the semiconductor, solar, and electronics industries. Its portfolio spans vacuum soldering systems (VS 160, VS 320, VS 320 i inline, VS XL) and sintering presses (SP 60, SP 300), configured with options such as hydrogen, HCOOH, special gases, microwave plasma, and motor-driven manipulators. The company also runs an Application Center offering customer-specific process development, prototyping, and small/pre-series production.

Product overview

budatec GmbH is a plant manufacturer for the semiconductor and solar industry offering thermal systems and products for electronics manufacturing. The product portfolio centers on vacuum soldering systems (VS series) and sintering presses (SP series), ranging from small batch benchtop systems to fully automated production systems. The VS 160, VS 320, VS 320 i, and VS XL vacuum soldering systems share a common technology platform but serve different production scales, from R&D to mass production. The sintering presses (SP 60 and SP 300) complement the vacuum soldering range, with the SP 60 designed as an extension module for the VS 320, while the SP 300 is a standalone fully automatic system. Accessories include water coolers, testing equipment, and custom soldering fixtures. Applications span electronics and power electronics components, automotive industry suppliers, laser manufacturing, medical technology, and research institutions.

Differentiator

Problem solved

Functional benefit

Products and services

• VS 160 Vacuum Soldering System Compact vacuum soldering system with 160 mm x 160 mm heating plate area, offering heating and cooling rates up to 200 K/min. Available as benchtop (VS 160 S) or with base frame (VS 160 UG) for R&D and small batch production. Targets R&D labs, universities, and small-batch production environments in semiconductor and electronics manufacturing.
• VS 320 Vacuum Soldering System Medium-to-large batch vacuum soldering system with 320 mm x 320 mm heating plate area. Supports options including hydrogen (up to 100%), HCOOH, special gases, microwave plasma, and integration with a sintering press. Designed for medium and large batch production in semiconductor and power electronics packaging.
• VS 320 i Inline Vacuum Soldering System Flexibly integrable inline vacuum soldering system with autonomous loading and unloading of product carriers, based on the VS 320 platform with all available process options. Targeted at high-volume mass production of electronic and power electronic components.
• VS XL Vacuum Soldering System Large-area vacuum soldering system with 1000 mm x 320 mm heating plate area for processing large parts and high-throughput batches. Supports hydrogen, HCOOH, special gases, and motor-driven manipulators. Designed for high-throughput production of large-format power electronics and other components.
• SP 60 Sintering Press Sintering press add-on that converts a VS 320 vacuum soldering system into a combined system for sintering under inert or reduced atmospheres. Achieves sintered joints on areas up to 60 mm x 60 mm with adjustable force up to 15 kN. Defined atmospheres improve joint reliability and strength for power module and semiconductor packaging.
• SP 300 Sintering Press Fully automatic standalone sintering press for producing sintered joints under inert and reduced atmospheres on areas up to 220 mm x 180 mm with adjustable force up to 300 kN. Uses servo-electric drive with load cell for precise force control, eliminating hydraulic oil leakage risk. Targeted at industrial-scale sintering for power module and semiconductor packaging.
• VS 160/320/XL II Series Updated generation of the VS series vacuum soldering systems (VS 160 II, VS 320 II, VS XL II) with new design, new software, and additional functions, building on the original VS platform architecture.
• Application Center Services Customer application development facility offering paste printing, paste drying, bonding, sintering, vacuum soldering, and wire bonding capabilities for sample assemblies and small/pre-series production. Provides process development, prototyping, and pre-series services to semiconductor, power electronics, and electronics manufacturers.

Quantifiable outcome

• Sintering multiplies shear forces compared to traditional soldering methods
• +2 more outcomes

Named customers7 records

Segments6 records

Ideal customer profiles3 records

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature10 records

Partnerships

24 partnerships are on record, tiered core and minor.

• Adlershof - Science at WorkcoreStrategic or Co-development PartnerTechnology park and science campus partnership in Berlin Adlershof, where budatec's headquarters is located. Provides access to research networks and collaborative environment for technology development.
• AENEAScoreStrategic or Co-development PartnerEuropean industry association promoting research, development, and innovation in electronic components and systems. Supports European competitiveness by promoting R&D&I across the value chain.
• ECPE e.V. (European Center for Power Electronics)coreStrategic or Co-development PartnerEuropean association promoting education, innovation, science, research, and technology transfer in power electronics throughout Europe.
• IMAPS-Deutschland e.V.coreStrategic or Co-development PartnerInternational Microelectronics and Packaging Society German chapter, providing networking and knowledge sharing in microelectronics packaging.
• ISA - International Semicon AlliancecoreStrategic or Co-development PartnerCooperation of internationally leading technology companies from the semiconductor industry for knowledge sharing and joint initiatives.
• NET4AIminorStrategic or Co-development PartnerCross-sector network of companies and research institutions with regional focus on Brandenburg and Berlin for artificial intelligence collaboration.
• SELECT NetworkcoreStrategic or Co-development PartnerInterconnected network for development of advanced and efficient technological approaches for heat treatment and joining processes in microsystems engineering, microelectronics, and thin-film technology.
• Werner-von-Siemens CentrecoreStrategic or Co-development PartnerIndustrial and scientific campus in Berlin bringing together innovators from different organizations for collaborative technology development.
• ZULE (Zuverlässige Leistungselektronik)coreStrategic or Co-development PartnerCooperation network focused on reliable power electronics, contributing to implementation of innovative solutions for system reliability.
• ReCuSin ConsortiumcoreStrategic or Co-development PartnerR&D project with Federal Ministry of Research for sustainably manufactured electronic inverters with sintered copper-copper connections for electrolysis plants.
• PAPAI ConsortiumcoreStrategic or Co-development PartnerR&D project on advanced assembly and connection technology in power electronics with AI-supported process monitoring, funded by Federal Ministry of Research.
• KuSin ConsortiumcoreStrategic or Co-development PartnerR&D project on copper sintering processes using induction heating for electromobility applications, funded by Federal Ministry for Economic Affairs.
• Fraunhofer IPKcoreStrategic or Co-development PartnerCollaboration with Fraunhofer Institute for Production Systems and Design Technology on multiple R&D projects including CraftForward, RES-GAME, and MAP.
• TU DresdencoreStrategic or Co-development PartnerAcademic partnership for SelFü project on novel joining methods for high-performance electronic components.
• EMEA Electro SolutionscoreChannel Partner/ Reseller/ DistributorRegional distribution partner covering EMEA territory for sales and support of vacuum soldering systems and sintering presses.
• Bridge SRLminorChannel Partner/ Reseller/ DistributorItalian distribution partner for budatec products including vacuum soldering systems.
• QUASYS AGminorChannel Partner/ Reseller/ DistributorSwiss distribution partner specializing in budatec vacuum soldering systems.
• Global Marketing ServicesminorChannel Partner/ Reseller/ DistributorIndian distribution partner for semiconductor manufacturing equipment including vacuum soldering systems.
• Murakami Co., Ltd.minorChannel Partner/ Reseller/ DistributorJapanese distribution partner for budatec equipment serving the Asian market.
• ISO-Dynamique Microsystems GroupminorChannel Partner/ Reseller/ DistributorAsian distribution partner covering multiple markets for microsystems and electronics manufacturing equipment.
• BONDTRONICS Technology Co. Ltd.minorChannel Partner/ Reseller/ DistributorTaiwanese distribution partner for electronics manufacturing equipment.
• Neu Dynamics Co.minorChannel Partner/ Reseller/ DistributorUS distribution partner serving North American market for semiconductor packaging equipment.
• ASTECminorChannel Partner/ Reseller/ DistributorMexican distribution partner covering Latin American markets for electronics manufacturing equipment.
• Avanteh Ltd.minorChannel Partner/ Reseller/ DistributorRussian distribution partner for budatec products in the Russian market.

Scale indicators4 records

Recent moves8 records

Expansion highlights5 records

Direct peers

• PINK GmbH Vakuumtechnik: German manufacturer of vacuum process equipment for semiconductor and photonics applications, including wafer bonding and vacuum soldering tools that overlap directly with budatec's VS series product range and customer base.
• SEHO Systems GmbH: German supplier of selective soldering, reflow soldering and vacuum soldering systems for electronics manufacturing, serving automotive, power electronics and EMS customers that budtec targets.
• Heller Industries: US manufacturer of reflow soldering and vacuum/reflow soldering ovens for SMT and power-electronics assembly — directly competing with budatec's VS platform for the same EMS and OEM accounts.
• ATV Technologie GmbH: German specialist in vacuum soldering and thermosonic bonding systems for microelectronics and power-electronics packaging, with comparable technology focus and customer overlap to budatec.
• Zevac / Asscon Systemtechnik: Swiss manufacturer of vapor-phase and vacuum soldering equipment used in semiconductor packaging and power-electronics production; competes in adjacent thermal-joining niches with budatec.

Broad incumbents

• centrotherm international AG: Former acquirer of TECA (the predecessor of budatec's founders); produces thermal processing systems for semiconductor and solar industries with broader process coverage than budatec's niche tools.
• ERSA GmbH: Established German soldering-equipment vendor (reflow, selective, rework) serving the same electronics-manufacturing accounts as budatec, with overlapping vacuum-soldering capability via its subsidiary footprint.
• Rehm Thermal Systems: German maker of convection and vacuum/reflow soldering systems for electronics manufacturing, addressing the same automotive and power-electronics customer base with a broader equipment portfolio.
• AMADA WELD TECH: Global manufacturer of resistance welding, laser welding and sintering equipment used in power-electronics and battery assembly; overlaps with budatec's sintering and bonding product lines.
• ASMPT (ASM Pacific Technology): Large global supplier of semiconductor packaging and assembly equipment, including die bonding and sintering tools, representing the broad-incumbent competitive threat to specialty players like budatec in power-module packaging.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/budatec-gmbh

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about budatec